ATE473199T1 - Method of manufacturing mechanical components of mems or nems structures in monocrystalline silicon - Google Patents

Method of manufacturing mechanical components of mems or nems structures in monocrystalline silicon

Info

Publication number
ATE473199T1
ATE473199T1 AT08172514T AT08172514T ATE473199T1 AT E473199 T1 ATE473199 T1 AT E473199T1 AT 08172514 T AT08172514 T AT 08172514T AT 08172514 T AT08172514 T AT 08172514T AT E473199 T1 ATE473199 T1 AT E473199T1
Authority
AT
Austria
Prior art keywords
mems
monocrystalline silicon
mechanical components
etching
substrate
Prior art date
Application number
AT08172514T
Other languages
English (en)
Inventor
Philippe Robert
Valerie Nguyen
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE473199T1 publication Critical patent/ATE473199T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/00468—Releasing structures
    • B81C1/00484—Processes for releasing structures not provided for in group B81C1/00476
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
    • B81C1/0065—Mechanical properties
    • B81C1/00682—Treatments for improving mechanical properties, not provided for in B81C1/00658 - B81C1/0065
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/05—Temporary protection of devices or parts of the devices during manufacturing
    • B81C2201/053—Depositing a protective layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Micromachines (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Pressure Sensors (AREA)
  • Drying Of Semiconductors (AREA)
AT08172514T 2007-12-28 2008-12-22 Method of manufacturing mechanical components of mems or nems structures in monocrystalline silicon ATE473199T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0760426A FR2925890B1 (fr) 2007-12-28 2007-12-28 Procede de fabrication de composants mecaniques de structures mems ou nems en silicium monocristallin

Publications (1)

Publication Number Publication Date
ATE473199T1 true ATE473199T1 (de) 2010-07-15

Family

ID=39769267

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08172514T ATE473199T1 (de) 2007-12-28 2008-12-22 Method of manufacturing mechanical components of mems or nems structures in monocrystalline silicon

Country Status (6)

Country Link
US (1) US7932118B2 (de)
EP (1) EP2075222B1 (de)
JP (1) JP2009160728A (de)
AT (1) ATE473199T1 (de)
DE (1) DE602008001711D1 (de)
FR (1) FR2925890B1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008039372A2 (en) * 2006-09-22 2008-04-03 Carnegie Mellon University Assembling and applying nano-electro-mechanical systems
TWI373450B (en) 2009-07-29 2012-10-01 Pixart Imaging Inc Microelectronic device and method for fabricating mems resonator thereof
CN101993033B (zh) * 2009-08-19 2012-05-23 微智半导体股份有限公司 微机电的结构及制造方法
US8603848B2 (en) * 2009-08-25 2013-12-10 Electronics And Telecommunications Research Institute Three-dimensional MEMS structure and method of manufacturing the same
RU2439741C1 (ru) * 2010-11-09 2012-01-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Национальный исследовательский университет МИЭТ" (МИЭТ) Способ изготовления чувствительных элементов микромеханических систем
US8642370B2 (en) * 2011-03-04 2014-02-04 Texas Instruments Incorporated Cavity open process to improve undercut
CN102584331B (zh) * 2012-01-18 2013-10-30 广西大学 纳米颗粒阵列为模版的双组分双层纳米润滑薄膜的制备方法
US10246325B2 (en) * 2014-09-03 2019-04-02 Infineon Technologies Ag MEMS device and method for manufacturing a MEMS device
US9630836B2 (en) * 2015-09-30 2017-04-25 Mems Drive, Inc. Simplified MEMS device fabrication process
EP3088969B1 (de) * 2016-03-17 2018-12-26 Sigatec SA Thermocompensierte spiralfeder und verfahren zu deren herstellung
EP3285124B1 (de) * 2016-08-17 2020-12-16 Tronic's Microsystems S.A Mechanischer resonator für uhrwerk, sowie herstellungsverfahren eines solchen resonators
DE102018214634B3 (de) * 2018-08-29 2019-09-12 Robert Bosch Gmbh Sensoreinrichtung und Verfahren zur Herstellung einer Sensoreinrichtung
US20220415703A1 (en) * 2021-06-24 2022-12-29 Stmicroelectronics S.R.L. Ultra-thin semiconductor die with irregular textured surfaces
CN115966865B (zh) * 2022-12-29 2024-06-14 中国电子科技集团公司第二十六研究所 一种基于三维堆叠产生带外零点的mems滤波器及其制作方法
US20250033951A1 (en) * 2023-07-28 2025-01-30 Lawrence Semiconductor Research Laboratory, Inc. Anchor structure
US20250187901A1 (en) * 2023-12-08 2025-06-12 Lawrence Semiconductor Research Laboratory, Inc. Micro-electro-mechanical systems (mems) having vertical stops and anchor structures

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198390A (en) * 1992-01-16 1993-03-30 Cornell Research Foundation, Inc. RIE process for fabricating submicron, silicon electromechanical structures
US6635506B2 (en) * 2001-11-07 2003-10-21 International Business Machines Corporation Method of fabricating micro-electromechanical switches on CMOS compatible substrates
DE10235371A1 (de) * 2002-08-02 2004-02-12 Robert Bosch Gmbh Verfahren zur Herstellung einer mikromechanischen Vorrichtung, insbesondere einer mikromechanischen Schwingspiegelvorrichtung
FR2857952B1 (fr) * 2003-07-25 2005-12-16 St Microelectronics Sa Resonateur electromecanique et procede de fabrication d'un tel resonateur
EP1521301A1 (de) * 2003-09-30 2005-04-06 Interuniversitaire Microelectronica Centrum vzw ( IMEC) Herstellung von luftgefüllten Lücken um Verbindungsleitung herum
EP1544163B1 (de) * 2003-12-16 2021-02-24 Robert Bosch GmbH Verfahren zur Herstellung eines Membransensors und entsprechender Membransensor

Also Published As

Publication number Publication date
US7932118B2 (en) 2011-04-26
FR2925890B1 (fr) 2010-01-29
US20090170231A1 (en) 2009-07-02
EP2075222A1 (de) 2009-07-01
DE602008001711D1 (de) 2010-08-19
JP2009160728A (ja) 2009-07-23
EP2075222B1 (de) 2010-07-07
FR2925890A1 (fr) 2009-07-03

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