ATE474692T1 - Ultraschallschweissverfahren zur herstellung eines polierkissens mit einem optisch transmissiven bereich - Google Patents

Ultraschallschweissverfahren zur herstellung eines polierkissens mit einem optisch transmissiven bereich

Info

Publication number
ATE474692T1
ATE474692T1 AT04753997T AT04753997T ATE474692T1 AT E474692 T1 ATE474692 T1 AT E474692T1 AT 04753997 T AT04753997 T AT 04753997T AT 04753997 T AT04753997 T AT 04753997T AT E474692 T1 ATE474692 T1 AT E474692T1
Authority
AT
Austria
Prior art keywords
polishing pad
optically transmissive
ultrasonic welding
producing
welding process
Prior art date
Application number
AT04753997T
Other languages
English (en)
Inventor
Kelly J Newell
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of ATE474692T1 publication Critical patent/ATE474692T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
AT04753997T 2003-06-17 2004-06-03 Ultraschallschweissverfahren zur herstellung eines polierkissens mit einem optisch transmissiven bereich ATE474692T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/463,721 US6997777B2 (en) 2003-06-17 2003-06-17 Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
PCT/US2004/017289 WO2005000528A1 (en) 2003-06-17 2004-06-03 Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region

Publications (1)

Publication Number Publication Date
ATE474692T1 true ATE474692T1 (de) 2010-08-15

Family

ID=33517134

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04753997T ATE474692T1 (de) 2003-06-17 2004-06-03 Ultraschallschweissverfahren zur herstellung eines polierkissens mit einem optisch transmissiven bereich

Country Status (10)

Country Link
US (1) US6997777B2 (de)
EP (1) EP1638735B1 (de)
JP (2) JP4908207B2 (de)
KR (1) KR100913282B1 (de)
CN (1) CN100467228C (de)
AT (1) ATE474692T1 (de)
DE (1) DE602004028245D1 (de)
MY (1) MY132430A (de)
TW (1) TWI286957B (de)
WO (1) WO2005000528A1 (de)

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USD559064S1 (en) * 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
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USD559648S1 (en) * 2004-10-05 2008-01-15 Jsr Corporation Polishing pad
USD559066S1 (en) 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
JP4620501B2 (ja) * 2005-03-04 2011-01-26 ニッタ・ハース株式会社 研磨パッド
JP2007118106A (ja) * 2005-10-26 2007-05-17 Toyo Tire & Rubber Co Ltd 研磨パッド及びその製造方法
US7942724B2 (en) * 2006-07-03 2011-05-17 Applied Materials, Inc. Polishing pad with window having multiple portions
EP2244642A4 (de) * 2008-02-20 2011-07-20 Mayo Foundation Systeme, vorrichtungen und verfahren für den zugang zu körpergewebe
CA2715895A1 (en) * 2008-02-20 2009-08-27 Mayo Foundation For Medical Education And Research Ultrasound guided systems and methods
JP5133830B2 (ja) * 2008-09-19 2013-01-30 イビデン株式会社 基材の被覆方法
DE102008059044B4 (de) * 2008-11-26 2013-08-22 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe mit einer verspannt-relaxierten Si1-xGex-Schicht
JP5366606B2 (ja) * 2009-03-25 2013-12-11 シチズンホールディングス株式会社 時計用指針の製造方法
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
US9795404B2 (en) 2009-12-31 2017-10-24 Tenex Health, Inc. System and method for minimally invasive ultrasonic musculoskeletal tissue treatment
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
KR101942100B1 (ko) * 2010-07-07 2019-01-24 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 저결함성 창을 갖는 화학 기계 연마 패드
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
CN101957491A (zh) * 2010-08-24 2011-01-26 亚泰影像科技股份有限公司 透镜组的固定方法
US8876983B2 (en) * 2011-09-01 2014-11-04 Ford Global Technologies, Llc In-line cleaning method for ultrasonic welding tools
US9156125B2 (en) 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
US11406415B2 (en) 2012-06-11 2022-08-09 Tenex Health, Inc. Systems and methods for tissue treatment
US9149291B2 (en) 2012-06-11 2015-10-06 Tenex Health, Inc. Systems and methods for tissue treatment
US9962181B2 (en) 2014-09-02 2018-05-08 Tenex Health, Inc. Subcutaneous wound debridement
US9763689B2 (en) 2015-05-12 2017-09-19 Tenex Health, Inc. Elongated needles for ultrasonic applications
US9868185B2 (en) * 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto
KR101945878B1 (ko) 2017-07-11 2019-02-11 에스케이씨 주식회사 연마층과 유사 경도를 갖는 윈도우를 포함하는 연마패드
DE102017214778A1 (de) * 2017-08-23 2019-02-28 Sgl Carbon Se Alternatives Fügeverfahren
JP7844617B2 (ja) * 2021-07-06 2026-04-13 アプライド マテリアルズ インコーポレイテッド 化学機械研磨のための音響窓を含む研磨パッド
CN114196327A (zh) * 2022-01-28 2022-03-18 淄博海泰新光光学技术有限公司 一种用于光学零件抛光的复合材料及制备方法

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US6569004B1 (en) * 1999-12-30 2003-05-27 Lam Research Polishing pad and method of manufacture
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JP2002170799A (ja) * 2000-11-30 2002-06-14 Nikon Corp 測定装置、研磨状況モニタ装置、研磨装置、半導体デバイス製造方法、並びに半導体デバイス
US6612917B2 (en) * 2001-02-07 2003-09-02 3M Innovative Properties Company Abrasive article suitable for modifying a semiconductor wafer
US6632129B2 (en) * 2001-02-15 2003-10-14 3M Innovative Properties Company Fixed abrasive article for use in modifying a semiconductor wafer
JP4131632B2 (ja) * 2001-06-15 2008-08-13 株式会社荏原製作所 ポリッシング装置及び研磨パッド
JP2003133270A (ja) * 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
JP2003163191A (ja) * 2001-11-28 2003-06-06 Tokyo Seimitsu Co Ltd 機械化学的研磨装置用の研磨パッド
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DE10302320A1 (de) * 2003-01-20 2004-07-29 Wipak Walsrode Gmbh & Co.Kg Wiederverschließbare Verpackung
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Also Published As

Publication number Publication date
JP2006527664A (ja) 2006-12-07
JP4908207B2 (ja) 2012-04-04
CN1805828A (zh) 2006-07-19
TWI286957B (en) 2007-09-21
EP1638735B1 (de) 2010-07-21
JP2011031392A (ja) 2011-02-17
US20040259483A1 (en) 2004-12-23
DE602004028245D1 (de) 2010-09-02
WO2005000528A1 (en) 2005-01-06
CN100467228C (zh) 2009-03-11
US6997777B2 (en) 2006-02-14
KR20060010843A (ko) 2006-02-02
TW200526355A (en) 2005-08-16
KR100913282B1 (ko) 2009-08-21
MY132430A (en) 2007-10-31
EP1638735A1 (de) 2006-03-29

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