ATE464976T1 - Polierkissen mit ausgespartem fenster - Google Patents

Polierkissen mit ausgespartem fenster

Info

Publication number
ATE464976T1
ATE464976T1 AT04784079T AT04784079T ATE464976T1 AT E464976 T1 ATE464976 T1 AT E464976T1 AT 04784079 T AT04784079 T AT 04784079T AT 04784079 T AT04784079 T AT 04784079T AT E464976 T1 ATE464976 T1 AT E464976T1
Authority
AT
Austria
Prior art keywords
layer
polishing
aperture
width
length
Prior art date
Application number
AT04784079T
Other languages
English (en)
Inventor
Kyle Turner
Jeffrey Beeler
Kelly Newell
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of ATE464976T1 publication Critical patent/ATE464976T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
AT04784079T 2003-09-19 2004-09-14 Polierkissen mit ausgespartem fenster ATE464976T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/666,797 US7195539B2 (en) 2003-09-19 2003-09-19 Polishing pad with recessed window
PCT/US2004/030105 WO2005032765A1 (en) 2003-09-19 2004-09-14 Polishing pad with recessed window

Publications (1)

Publication Number Publication Date
ATE464976T1 true ATE464976T1 (de) 2010-05-15

Family

ID=34313201

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04784079T ATE464976T1 (de) 2003-09-19 2004-09-14 Polierkissen mit ausgespartem fenster

Country Status (9)

Country Link
US (1) US7195539B2 (de)
EP (1) EP1667816B1 (de)
JP (1) JP4991294B2 (de)
KR (1) KR100936594B1 (de)
CN (1) CN1852788A (de)
AT (1) ATE464976T1 (de)
DE (1) DE602004026748D1 (de)
TW (1) TWI276504B (de)
WO (1) WO2005032765A1 (de)

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US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
US7258602B2 (en) * 2003-10-22 2007-08-21 Iv Technologies Co., Ltd. Polishing pad having grooved window therein and method of forming the same
US6984163B2 (en) * 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
USD559063S1 (en) * 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
US7182670B2 (en) * 2004-09-22 2007-02-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having a streamlined windowpane
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089095A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
JP2007118106A (ja) * 2005-10-26 2007-05-17 Toyo Tire & Rubber Co Ltd 研磨パッド及びその製造方法
JP4859109B2 (ja) * 2006-03-27 2012-01-25 東洋ゴム工業株式会社 研磨パッドの製造方法
JP5110677B2 (ja) * 2006-05-17 2012-12-26 東洋ゴム工業株式会社 研磨パッド
JP2007307639A (ja) * 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
US8562389B2 (en) * 2007-06-08 2013-10-22 Applied Materials, Inc. Thin polishing pad with window and molding process
TWI411495B (zh) * 2007-08-16 2013-10-11 Cabot Microelectronics Corp 拋光墊
WO2009070352A1 (en) * 2007-11-30 2009-06-04 Innopad, Inc. Chemical-mechanical planarization pad having end point detection window
US8157614B2 (en) * 2009-04-30 2012-04-17 Applied Materials, Inc. Method of making and apparatus having windowless polishing pad and protected fiber
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
JP5501785B2 (ja) * 2010-02-05 2014-05-28 株式会社ディスコ サファイア基板の加工方法
JP5443192B2 (ja) * 2010-02-10 2014-03-19 株式会社ディスコ サファイア基板の加工方法
JP5426469B2 (ja) * 2010-05-10 2014-02-26 東洋ゴム工業株式会社 研磨パッドおよびガラス基板の製造方法
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8758659B2 (en) 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
US8628384B2 (en) * 2010-09-30 2014-01-14 Nexplanar Corporation Polishing pad for eddy current end-point detection
KR101495141B1 (ko) * 2010-09-30 2015-02-24 넥스플래너 코퍼레이션 와전류 종료­시점 검출을 위한 연마 패드
US8657653B2 (en) 2010-09-30 2014-02-25 Nexplanar Corporation Homogeneous polishing pad for eddy current end-point detection
JP5918254B2 (ja) * 2010-11-18 2016-05-18 キャボット マイクロエレクトロニクス コーポレイション 透過性領域を含む研磨パッド
US8920219B2 (en) * 2011-07-15 2014-12-30 Nexplanar Corporation Polishing pad with alignment aperture
US9156125B2 (en) 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
US9597769B2 (en) 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US20140256231A1 (en) * 2013-03-07 2014-09-11 Dow Global Technologies Llc Multilayer Chemical Mechanical Polishing Pad With Broad Spectrum, Endpoint Detection Window
JP6255991B2 (ja) * 2013-12-26 2018-01-10 株式会社Sumco ワークの両面研磨装置
US9216489B2 (en) 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9064806B1 (en) 2014-03-28 2015-06-23 Rohm and Haas Electronics Materials CMP Holdings, Inc. Soft and conditionable chemical mechanical polishing pad with window
US9259820B2 (en) 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
US9314897B2 (en) 2014-04-29 2016-04-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9333620B2 (en) 2014-04-29 2016-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with clear endpoint detection window
KR101555822B1 (ko) * 2014-09-05 2015-09-25 임흥빈 절개형 핸드 그라인더 휠
US9475168B2 (en) * 2015-03-26 2016-10-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad window
CN104889874B (zh) * 2015-06-25 2017-08-04 蓝思科技（长沙）有限公司 一种蓝宝石抛光用吸附垫及其制备方法
US10213894B2 (en) * 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
US10569383B2 (en) * 2017-09-15 2020-02-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Flanged optical endpoint detection windows and CMP polishing pads containing them
CN109202693B (zh) * 2017-10-16 2021-10-12 Skc索密思株式会社 防泄漏抛光垫及其制造方法
US11002034B2 (en) 2019-05-31 2021-05-11 Fred Joseph Horrell, III Utility pole crossarm conversion apparatuses
JP7575328B2 (ja) * 2021-03-29 2024-10-29 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP7540929B2 (ja) * 2020-09-30 2024-08-27 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP7540931B2 (ja) * 2020-09-30 2024-08-27 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP7540930B2 (ja) * 2020-09-30 2024-08-27 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
TW202225286A (zh) * 2020-09-30 2022-07-01 日商富士紡控股股份有限公司 研磨墊及研磨墊之製造方法
WO2022159810A1 (en) * 2021-01-25 2022-07-28 Cmc Materials, Inc. Endpoint window with controlled texture surface
JP7672853B2 (ja) * 2021-03-29 2025-05-08 富士紡ホールディングス株式会社 研磨パッド
CN113246015B (zh) * 2021-05-25 2022-09-20 万华化学集团电子材料有限公司 具有终点检测窗的抛光垫及其应用
US20230009737A1 (en) * 2021-07-06 2023-01-12 Applied Materials, Inc. Acoustic window in pad backing layer for chemical mechanical polishing
CN114918823B (zh) * 2022-05-20 2023-08-25 安徽禾臣新材料有限公司 一种大尺寸衬底抛光用白垫及其生产工艺
CN115946035A (zh) * 2022-07-07 2023-04-11 宁波赢伟泰科新材料有限公司 一种终点检测窗口和带窗口的化学机械抛光垫及制备方法
CN115415931B (zh) * 2022-07-26 2024-03-15 安徽禾臣新材料有限公司 一种半导体加工用化学机械抛光垫
US20240253176A1 (en) * 2023-01-31 2024-08-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with endpoint window
KR102785924B1 (ko) * 2023-08-29 2025-03-21 오인영 골곡, 요철, 또는 엣지 부분을 포함하는 자동차의 피부 광택 작업에 적합한 자동차 광택용 폴리싱 패드 및 조립체
CN118322101B (zh) * 2024-06-14 2024-08-06 北京特思迪半导体设备有限公司 晶圆终点在线检测抛光设备及晶圆厚度在线检测方法

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Also Published As

Publication number Publication date
JP4991294B2 (ja) 2012-08-01
EP1667816B1 (de) 2010-04-21
KR20060079231A (ko) 2006-07-05
CN1852788A (zh) 2006-10-25
WO2005032765A1 (en) 2005-04-14
US7195539B2 (en) 2007-03-27
KR100936594B1 (ko) 2010-01-13
EP1667816A1 (de) 2006-06-14
US20050060943A1 (en) 2005-03-24
DE602004026748D1 (de) 2010-06-02
JP2007506280A (ja) 2007-03-15
TWI276504B (en) 2007-03-21
TW200526357A (en) 2005-08-16

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