ATE469955T1 - Verfahren zur herstellung von schleifpartikeln aus diamand - Google Patents

Verfahren zur herstellung von schleifpartikeln aus diamand

Info

Publication number
ATE469955T1
ATE469955T1 AT99940562T AT99940562T ATE469955T1 AT E469955 T1 ATE469955 T1 AT E469955T1 AT 99940562 T AT99940562 T AT 99940562T AT 99940562 T AT99940562 T AT 99940562T AT E469955 T1 ATE469955 T1 AT E469955T1
Authority
AT
Austria
Prior art keywords
diamond
diamond particles
particles
abrasive
producing
Prior art date
Application number
AT99940562T
Other languages
English (en)
Inventor
Hiroshi Ishizuka
Original Assignee
Hiroshi Ishizuka
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hiroshi Ishizuka filed Critical Hiroshi Ishizuka
Application granted granted Critical
Publication of ATE469955T1 publication Critical patent/ATE469955T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Composite Materials (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Glanulating (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Disintegrating Or Milling (AREA)
AT99940562T 1998-08-28 1999-08-30 Verfahren zur herstellung von schleifpartikeln aus diamand ATE469955T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP28188098 1998-08-28
JP17029099A JP3411239B2 (ja) 1998-08-28 1999-06-16 ダイヤモンド研磨材粒子及びその製法
PCT/JP1999/004684 WO2000012647A1 (en) 1998-08-28 1999-08-30 Diamond abrasive particles and method for preparing the same

Publications (1)

Publication Number Publication Date
ATE469955T1 true ATE469955T1 (de) 2010-06-15

Family

ID=26493327

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99940562T ATE469955T1 (de) 1998-08-28 1999-08-30 Verfahren zur herstellung von schleifpartikeln aus diamand

Country Status (10)

Country Link
US (1) US6565618B1 (de)
EP (1) EP1114855B1 (de)
JP (1) JP3411239B2 (de)
KR (1) KR100632026B1 (de)
AT (1) ATE469955T1 (de)
BR (2) BRPI9913215B1 (de)
CA (1) CA2340906C (de)
DE (1) DE69942455D1 (de)
MX (1) MXPA01002146A (de)
WO (1) WO2000012647A1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4925233B2 (ja) * 2001-05-11 2012-04-25 トーメイダイヤ株式会社 ダイヤモンド粒子研磨材
AU2001272778A1 (en) * 2000-07-21 2002-02-05 The Ishizuka Research Inctitute, Ltd. Single crystal fine diamond powder having narrow particle size distribution and method for production thereof
JP2002060733A (ja) * 2000-08-17 2002-02-26 Ishizuka Kenkyusho:Kk ダイヤモンド研磨材粒子及びその製法
JP2002370158A (ja) * 2001-06-15 2002-12-24 Nihon Micro Coating Co Ltd ガラス基板の表面をテクスチャ加工するために用いられる研磨スラリー及び方法
JP3913096B2 (ja) * 2001-06-28 2007-05-09 三菱重工業株式会社 有害物質処理システム
US7235296B2 (en) 2002-03-05 2007-06-26 3M Innovative Properties Co. Formulations for coated diamond abrasive slurries
KR100477895B1 (ko) * 2002-04-08 2005-03-18 한국화학연구원 나노분말이 습식 코팅된 지립을 이용한 내구성이 증진된다이아몬드 공구의 제조방법
JP3940693B2 (ja) * 2003-02-24 2007-07-04 日本ミクロコーティング株式会社 磁気ハードディスク基板及びその製造方法
JP4237013B2 (ja) * 2003-08-01 2009-03-11 株式会社石塚研究所 表面改質微細ダイヤモンド研磨材の製造法
US7153191B2 (en) * 2004-08-20 2006-12-26 Micron Technology, Inc. Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
JP4936424B2 (ja) * 2005-10-31 2012-05-23 日本ミクロコーティング株式会社 研磨材及びその製造方法
JP2007149203A (ja) * 2005-11-28 2007-06-14 Nihon Micro Coating Co Ltd テクスチャ加工方法及び加工スラリー
JP4838703B2 (ja) 2006-12-26 2011-12-14 富士電機株式会社 磁気記録媒体用ディスク基板の製造方法、磁気記録媒体用ディスク基板、磁気記録媒体の製造方法、磁気記録媒体、及び磁気記録装置
US8652226B2 (en) * 2008-09-16 2014-02-18 Diamond Innovations, Inc. Abrasive particles having a unique morphology
CA2768826C (en) 2009-07-31 2017-08-29 Diamond Innovations, Inc. Precision wire including surface modified abrasive particles
JP5828453B2 (ja) * 2010-11-15 2015-12-09 学校法人東京理科大学 充填剤の製造方法
US8734753B2 (en) 2010-12-30 2014-05-27 Engis Corporation Surface etched diamond particles and method for etching the surface of diamond particles
KR101182187B1 (ko) * 2011-12-15 2012-09-12 한국과학기술연구원 화학적 기계적 연마 패드 컨디셔너 및 그 제조방법
DE102012215191B4 (de) * 2012-03-14 2026-03-19 Friedrich-Alexander-Universität Erlangen-Nürnberg Werkzeug für Ultraschallschweißvorrichtung
US9643847B2 (en) * 2013-03-15 2017-05-09 Honda Motor Co., Ltd. Method for growth of vertically aligned carbon nanotubes on diamond substrates
JP6261000B2 (ja) * 2013-12-24 2018-01-17 トーメイダイヤ株式会社 制御された導電性／電気抵抗を有するダイヤモンド及びその製法
JP6611414B2 (ja) * 2014-05-27 2019-11-27 スリーエム イノベイティブ プロパティズ カンパニー 塗装表面の仕上げ方法及び研磨材料
CN105086939B (zh) * 2015-08-21 2017-05-10 北京保利世达科技有限公司 一种单晶金刚石磨粒及其制备方法
JP6802077B2 (ja) * 2017-01-26 2020-12-16 株式会社ダイセル ナノダイヤモンドの製造方法
RU2704427C1 (ru) * 2018-10-30 2019-10-28 Федеральное государственное бюджетное учреждение науки Институт экспериментальной минералогии имени академика Д.С. Коржинского Российской академии наук (ИЭМ РАН) Способ получения алмаза
JP7650073B2 (ja) 2019-10-04 2025-03-24 トーメイダイヤ株式会社 易破砕性ダイヤモンド砥粒の製造方法
CN111168591B (zh) * 2020-01-17 2021-09-03 深圳大学 金刚石磨具及其制备方法
CN114276783A (zh) * 2021-12-03 2022-04-05 厦门雷昂科技有限公司 一种改性金刚石超硬磨粒及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ZA741183B (en) * 1974-02-22 1975-10-29 De Beers Ind Diamond Abrasive particles
DE2533743C3 (de) * 1975-07-28 1979-07-12 Institut Fizitscheskoj Chimii Akademii Nauk Ssr, Moskau Verfahren zur Herstellung eines polykristallinen Diamantelements
JPS5215493A (en) * 1975-07-28 1977-02-05 Inst Subuerukuhitobuerudeikuhi Method of manufacturing multiicrystal diamond members
JPS5938653B2 (ja) * 1980-05-30 1984-09-18 日本ビクター株式会社 電極付き針の製作法
ZA826297B (en) * 1981-10-30 1983-11-30 Gen Electric Sintering diamond
JPS63237820A (ja) * 1987-03-26 1988-10-04 Osaka Daiyamondo Kogyo Kk ダイヤモンド工具
JPH05166176A (ja) * 1991-12-12 1993-07-02 Sumitomo Metal Mining Co Ltd 磁気ディスクの製造方法
RU2094370C1 (ru) * 1993-10-19 1997-10-27 Институт гидродинамики им.М.А.Лаврентьева СО РАН Способ получения частиц углерода луковичной структуры
CA2163953C (en) * 1994-11-30 1999-05-11 Yasuyuki Kanada Diamond sintered body having high strength and high wear-resistance and manufacturing method thereof
JP2691884B2 (ja) * 1995-07-10 1997-12-17 株式会社石塚研究所 親水性ダイヤモンド微細粒子及びその製造方法
JPH10152778A (ja) * 1996-11-26 1998-06-09 Kao Corp 保護膜の形成方法

Also Published As

Publication number Publication date
MXPA01002146A (es) 2003-03-27
EP1114855A1 (de) 2001-07-11
CA2340906C (en) 2010-12-07
KR20010073074A (ko) 2001-07-31
JP2000136376A (ja) 2000-05-16
EP1114855B1 (de) 2010-06-02
DE69942455D1 (de) 2010-07-15
CA2340906A1 (en) 2000-03-09
US6565618B1 (en) 2003-05-20
KR100632026B1 (ko) 2006-10-04
BR9913215B1 (pt) 2018-04-24
EP1114855A4 (de) 2004-10-13
BR9913215A (pt) 2001-05-22
BRPI9913215B1 (pt) 2018-04-24
JP3411239B2 (ja) 2003-05-26
HK1038582A1 (en) 2002-03-22
WO2000012647A1 (en) 2000-03-09

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