ATE463950T1 - Verfahren zur herstellung einer hochfrequenz- baugruppe - Google Patents

Verfahren zur herstellung einer hochfrequenz- baugruppe

Info

Publication number
ATE463950T1
ATE463950T1 AT04766756T AT04766756T ATE463950T1 AT E463950 T1 ATE463950 T1 AT E463950T1 AT 04766756 T AT04766756 T AT 04766756T AT 04766756 T AT04766756 T AT 04766756T AT E463950 T1 ATE463950 T1 AT E463950T1
Authority
AT
Austria
Prior art keywords
frequency
specimen
producing
frequency assembly
feature
Prior art date
Application number
AT04766756T
Other languages
English (en)
Inventor
Willibald Konrath
Haiko Schmelcher
Original Assignee
Ericsson Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Ab filed Critical Ericsson Ab
Application granted granted Critical
Publication of ATE463950T1 publication Critical patent/ATE463950T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
  • Ceramic Products (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Automatic Assembly (AREA)
AT04766756T 2003-09-25 2004-09-09 Verfahren zur herstellung einer hochfrequenz- baugruppe ATE463950T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10344409A DE10344409A1 (de) 2003-09-25 2003-09-25 Verfahren zum Fertigen einer Hochfrequenzbaugruppe
PCT/EP2004/052116 WO2005032221A2 (en) 2003-09-25 2004-09-09 Method for manufacturing a high-frequency assembly

Publications (1)

Publication Number Publication Date
ATE463950T1 true ATE463950T1 (de) 2010-04-15

Family

ID=34384272

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04766756T ATE463950T1 (de) 2003-09-25 2004-09-09 Verfahren zur herstellung einer hochfrequenz- baugruppe

Country Status (7)

Country Link
US (1) US8014890B2 (de)
EP (1) EP1665918B1 (de)
JP (1) JP2007507097A (de)
CN (1) CN1887039B (de)
AT (1) ATE463950T1 (de)
DE (2) DE10344409A1 (de)
WO (1) WO2005032221A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10344409A1 (de) * 2003-09-25 2005-04-28 Marconi Comm Gmbh Verfahren zum Fertigen einer Hochfrequenzbaugruppe
JP4819602B2 (ja) * 2006-07-05 2011-11-24 パナソニック株式会社 Ａｃｆ貼付装置及びａｃｆ貼付方法
JP6402882B2 (ja) * 2013-09-19 2018-10-10 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法
CN107926156B (zh) * 2015-09-03 2020-09-18 株式会社富士 元件安装机

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5887896A (ja) * 1981-11-20 1983-05-25 アルプス電気株式会社 高周波回路機器の組立構造
DK291184D0 (da) * 1984-06-13 1984-06-13 Boeegh Petersen Allan Fremgangsmaade og indretning til test af kredsloebsplader
JPS6222498A (ja) * 1985-07-23 1987-01-30 三菱電機株式会社 電子部品装着装置
JPH0693208B2 (ja) 1987-02-04 1994-11-16 フアナツク株式会社 サーボ遅れ補正方法
US4947335A (en) * 1988-09-12 1990-08-07 At&T Bell Laboratories Identification of workpiece information
US5086397A (en) * 1989-07-18 1992-02-04 Schuster Pamela K Method and apparatus for data collection of testing and inspection of products made on a production assembly line
US5137362A (en) * 1990-03-26 1992-08-11 Motorola, Inc. Automatic package inspection method
JP2844857B2 (ja) * 1990-06-21 1999-01-13 ソニー株式会社 混成集積回路の製造装置
DE4111111C2 (de) * 1991-04-05 1997-04-30 Siemens Ag Verfahren zur Grobdrehlagenerkennung von elektronischen Bauelementen durch Bildauswertung der Indexmarke
US5237622A (en) * 1991-12-04 1993-08-17 Micron Technology, Inc. Semiconductor pick-and-place machine automatic calibration apparatus
JP3442109B2 (ja) * 1993-08-31 2003-09-02 松下電器産業株式会社 電子部品の装着ミス補正方法および部品実装装置
US5680936A (en) * 1995-03-14 1997-10-28 Automated Technologies Industries, Inc. Printed circuit board sorting device
DE19515684C2 (de) * 1995-04-28 2003-11-06 Michael Geringer Verfahren zur Vereinzelung von elektrischen Bauelementen
US5740066A (en) * 1995-07-03 1998-04-14 Motorola, Inc. Electrical circuit board and circuit board assembly
US6938335B2 (en) * 1996-12-13 2005-09-06 Matsushita Electric Industrial Co., Ltd. Electronic component mounting method
US6020751A (en) * 1997-01-02 2000-02-01 Intel Corporation Method and apparatus for stress testing of a circuit board assembly
ATE371915T1 (de) * 1997-10-09 2007-09-15 Vectron Inc Elektronisches video-aufbau-inspektions-system
US6801652B1 (en) * 1998-09-29 2004-10-05 Siemens Aktiengesellschaft Method for checking the presentation of components to an automatic onserting unit
US6816037B2 (en) * 1998-11-27 2004-11-09 Mark Allan Hoffman Helical filters and methods for specifying assembly thereof
US6084487A (en) * 1998-11-27 2000-07-04 Hoffman; Mark Allan Helical filter with a removable tap housing
US6539531B2 (en) * 1999-02-25 2003-03-25 Formfactor, Inc. Method of designing, fabricating, testing and interconnecting an IC to external circuit nodes
JP2000294985A (ja) * 1999-04-09 2000-10-20 Nec Corp 複数の部品を組み合わせて製造する方法
US6870438B1 (en) * 1999-11-10 2005-03-22 Kyocera Corporation Multi-layered wiring board for slot coupling a transmission line to a waveguide
US6798076B2 (en) * 1999-12-21 2004-09-28 Intel Corporation Method and apparatus for encoding information in an IC package
AU2001272081A1 (en) 2000-02-28 2001-09-03 Ericsson Inc. Integrated circuit package with device specific data storage
JP3531586B2 (ja) * 2000-06-12 2004-05-31 松下電器産業株式会社 表示パネルの組立装置および組立方法
EP1357781A4 (de) * 2001-01-10 2008-02-13 Matsushita Electric Industrial Co Ltd "komponentenanbindungsvorrichtung, dienstliefervorrichtung und dienstlieferverfahren"
JP2003035738A (ja) * 2001-07-19 2003-02-07 Omron Corp 部品実装基板の検査方法および部品実装基板用の検査装置
JP4251855B2 (ja) * 2002-11-19 2009-04-08 株式会社ヨコオ 高周波・高速用デバイスの検査治具の製法
DE10344409A1 (de) * 2003-09-25 2005-04-28 Marconi Comm Gmbh Verfahren zum Fertigen einer Hochfrequenzbaugruppe

Also Published As

Publication number Publication date
JP2007507097A (ja) 2007-03-22
CN1887039B (zh) 2010-09-01
DE10344409A1 (de) 2005-04-28
US20070208449A1 (en) 2007-09-06
WO2005032221A3 (en) 2005-08-18
WO2005032221A2 (en) 2005-04-07
US8014890B2 (en) 2011-09-06
DE602004026453D1 (de) 2010-05-20
EP1665918A2 (de) 2006-06-07
EP1665918B1 (de) 2010-04-07
CN1887039A (zh) 2006-12-27

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Legal Events

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