ATE467858T1 - Methode zur reduzierung des optischen naheffekts in lithographischen verfahren - Google Patents

Methode zur reduzierung des optischen naheffekts in lithographischen verfahren

Info

Publication number
ATE467858T1
ATE467858T1 AT99950074T AT99950074T ATE467858T1 AT E467858 T1 ATE467858 T1 AT E467858T1 AT 99950074 T AT99950074 T AT 99950074T AT 99950074 T AT99950074 T AT 99950074T AT E467858 T1 ATE467858 T1 AT E467858T1
Authority
AT
Austria
Prior art keywords
feature
main feature
transferred
reducing
lithographic processes
Prior art date
Application number
AT99950074T
Other languages
English (en)
Inventor
Christophe Pierrat
James Burdorf
William Baggenstoss
William Stanton
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Application granted granted Critical
Publication of ATE467858T1 publication Critical patent/ATE467858T1/de

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
    • G03F7/70441Optical proximity correction [OPC]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
AT99950074T 1998-10-01 1999-09-30 Methode zur reduzierung des optischen naheffekts in lithographischen verfahren ATE467858T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/164,786 US6120952A (en) 1998-10-01 1998-10-01 Methods of reducing proximity effects in lithographic processes
PCT/US1999/022815 WO2000019272A1 (en) 1998-10-01 1999-09-30 Methods of reducing proximity effects in lithographic processes

Publications (1)

Publication Number Publication Date
ATE467858T1 true ATE467858T1 (de) 2010-05-15

Family

ID=22596084

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99950074T ATE467858T1 (de) 1998-10-01 1999-09-30 Methode zur reduzierung des optischen naheffekts in lithographischen verfahren

Country Status (8)

Country Link
US (3) US6120952A (de)
EP (1) EP1125167B1 (de)
JP (1) JP3461336B2 (de)
KR (1) KR20010075482A (de)
AT (1) ATE467858T1 (de)
AU (1) AU6280799A (de)
DE (1) DE69942370D1 (de)
WO (1) WO2000019272A1 (de)

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DE10356693A1 (de) * 2003-11-27 2005-07-14 Infineon Technologies Ag Verfahren zum Erzeugen eines Abbildungsfehler vermeidenden Maskenlayouts für eine Maske
US7536660B2 (en) * 2004-02-24 2009-05-19 Konstantinos Adam OPC simulation model using SOCS decomposition of edge fragments
US7539954B2 (en) * 2004-02-24 2009-05-26 Konstantinos Adam OPC simulation model using SOCS decomposition of edge fragments
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US7861207B2 (en) 2004-02-25 2010-12-28 Mentor Graphics Corporation Fragmentation point and simulation site adjustment for resolution enhancement techniques
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US7700441B2 (en) 2006-02-02 2010-04-20 Micron Technology, Inc. Methods of forming field effect transistors, methods of forming field effect transistor gates, methods of forming integrated circuitry comprising a transistor gate array and circuitry peripheral to the gate array, and methods of forming integrated circuitry comprising a transistor gate array including first gates and second grounded isolation gates
US7712068B2 (en) * 2006-02-17 2010-05-04 Zhuoxiang Ren Computation of electrical properties of an IC layout
US7506285B2 (en) 2006-02-17 2009-03-17 Mohamed Al-Imam Multi-dimensional analysis for predicting RET model accuracy
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JP7569930B2 (ja) * 2020-09-18 2024-10-18 アプライド マテリアルズ インコーポレイテッド 補助的なフィーチャを用いてデジタルリソグラフィのプロセスウィンドウ及び解像度を改善する方法
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Also Published As

Publication number Publication date
US20010002304A1 (en) 2001-05-31
AU6280799A (en) 2000-04-17
JP3461336B2 (ja) 2003-10-27
DE69942370D1 (de) 2010-06-24
EP1125167A1 (de) 2001-08-22
US20010023045A1 (en) 2001-09-20
US6120952A (en) 2000-09-19
EP1125167B1 (de) 2010-05-12
US6284419B2 (en) 2001-09-04
KR20010075482A (ko) 2001-08-09
WO2000019272A1 (en) 2000-04-06
US6319644B2 (en) 2001-11-20
WO2000019272B1 (en) 2000-05-25
JP2002526792A (ja) 2002-08-20

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