ATE473475T1 - Verfahren zur dynamischen ausrichtung von substraten - Google Patents

Verfahren zur dynamischen ausrichtung von substraten

Info

Publication number
ATE473475T1
ATE473475T1 AT06008154T AT06008154T ATE473475T1 AT E473475 T1 ATE473475 T1 AT E473475T1 AT 06008154 T AT06008154 T AT 06008154T AT 06008154 T AT06008154 T AT 06008154T AT E473475 T1 ATE473475 T1 AT E473475T1
Authority
AT
Austria
Prior art keywords
sensor
wafer
port
blade
axis
Prior art date
Application number
AT06008154T
Other languages
English (en)
Inventor
Benjamin W Mooring
Charles W Freund
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/470,780 external-priority patent/US6502054B1/en
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of ATE473475T1 publication Critical patent/ATE473475T1/de

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/401—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by control arrangements for measuring, e.g. calibration and initialisation, measuring workpiece for machining purposes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/408—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by data handling or data format, e.g. reading, buffering or conversion of data
    • G05B19/4083—Adapting program, configuration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36405—Adjust path by detecting path, line with a photosensor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37283—Photoelectric sensor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37512—Correction for detection delay
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49299—Identify workpiece and align, center workpiece at the same time

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Drying Of Semiconductors (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
AT06008154T 1999-11-22 2000-11-22 Verfahren zur dynamischen ausrichtung von substraten ATE473475T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16726299P 1999-11-22 1999-11-22
US09/470,780 US6502054B1 (en) 1999-11-22 1999-12-23 Method of and apparatus for dynamic alignment of substrates
US09/527,059 US6629053B1 (en) 1999-11-22 2000-03-16 Method and apparatus for determining substrate offset using optimization techniques

Publications (1)

Publication Number Publication Date
ATE473475T1 true ATE473475T1 (de) 2010-07-15

Family

ID=27389371

Family Applications (2)

Application Number Title Priority Date Filing Date
AT06008154T ATE473475T1 (de) 1999-11-22 2000-11-22 Verfahren zur dynamischen ausrichtung von substraten
AT00310347T ATE364862T1 (de) 1999-11-22 2000-11-22 Verfahren und gerät zur entscheidung einer substratsverschiebung mit optimierungsmethoden

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT00310347T ATE364862T1 (de) 1999-11-22 2000-11-22 Verfahren und gerät zur entscheidung einer substratsverschiebung mit optimierungsmethoden

Country Status (6)

Country Link
US (1) US6629053B1 (de)
EP (3) EP1698955B1 (de)
JP (2) JP4880115B2 (de)
AT (2) ATE473475T1 (de)
DE (1) DE60035164T2 (de)
TW (2) TW494445B (de)

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Also Published As

Publication number Publication date
JP2001230302A (ja) 2001-08-24
TW494445B (en) 2002-07-11
JP4880115B2 (ja) 2012-02-22
EP1102137B1 (de) 2007-06-13
US6629053B1 (en) 2003-09-30
ATE364862T1 (de) 2007-07-15
DE60035164T2 (de) 2008-02-21
TW508482B (en) 2002-11-01
JP4880114B2 (ja) 2012-02-22
EP1102311B1 (de) 2012-01-25
EP1102311A3 (de) 2004-09-15
DE60035164D1 (de) 2007-07-26
EP1102137A3 (de) 2003-10-15
EP1102137A2 (de) 2001-05-23
EP1698955A1 (de) 2006-09-06
JP2001210698A (ja) 2001-08-03
EP1698955B1 (de) 2010-07-07
EP1102311A2 (de) 2001-05-23

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