ATE482084T1 - Siebdruckmaschine und verfahren - Google Patents

Siebdruckmaschine und verfahren

Info

Publication number
ATE482084T1
ATE482084T1 AT08734584T AT08734584T ATE482084T1 AT E482084 T1 ATE482084 T1 AT E482084T1 AT 08734584 T AT08734584 T AT 08734584T AT 08734584 T AT08734584 T AT 08734584T AT E482084 T1 ATE482084 T1 AT E482084T1
Authority
AT
Austria
Prior art keywords
workpiece
printing machine
screen printing
operable
screen
Prior art date
Application number
AT08734584T
Other languages
English (en)
Inventor
Charles Moncavage
Original Assignee
Dtg Int Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dtg Int Gmbh filed Critical Dtg Int Gmbh
Application granted granted Critical
Publication of ATE482084T1 publication Critical patent/ATE482084T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/12—Machines with auxiliary equipment, e.g. for drying printed articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/40—Inking units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • B41M1/125—Stencil printing; Silk-screen printing using a field of force, e.g. an electrostatic field, or an electric current
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
AT08734584T 2007-02-20 2008-02-19 Siebdruckmaschine und verfahren ATE482084T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US89067507P 2007-02-20 2007-02-20
PCT/EP2008/001275 WO2008101663A1 (en) 2007-02-20 2008-02-19 Screen printing machine and method

Publications (1)

Publication Number Publication Date
ATE482084T1 true ATE482084T1 (de) 2010-10-15

Family

ID=38050428

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08734584T ATE482084T1 (de) 2007-02-20 2008-02-19 Siebdruckmaschine und verfahren

Country Status (7)

Country Link
US (1) US9327490B2 (de)
EP (1) EP2117845B1 (de)
CN (1) CN101801668B (de)
AT (1) ATE482084T1 (de)
DE (1) DE602008002714D1 (de)
GB (1) GB2446884B (de)
WO (1) WO2008101663A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007019073A1 (de) * 2007-04-23 2008-11-06 Ekra Automatisierungssysteme Gmbh Asys Group Verfahren und Vorrichtung zum Aufbringen von Medien auf flächige Substrate
US8733244B2 (en) * 2010-12-08 2014-05-27 Illinois Tool Works, Inc. Methods for depositing viscous material on a substrate with a combination stencil printer and dispenser
US8746139B2 (en) 2010-12-08 2014-06-10 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
US8739699B2 (en) * 2010-12-08 2014-06-03 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
US8474377B2 (en) 2010-12-08 2013-07-02 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
CN102092178B (zh) * 2010-12-22 2012-05-30 常州聚诚科技有限公司 电视机面板丝网印刷装置
CN102501615A (zh) * 2011-10-12 2012-06-20 江苏锐毕利实业有限公司 刚性印制电路板喷印定位方法
US11176635B2 (en) * 2013-01-25 2021-11-16 Cyberoptics Corporation Automatic programming of solder paste inspection system
CN104551291A (zh) * 2013-10-21 2015-04-29 泰科电子(上海)有限公司 自动焊接系统
US10137528B2 (en) * 2014-12-15 2018-11-27 Autodie Llc Blank etching fixture
CN105015151A (zh) * 2015-07-31 2015-11-04 苏州宏展信息科技有限公司 一种小型焊膏丝印台

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5110615A (en) * 1990-01-31 1992-05-05 Asymptotic Technologies, Inc. Method for dispensing viscous materials a constant height above a workpiece surface
JPH05160549A (ja) * 1991-12-11 1993-06-25 Hitachi Ltd 印刷配線板の回路パタ−ン切除方法および装置
US5792268A (en) * 1993-07-02 1998-08-11 Sci Systems, Inc. Printered circuit board screen printer vacuum holding apparatus
JPH07185999A (ja) * 1993-12-28 1995-07-25 Seikosha Co Ltd プリント基板の穴明け装置
US5794329A (en) * 1995-02-27 1998-08-18 Mpm Corporation Support apparatus for circuit board
EP1465469B1 (de) * 1995-08-30 2014-04-09 Panasonic Corporation Siebdruckverfahren und Siebdruckvorrichtung
IT1283534B1 (it) * 1996-07-26 1998-04-21 Aisa Spa Macchina per la stampa serigrafica di lastre dotata di apparecchiatura di registrazione della posizione relativa tra la lastra e il retino
US5709905A (en) * 1997-01-28 1998-01-20 Motorola, Inc. Apparatus and method for automatic monitoring and control of stencil printing
JPH10217427A (ja) * 1997-02-12 1998-08-18 Matsushita Electric Ind Co Ltd クリーム半田印刷方法及び印刷機
JP4014270B2 (ja) * 1998-01-06 2007-11-28 富士機械製造株式会社 基板支持ピン配置方法，配置検査方法および装置
JP2000168040A (ja) * 1998-12-04 2000-06-20 Minami Kk スクリーン印刷機
US6541063B1 (en) * 1999-11-04 2003-04-01 Speedline Technologies, Inc. Calibration of a dispensing system
KR200236121Y1 (ko) * 2000-03-10 2001-10-06 (주)에이알아이 인쇄회로기판의 솔더 페이스트 검사 및 도포장치
US6715413B2 (en) * 2000-05-09 2004-04-06 Matsushita Electric Industrial Co., Ltd. Apparatus and method of screen printing
US6510356B2 (en) * 2001-04-02 2003-01-21 Hewlett-Packard Company Method and apparatus for programming a paste dispensing machine
GB2377908A (en) * 2001-05-31 2003-01-29 Blakell Europlacer Ltd Screen printer for PCB with alignment apparatus
US6890050B2 (en) * 2002-08-20 2005-05-10 Palo Alto Research Center Incorporated Method for the printing of homogeneous electronic material with a multi-ejector print head
KR100540633B1 (ko) * 2003-06-20 2006-01-11 주식회사 탑 엔지니어링 페이스트 도포기 및 그 제어 방법
US20050268799A1 (en) * 2004-06-02 2005-12-08 Speedline Technologies, Inc. Solder paste lateral flow and redistribution system and methods of same
JP2006167991A (ja) * 2004-12-13 2006-06-29 Denso Corp スクリーン印刷装置及びその印刷方法
US20070102477A1 (en) * 2005-11-10 2007-05-10 Speedline Technologies, Inc. Imaging system and method for a stencil printer
DE102007019073A1 (de) 2007-04-23 2008-11-06 Ekra Automatisierungssysteme Gmbh Asys Group Verfahren und Vorrichtung zum Aufbringen von Medien auf flächige Substrate

Also Published As

Publication number Publication date
GB0706091D0 (en) 2007-05-09
EP2117845B1 (de) 2010-09-22
WO2008101663A1 (en) 2008-08-28
US9327490B2 (en) 2016-05-03
DE602008002714D1 (de) 2010-11-04
CN101801668B (zh) 2015-09-30
CN101801668A (zh) 2010-08-11
GB2446884A (en) 2008-08-27
US20100206189A1 (en) 2010-08-19
HK1138542A1 (en) 2010-08-27
GB2446884B (en) 2012-02-01
EP2117845A1 (de) 2009-11-18

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Legal Events

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