ATE469356T1 - Stromsensor - Google Patents
StromsensorInfo
- Publication number
- ATE469356T1 ATE469356T1 AT04816162T AT04816162T ATE469356T1 AT E469356 T1 ATE469356 T1 AT E469356T1 AT 04816162 T AT04816162 T AT 04816162T AT 04816162 T AT04816162 T AT 04816162T AT E469356 T1 ATE469356 T1 AT E469356T1
- Authority
- AT
- Austria
- Prior art keywords
- conductor portion
- substrate
- current sensor
- current conductor
- current
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
- G01R15/207—Constructional details independent of the type of device used
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
- G01R15/202—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices using Hall-effect devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/853—On the same surface
- H10W72/865—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
- Hall/Mr Elements (AREA)
- Measuring Magnetic Variables (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/649,450 US7709754B2 (en) | 2003-08-26 | 2003-08-26 | Current sensor |
| PCT/US2004/009908 WO2005026749A1 (en) | 2003-08-26 | 2004-03-29 | Current sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE469356T1 true ATE469356T1 (de) | 2010-06-15 |
Family
ID=34216957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04816162T ATE469356T1 (de) | 2003-08-26 | 2004-03-29 | Stromsensor |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7709754B2 (de) |
| EP (1) | EP1658508B1 (de) |
| JP (4) | JP4757195B2 (de) |
| KR (1) | KR101008311B1 (de) |
| CN (1) | CN1842711A (de) |
| AT (1) | ATE469356T1 (de) |
| DE (1) | DE602004027389D1 (de) |
| WO (1) | WO2005026749A1 (de) |
Families Citing this family (113)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7259545B2 (en) * | 2003-02-11 | 2007-08-21 | Allegro Microsystems, Inc. | Integrated sensor |
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| US7709754B2 (en) | 2003-08-26 | 2010-05-04 | Allegro Microsystems, Inc. | Current sensor |
| US7166807B2 (en) | 2003-08-26 | 2007-01-23 | Allegro Microsystems, Inc. | Current sensor |
| US7075287B1 (en) | 2003-08-26 | 2006-07-11 | Allegro Microsystems, Inc. | Current sensor |
| US6995315B2 (en) * | 2003-08-26 | 2006-02-07 | Allegro Microsystems, Inc. | Current sensor |
| US7476816B2 (en) * | 2003-08-26 | 2009-01-13 | Allegro Microsystems, Inc. | Current sensor |
| AU2006246275B2 (en) * | 2005-05-12 | 2010-12-23 | Corporation Nuvolt Inc. | Current sensor |
| US7358724B2 (en) * | 2005-05-16 | 2008-04-15 | Allegro Microsystems, Inc. | Integrated magnetic flux concentrator |
| US7483248B1 (en) * | 2005-05-19 | 2009-01-27 | Sun Microsystems, Inc. | Method and apparatus for detecting current changes in integrated circuits |
| JP4904427B2 (ja) * | 2005-05-27 | 2012-03-28 | アレグロ・マイクロシステムズ・インコーポレーテッド | 電流センサ |
| JP2007003237A (ja) * | 2005-06-21 | 2007-01-11 | Denso Corp | 電流センサ |
| EP1772737A3 (de) * | 2005-10-08 | 2008-02-20 | Melexis Technologies SA | Baugruppe zur Strommessung |
| JP4224483B2 (ja) * | 2005-10-14 | 2009-02-12 | Ｔｄｋ株式会社 | 電流センサ |
| US7768083B2 (en) * | 2006-01-20 | 2010-08-03 | Allegro Microsystems, Inc. | Arrangements for an integrated sensor |
| US20070279053A1 (en) * | 2006-05-12 | 2007-12-06 | Taylor William P | Integrated current sensor |
| US7816905B2 (en) * | 2008-06-02 | 2010-10-19 | Allegro Microsystems, Inc. | Arrangements for a current sensing circuit and integrated current sensor |
| US7936164B2 (en) * | 2008-07-03 | 2011-05-03 | Allegro Microsystems, Inc. | Folding current sensor |
| US8093670B2 (en) * | 2008-07-24 | 2012-01-10 | Allegro Microsystems, Inc. | Methods and apparatus for integrated circuit having on chip capacitor with eddy current reductions |
| US8063634B2 (en) * | 2008-07-31 | 2011-11-22 | Allegro Microsystems, Inc. | Electronic circuit and method for resetting a magnetoresistance element |
| US9222992B2 (en) * | 2008-12-18 | 2015-12-29 | Infineon Technologies Ag | Magnetic field current sensors |
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| US8089075B2 (en) * | 2009-04-17 | 2012-01-03 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | LFCC package with a reflector cup surrounded by a single encapsulant |
| JP5680287B2 (ja) * | 2009-05-27 | 2015-03-04 | 新科實業有限公司ＳＡＥ Ｍａｇｎｅｔｉｃｓ（Ｈ．Ｋ．）Ｌｔｄ． | 電流センサ |
| US20110006763A1 (en) * | 2009-07-07 | 2011-01-13 | Anthonius Bakker | Hall effect current sensor system and associated flip-chip packaging |
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| US8283742B2 (en) | 2010-08-31 | 2012-10-09 | Infineon Technologies, A.G. | Thin-wafer current sensors |
| USD644191S1 (en) * | 2010-09-29 | 2011-08-30 | Kabushiki Kaisha Toshiba | Portion of a light-emitting diode |
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| US8629539B2 (en) | 2012-01-16 | 2014-01-14 | Allegro Microsystems, Llc | Methods and apparatus for magnetic sensor having non-conductive die paddle |
| US9666788B2 (en) | 2012-03-20 | 2017-05-30 | Allegro Microsystems, Llc | Integrated circuit package having a split lead frame |
| US10234513B2 (en) | 2012-03-20 | 2019-03-19 | Allegro Microsystems, Llc | Magnetic field sensor integrated circuit with integral ferromagnetic material |
| US9494660B2 (en) | 2012-03-20 | 2016-11-15 | Allegro Microsystems, Llc | Integrated circuit package having a split lead frame |
| US9812588B2 (en) | 2012-03-20 | 2017-11-07 | Allegro Microsystems, Llc | Magnetic field sensor integrated circuit with integral ferromagnetic material |
| CN103323643B (zh) * | 2012-03-20 | 2016-06-29 | 美新半导体（无锡）有限公司 | 单芯片电流传感器及其制造方法 |
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| US9190606B2 (en) | 2013-03-15 | 2015-11-17 | Allegro Micosystems, LLC | Packaging for an electronic device |
| US10345343B2 (en) | 2013-03-15 | 2019-07-09 | Allegro Microsystems, Llc | Current sensor isolation |
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| CN109564248B (zh) * | 2016-07-22 | 2021-11-23 | 旭化成微电子株式会社 | 电流传感器 |
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| US10247758B2 (en) | 2016-08-08 | 2019-04-02 | Allegro Microsystems, Llc | Current sensor |
| EP3293888B1 (de) | 2016-09-13 | 2020-08-26 | Allegro MicroSystems, LLC | Signalisolator mit bidirektionaler kommunikation zwischen chips |
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| US10557873B2 (en) | 2017-07-19 | 2020-02-11 | Allegro Microsystems, Llc | Systems and methods for closed loop current sensing |
| EP3508863B1 (de) * | 2018-01-05 | 2023-06-07 | Melexis Technologies SA | Offsetstromsensorstruktur |
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| US10935612B2 (en) | 2018-08-20 | 2021-03-02 | Allegro Microsystems, Llc | Current sensor having multiple sensitivity ranges |
| FR3090121B1 (fr) * | 2018-12-12 | 2022-01-28 | Melexis Tech | Capteur de courant à conducteur de courant intégré |
| US10892405B2 (en) * | 2019-05-07 | 2021-01-12 | Texas Instruments Incorporated | Hall-effect sensor package with added current path |
| US10991644B2 (en) | 2019-08-22 | 2021-04-27 | Allegro Microsystems, Llc | Integrated circuit package having a low profile |
| US11115244B2 (en) | 2019-09-17 | 2021-09-07 | Allegro Microsystems, Llc | Signal isolator with three state data transmission |
| US11289406B2 (en) | 2019-09-18 | 2022-03-29 | Allegro Microsystems, Llc | Signal isolator having enhanced creepage characteristics |
| US11183436B2 (en) | 2020-01-17 | 2021-11-23 | Allegro Microsystems, Llc | Power module package and packaging techniques |
| US11150273B2 (en) | 2020-01-17 | 2021-10-19 | Allegro Microsystems, Llc | Current sensor integrated circuits |
| US11169223B2 (en) | 2020-03-23 | 2021-11-09 | Allegro Microsystems, Llc | Hall element signal calibrating in angle sensor |
| US11800813B2 (en) | 2020-05-29 | 2023-10-24 | Allegro Microsystems, Llc | High isolation current sensor |
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| US11630130B2 (en) | 2021-03-31 | 2023-04-18 | Allegro Microsystems, Llc | Channel sensitivity matching |
| DE102021115598B4 (de) | 2021-06-16 | 2023-02-09 | Infineon Technologies Ag | Stromsensor |
| US11768229B2 (en) | 2021-08-23 | 2023-09-26 | Allegro Microsystems, Llc | Packaged current sensor integrated circuit |
| US12163983B2 (en) | 2021-08-23 | 2024-12-10 | Allegro Microsystems, Llc | Packaged current sensor integrated circuit |
| JP7614992B2 (ja) * | 2021-09-16 | 2025-01-16 | 株式会社東芝 | 電流検出装置 |
| US11644485B2 (en) | 2021-10-07 | 2023-05-09 | Allegro Microsystems, Llc | Current sensor integrated circuits |
| CN119936463A (zh) * | 2021-12-31 | 2025-05-06 | 浙江森尼克半导体有限公司 | 电流传感器及其集成电路装置 |
| US11892476B2 (en) | 2022-02-15 | 2024-02-06 | Allegro Microsystems, Llc | Current sensor package |
| US12112865B2 (en) | 2022-03-15 | 2024-10-08 | Allegro Microsystems, Llc | Multiple branch bus bar for coreless current sensing application |
| US11768230B1 (en) | 2022-03-30 | 2023-09-26 | Allegro Microsystems, Llc | Current sensor integrated circuit with a dual gauge lead frame |
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-
2003
- 2003-08-26 US US10/649,450 patent/US7709754B2/en not_active Expired - Lifetime
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2004
- 2004-03-29 WO PCT/US2004/009908 patent/WO2005026749A1/en not_active Ceased
- 2004-03-29 DE DE602004027389T patent/DE602004027389D1/de not_active Expired - Lifetime
- 2004-03-29 JP JP2006524610A patent/JP4757195B2/ja not_active Expired - Lifetime
- 2004-03-29 CN CNA2004800242965A patent/CN1842711A/zh active Pending
- 2004-03-29 KR KR1020067002842A patent/KR101008311B1/ko not_active Expired - Lifetime
- 2004-03-29 AT AT04816162T patent/ATE469356T1/de active
- 2004-03-29 EP EP04816162A patent/EP1658508B1/de not_active Expired - Lifetime
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2009
- 2009-06-26 JP JP2009151851A patent/JP2009210589A/ja active Pending
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- 2012-12-13 JP JP2012271928A patent/JP2013079973A/ja not_active Withdrawn
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2009210589A (ja) | 2009-09-17 |
| JP2013079973A (ja) | 2013-05-02 |
| EP1658508B1 (de) | 2010-05-26 |
| JP5981633B2 (ja) | 2016-08-31 |
| JP4757195B2 (ja) | 2011-08-24 |
| KR101008311B1 (ko) | 2011-01-14 |
| CN1842711A (zh) | 2006-10-04 |
| US7709754B2 (en) | 2010-05-04 |
| JP2016065882A (ja) | 2016-04-28 |
| DE602004027389D1 (de) | 2010-07-08 |
| WO2005026749A1 (en) | 2005-03-24 |
| EP1658508A1 (de) | 2006-05-24 |
| US20050045359A1 (en) | 2005-03-03 |
| KR20060061825A (ko) | 2006-06-08 |
| JP2007503584A (ja) | 2007-02-22 |
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