ATE485115T1 - Verfahren und system zum behandeln eines werkstückes wie eines halbleiterwafers - Google Patents

Verfahren und system zum behandeln eines werkstückes wie eines halbleiterwafers

Info

Publication number
ATE485115T1
ATE485115T1 AT04020205T AT04020205T ATE485115T1 AT E485115 T1 ATE485115 T1 AT E485115T1 AT 04020205 T AT04020205 T AT 04020205T AT 04020205 T AT04020205 T AT 04020205T AT E485115 T1 ATE485115 T1 AT E485115T1
Authority
AT
Austria
Prior art keywords
workpiece
liquid
water
hydrochloric acid
semiconductor wafer
Prior art date
Application number
AT04020205T
Other languages
English (en)
Inventor
Eric Bergman
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semitool Inc filed Critical Semitool Inc
Application granted granted Critical
Publication of ATE485115T1 publication Critical patent/ATE485115T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/044—Cleaning involving contact with liquid using agitated containers in which the liquid and articles or material are placed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/427—Stripping or agents therefor using plasma means only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
    • H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/005—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being ozonated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/007—Heating the liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2230/00—Other cleaning aspects applicable to all B08B range
    • B08B2230/01—Cleaning with steam

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AT04020205T 1999-07-23 2000-07-21 Verfahren und system zum behandeln eines werkstückes wie eines halbleiterwafers ATE485115T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14535099P 1999-07-23 1999-07-23

Publications (1)

Publication Number Publication Date
ATE485115T1 true ATE485115T1 (de) 2010-11-15

Family

ID=22512696

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04020205T ATE485115T1 (de) 1999-07-23 2000-07-21 Verfahren und system zum behandeln eines werkstückes wie eines halbleiterwafers

Country Status (6)

Country Link
EP (2) EP1212151A4 (de)
JP (3) JP2004500701A (de)
AT (1) ATE485115T1 (de)
DE (1) DE60045134D1 (de)
TW (1) TW472317B (de)
WO (1) WO2001007177A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7163588B2 (en) 1997-05-09 2007-01-16 Semitool, Inc. Processing a workpiece using water, a base, and ozone
US7416611B2 (en) 1997-05-09 2008-08-26 Semitool, Inc. Process and apparatus for treating a workpiece with gases
JP4917651B2 (ja) * 1999-08-12 2012-04-18 アクアサイエンス株式会社 レジスト膜除去装置及びレジスト膜除去方法
US6982006B1 (en) 1999-10-19 2006-01-03 Boyers David G Method and apparatus for treating a substrate with an ozone-solvent solution
JP4000247B2 (ja) * 2001-04-18 2007-10-31 株式会社ルネサステクノロジ フォトマスクの洗浄方法
EP1347496A3 (de) * 2002-03-12 2006-05-03 Dainippon Screen Mfg. Co., Ltd. Vorrichtung und Verfahren zur Substratbehandlung
JP4232383B2 (ja) * 2002-05-13 2009-03-04 信越半導体株式会社 半導体ウエーハの表面処理方法
KR100467016B1 (ko) * 2002-05-30 2005-01-24 삼성전자주식회사 반도체기판의 세정방법
JP2006093473A (ja) * 2004-09-24 2006-04-06 M Fsi Kk 基板の洗浄方法及び基板の洗浄装置
JP4919388B2 (ja) * 2006-03-09 2012-04-18 国立大学法人広島大学 食品製造設備の被洗浄物を洗浄する洗浄装置、および洗浄方法
DE102007027112B4 (de) * 2007-06-13 2011-06-22 Siltronic AG, 81737 Verfahren zur Reinigung, Trocknung und Hydrophilierung einer Halbleiterscheibe
JP2008311591A (ja) * 2007-06-18 2008-12-25 Sharp Corp 基板処理装置および基板処理方法
EP2224470B1 (de) * 2007-12-07 2016-03-23 SUMCO Corporation Verfahren zum reinigen eines siliziumwafers
CN101945608B (zh) * 2008-02-21 2013-04-03 荷兰联合利华有限公司 清洁基底的方法和装置
IT1395090B1 (it) * 2009-04-08 2012-09-05 Lasa Impianti Srl Apparecchiatura a basso impatto ambientale per il lavaggio di particolari metallici e non metallici che necessitano di un altro grado di pulizia
JP5682290B2 (ja) * 2010-12-20 2015-03-11 東京エレクトロン株式会社 炭素含有薄膜のスリミング方法及び酸化装置
JP5520991B2 (ja) * 2012-03-29 2014-06-11 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
WO2013158937A1 (en) * 2012-04-18 2013-10-24 Advanced Wet Technologies Gmbh Hyperbaric methods and systems for rinsing and drying granular materials
US11358172B2 (en) * 2015-09-24 2022-06-14 Suss Microtec Photomask Equipment Gmbh & Co. Kg Method for treating substrates with an aqueous liquid medium exposed to UV-radiation
WO2018076187A1 (zh) * 2016-10-25 2018-05-03 深圳市柔宇科技有限公司 液体控温系统及膜层剥离设备
JP7353212B2 (ja) * 2020-02-28 2023-09-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7645114B2 (ja) * 2021-03-25 2025-03-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および、基板処理方法
JP7718916B2 (ja) 2021-08-31 2025-08-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、および、基板処理装置
JP7720209B2 (ja) * 2021-09-24 2025-08-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、および、基板処理装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5232511A (en) * 1990-05-15 1993-08-03 Semitool, Inc. Dynamic semiconductor wafer processing using homogeneous mixed acid vapors
US5261966A (en) * 1991-01-28 1993-11-16 Kabushiki Kaisha Toshiba Method of cleaning semiconductor wafers using mixer containing a bundle of gas permeable hollow yarns
JPH05152203A (ja) * 1991-11-29 1993-06-18 Chlorine Eng Corp Ltd 基板処理方法および処理装置
KR940012061A (ko) * 1992-11-27 1994-06-22 가나이 쯔또무 유기물제거방법 및 그 방법을 이용하기 위한 유기물제거장치
US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
JP2760418B2 (ja) * 1994-07-29 1998-05-28 住友シチックス株式会社 半導体ウエーハの洗浄液及びこれを用いた半導体ウエーハの洗浄方法
JP3923097B2 (ja) * 1995-03-06 2007-05-30 忠弘 大見 洗浄装置
JPH0969509A (ja) * 1995-09-01 1997-03-11 Matsushita Electron Corp 半導体ウェーハの洗浄・エッチング・乾燥装置及びその使用方法
US5803982A (en) * 1996-10-15 1998-09-08 Ez Environmental Solutions Corporation Pressure washing apparatus with ozone generator
ATE522926T1 (de) * 1997-02-14 2011-09-15 Imec Verfahren zur entfernung organischer kontamination von einer halbleiteroberfläche
JPH10340876A (ja) * 1997-06-10 1998-12-22 Shibaura Eng Works Co Ltd 洗浄処理方法および洗浄処理装置
JP4477704B2 (ja) * 1997-11-20 2010-06-09 アイメック 半導体基板表面からの有機汚染物の除去方法

Also Published As

Publication number Publication date
EP1481741B1 (de) 2010-10-20
WO2001007177A1 (en) 2001-02-01
DE60045134D1 (de) 2010-12-02
EP1481741A2 (de) 2004-12-01
EP1481741A3 (de) 2005-08-17
TW472317B (en) 2002-01-11
EP1212151A4 (de) 2005-08-17
JP2006261685A (ja) 2006-09-28
EP1212151A1 (de) 2002-06-12
JP2004500701A (ja) 2004-01-08
JP2007049176A (ja) 2007-02-22

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