ATE484072T1 - Verfahren zur herstellung einer verbindungsstruktur eines drahtes und verbindungsstruktur eines drahtes - Google Patents

Verfahren zur herstellung einer verbindungsstruktur eines drahtes und verbindungsstruktur eines drahtes

Info

Publication number
ATE484072T1
ATE484072T1 AT06013513T AT06013513T ATE484072T1 AT E484072 T1 ATE484072 T1 AT E484072T1 AT 06013513 T AT06013513 T AT 06013513T AT 06013513 T AT06013513 T AT 06013513T AT E484072 T1 ATE484072 T1 AT E484072T1
Authority
AT
Austria
Prior art keywords
notch
fpc
wire
connection structure
individual electrode
Prior art date
Application number
AT06013513T
Other languages
English (en)
Inventor
Hiroto Sugahara
Original Assignee
Brother Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brother Ind Ltd filed Critical Brother Ind Ltd
Application granted granted Critical
Publication of ATE484072T1 publication Critical patent/ATE484072T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/652—Cross-sectional shapes
    • H10W70/6523—Cross-sectional shapes for connecting to pads at different heights at the same side of the package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01212—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps at a different location than on the final device, e.g. forming as prepeg
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
  • Wire Processing (AREA)
  • Joining Of Building Structures In Genera (AREA)
  • Installation Of Indoor Wiring (AREA)
  • Combinations Of Printed Boards (AREA)
AT06013513T 2005-06-30 2006-06-29 Verfahren zur herstellung einer verbindungsstruktur eines drahtes und verbindungsstruktur eines drahtes ATE484072T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005190947 2005-06-30

Publications (1)

Publication Number Publication Date
ATE484072T1 true ATE484072T1 (de) 2010-10-15

Family

ID=37216017

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06013513T ATE484072T1 (de) 2005-06-30 2006-06-29 Verfahren zur herstellung einer verbindungsstruktur eines drahtes und verbindungsstruktur eines drahtes

Country Status (4)

Country Link
US (2) US7781324B2 (de)
EP (1) EP1739733B1 (de)
AT (1) ATE484072T1 (de)
DE (1) DE602006017299D1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4506773B2 (ja) 2007-03-28 2010-07-21 ブラザー工業株式会社 基板両面間の電気接続方法
JP2012069548A (ja) * 2010-09-21 2012-04-05 Brother Ind Ltd 配線基板の接続構造及び接続方法
WO2015048808A1 (en) * 2013-09-30 2015-04-02 Wolf Joseph Ambrose Silver thick film paste hermetically sealed by surface thin film multilayer
EP3906758A4 (de) * 2018-12-31 2023-07-12 3M Innovative Properties Company Herstellung von elektrischen verbindungen mittels kapillarmikrofluidik
US10916518B2 (en) * 2019-04-22 2021-02-09 Mikro Mesa Technology Co., Ltd. Electrical binding structure and method of forming the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4412642A (en) * 1982-03-15 1983-11-01 Western Electric Co., Inc. Cast solder leads for leadless semiconductor circuits
DE3684602D1 (de) * 1986-10-08 1992-04-30 Ibm Verfahren zum herstellen von loetkontakten fuer ein keramisches modul ohne steckerstifte.
US5435480A (en) * 1993-12-23 1995-07-25 International Business Machines Corporation Method for filling plated through holes
US6268275B1 (en) * 1998-10-08 2001-07-31 Micron Technology, Inc. Method of locating conductive spheres utilizing screen and hopper of solder balls
US6710454B1 (en) * 2000-02-16 2004-03-23 Micron Technology, Inc. Adhesive layer for an electronic apparatus having multiple semiconductor devices
US6501663B1 (en) * 2000-02-28 2002-12-31 Hewlett Packard Company Three-dimensional interconnect system
JP3654113B2 (ja) 2000-03-07 2005-06-02 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
JP2003157949A (ja) * 2001-11-26 2003-05-30 Yazaki Corp Ｆｐｃの接続方法
JP2003318542A (ja) 2002-04-22 2003-11-07 Seiko Epson Corp 多層配線の形成方法、多層配線基板、デバイス、デバイスの製造方法及び電子機器
US6869421B2 (en) * 2002-12-09 2005-03-22 Gary L. Hanley Device for non-gravity presentation of a liquid droplet

Also Published As

Publication number Publication date
US20100276191A1 (en) 2010-11-04
EP1739733A2 (de) 2007-01-03
US7888807B2 (en) 2011-02-15
DE602006017299D1 (de) 2010-11-18
US20070000970A1 (en) 2007-01-04
EP1739733B1 (de) 2010-10-06
US7781324B2 (en) 2010-08-24
EP1739733A3 (de) 2008-04-16

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