ATE477590T1 - Halbleiterbauelement mit einer schutzenden sicherheitsbeschichtung und verfahren zu seiner herstellung - Google Patents

Halbleiterbauelement mit einer schutzenden sicherheitsbeschichtung und verfahren zu seiner herstellung

Info

Publication number
ATE477590T1
ATE477590T1 AT03744942T AT03744942T ATE477590T1 AT E477590 T1 ATE477590 T1 AT E477590T1 AT 03744942 T AT03744942 T AT 03744942T AT 03744942 T AT03744942 T AT 03744942T AT E477590 T1 ATE477590 T1 AT E477590T1
Authority
AT
Austria
Prior art keywords
producing
substrate
semiconductor component
safety coating
protective safety
Prior art date
Application number
AT03744942T
Other languages
English (en)
Inventor
Robertus Wolters
Jongh Petra De
Ronald Dekker
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE477590T1 publication Critical patent/ATE477590T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00Arrangements for protection of devices
    • H10W42/40Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/922Active solid-state devices, e.g. transistors, solid-state diodes with means to prevent inspection of or tampering with an integrated circuit, e.g. "smart card", anti-tamper

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Security & Cryptography (AREA)
  • Theoretical Computer Science (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Physical Vapour Deposition (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
AT03744942T 2002-03-21 2003-03-20 Halbleiterbauelement mit einer schutzenden sicherheitsbeschichtung und verfahren zu seiner herstellung ATE477590T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP02076112 2002-03-21
PCT/IB2003/001025 WO2003081668A1 (en) 2002-03-21 2003-03-20 Semiconductor device with a protective security coating and method of manufacturing the same

Publications (1)

Publication Number Publication Date
ATE477590T1 true ATE477590T1 (de) 2010-08-15

Family

ID=28051802

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03744942T ATE477590T1 (de) 2002-03-21 2003-03-20 Halbleiterbauelement mit einer schutzenden sicherheitsbeschichtung und verfahren zu seiner herstellung

Country Status (8)

Country Link
US (1) US7173323B2 (de)
EP (1) EP1490902B1 (de)
JP (1) JP2005521262A (de)
CN (1) CN100431140C (de)
AT (1) ATE477590T1 (de)
AU (1) AU2003209602A1 (de)
DE (1) DE60333739D1 (de)
WO (1) WO2003081668A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100378991C (zh) * 2001-11-28 2008-04-02 Nxp股份有限公司 半导体器件,卡,系统以及初始化和检验半导体器件的真实性和身份的方法
EP1654762A1 (de) * 2003-07-11 2006-05-10 Philips Intellectual Property & Standards GmbH Sicherheitsempfindliche halbleiteranordnung, insbesondere chip-karte
US20080128022A1 (en) * 2006-11-15 2008-06-05 First Solar, Inc. Photovoltaic device including a tin oxide protective layer
EP2489072A4 (de) * 2009-10-14 2014-05-28 Lockheed Corp Schutzabdeckung für leiterplatten
US8947889B2 (en) 2010-10-14 2015-02-03 Lockheed Martin Corporation Conformal electromagnetic (EM) detector
CN111957664A (zh) * 2020-07-23 2020-11-20 伯恩创盛技术研发(惠州)有限公司 一种增加玻璃强度的方法及结构

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60170239A (ja) * 1984-02-15 1985-09-03 Nec Corp 半導体装置
EP0737363B1 (de) 1994-10-31 2001-12-19 Koninklijke Philips Electronics N.V. Verfahren zur Herstellung einer Halbleitervorrichtung für Mikrowellen
US5711987A (en) * 1996-10-04 1998-01-27 Dow Corning Corporation Electronic coatings
JPH10270583A (ja) * 1997-03-25 1998-10-09 Nippon Telegr & Teleph Corp <Ntt> 半導体装置
JP2976917B2 (ja) * 1997-03-31 1999-11-10 日本電気株式会社 半導体装置
US5808873A (en) * 1997-05-30 1998-09-15 Motorola, Inc. Electronic component assembly having an encapsulation material and method of forming the same
WO1999065074A2 (en) 1998-06-10 1999-12-16 Koninklijke Philips Electronics N.V. Semiconductor device comprising an integrated circuit provided with a ceramic security coating and method of manufacturing such a device
US6137173A (en) * 1998-06-30 2000-10-24 Intel Corporation Preventing backside analysis of an integrated circuit
FR2792440B1 (fr) * 1999-04-19 2001-06-08 Schlumberger Systems & Service Dispositif a circuit integre securise contre des attaques procedant par destruction controlee d'une couche complementaire

Also Published As

Publication number Publication date
DE60333739D1 (de) 2010-09-23
US7173323B2 (en) 2007-02-06
EP1490902A1 (de) 2004-12-29
EP1490902B1 (de) 2010-08-11
US20050140003A1 (en) 2005-06-30
CN100431140C (zh) 2008-11-05
CN1643681A (zh) 2005-07-20
JP2005521262A (ja) 2005-07-14
AU2003209602A1 (en) 2003-10-08
WO2003081668A1 (en) 2003-10-02

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties