ATE486301T1 - Vernetzte, positiv arbeitende photoresist- zusammensetzung - Google Patents

Vernetzte, positiv arbeitende photoresist- zusammensetzung

Info

Publication number
ATE486301T1
ATE486301T1 AT01306923T AT01306923T ATE486301T1 AT E486301 T1 ATE486301 T1 AT E486301T1 AT 01306923 T AT01306923 T AT 01306923T AT 01306923 T AT01306923 T AT 01306923T AT E486301 T1 ATE486301 T1 AT E486301T1
Authority
AT
Austria
Prior art keywords
acid
units
group
solubility
photoresist composition
Prior art date
Application number
AT01306923T
Other languages
English (en)
Inventor
Katsumi Oomori
Yohei Kinoshita
Tomotaka Yamada
Toshikazu Takayama
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000250175A external-priority patent/JP4144726B2/ja
Priority claimed from JP2000250174A external-priority patent/JP4062655B2/ja
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Application granted granted Critical
Publication of ATE486301T1 publication Critical patent/ATE486301T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
AT01306923T 2000-08-21 2001-08-14 Vernetzte, positiv arbeitende photoresist- zusammensetzung ATE486301T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000250175A JP4144726B2 (ja) 2000-08-21 2000-08-21 架橋形成ポジ型ホトレジスト組成物
JP2000250174A JP4062655B2 (ja) 2000-08-21 2000-08-21 架橋化ポジ型レジスト組成物

Publications (1)

Publication Number Publication Date
ATE486301T1 true ATE486301T1 (de) 2010-11-15

Family

ID=26598188

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01306923T ATE486301T1 (de) 2000-08-21 2001-08-14 Vernetzte, positiv arbeitende photoresist- zusammensetzung

Country Status (4)

Country Link
US (1) US6630282B2 (de)
EP (1) EP1182506B1 (de)
AT (1) ATE486301T1 (de)
DE (1) DE60143334D1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6645695B2 (en) 2000-09-11 2003-11-11 Shipley Company, L.L.C. Photoresist composition
TWI269118B (en) * 2001-03-05 2006-12-21 Sumitomo Chemical Co Chemical amplifying type positive resist composition
JP4184348B2 (ja) * 2002-12-26 2008-11-19 東京応化工業株式会社 ポジ型レジスト組成物およびレジストパターン形成方法
JP2004333548A (ja) * 2003-04-30 2004-11-25 Tokyo Ohka Kogyo Co Ltd ポジ型ホトレジスト組成物およびレジストパターン形成方法
WO2004104702A1 (ja) 2003-05-20 2004-12-02 Tokyo Ohka Kogyo Co., Ltd. 化学増幅型ポジ型ホトレジスト組成物及びレジストパターン形成方法
JP2005053936A (ja) * 2003-06-13 2005-03-03 Jsr Corp 光硬化性液状樹脂組成物
WO2005000924A1 (en) 2003-06-26 2005-01-06 Symyx Technologies, Inc. Photoresist polymers
CN100549051C (zh) 2003-06-26 2009-10-14 捷时雅株式会社 光刻胶聚合物组合物
US7250475B2 (en) 2003-06-26 2007-07-31 Symyx Technologies, Inc. Synthesis of photoresist polymers
CN101823989B (zh) * 2004-03-08 2012-05-09 三菱丽阳株式会社 抗蚀剂用聚合物、抗蚀剂组合物及图案制造方法以及抗蚀剂用聚合物用原料化合物
WO2005100412A1 (ja) * 2004-04-13 2005-10-27 Tokyo Ohka Kogyo Co., Ltd. 高分子化合物、該高分子化合物を含有するフォトレジスト組成物、およびレジストパターン形成方法
US7951522B2 (en) 2004-12-29 2011-05-31 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
US7927778B2 (en) 2004-12-29 2011-04-19 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
EP1684120A1 (de) * 2005-01-19 2006-07-26 Rohm and Haas Electronic Materials LLC Fotoresistzusammensetzungen, die Mischungen von Harzen enthalten
US20070031758A1 (en) * 2005-08-03 2007-02-08 Jsr Corporation Positive-type radiation-sensitive resin composition for producing a metal-plating formed material, transcription film and production method of a metal-plating formed material
TW200830050A (en) * 2006-09-21 2008-07-16 Fujifilm Corp Resist composition and pattern-forming method using the same
US8715918B2 (en) * 2007-09-25 2014-05-06 Az Electronic Materials Usa Corp. Thick film resists
KR102261808B1 (ko) 2016-08-09 2021-06-07 리지필드 액퀴지션 환경적으로 안정한 후막성 화학증폭형 레지스트
CN107151287B (zh) * 2017-05-24 2020-06-02 儒芯微电子材料（上海）有限公司 一种交联型丙烯酸酯类共聚物及其光刻胶
EP3763752A4 (de) * 2018-03-07 2021-12-15 Maruzen Petrochemical Co., Ltd. Neue bifunktionelle (meth)acrylatverbindung und polymer
CN117457484A (zh) 2022-07-26 2024-01-26 罗门哈斯电子材料有限责任公司 金属化方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0422628A3 (en) 1989-10-13 1992-02-26 E.I. Du Pont De Nemours And Company Photosensitive element
JP3206989B2 (ja) 1992-11-13 2001-09-10 富士写真フイルム株式会社 ポジ型感光性材料
JPH06230574A (ja) 1993-02-05 1994-08-19 Fuji Photo Film Co Ltd ポジ型感光性組成物
JP3373056B2 (ja) 1994-08-17 2003-02-04 富士写真フイルム株式会社 ポジ型感光性組成物
EP0738744B1 (de) 1995-04-21 2002-11-27 Arch Specialty Chemicals, Inc. Vernetzte Polymere
JP3695024B2 (ja) 1996-11-14 2005-09-14 Ｊｓｒ株式会社 半導体デバイス製造用感放射線性樹脂組成物
US6120972A (en) 1997-09-02 2000-09-19 Jsr Corporation Radiation-sensitive resin composition
KR100557368B1 (ko) * 1998-01-16 2006-03-10 제이에스알 가부시끼가이샤 감방사선성 수지 조성물
KR100504644B1 (ko) 1998-10-29 2005-08-04 신에쓰 가가꾸 고교 가부시끼가이샤 포지형 레지스트 재료
JP3941268B2 (ja) 1998-11-10 2007-07-04 Ｊｓｒ株式会社 感放射線性樹脂組成物
JP3796560B2 (ja) * 1999-01-27 2006-07-12 信越化学工業株式会社 化学増幅ポジ型レジスト組成物及びパターン形成方法
JP3662774B2 (ja) 1999-06-02 2005-06-22 東京応化工業株式会社 ポジ型レジスト組成物
JP2001166478A (ja) * 1999-12-03 2001-06-22 Jsr Corp 感放射線性樹脂組成物
JP4694686B2 (ja) * 2000-08-31 2011-06-08 東京応化工業株式会社 半導体素子製造方法

Also Published As

Publication number Publication date
DE60143334D1 (de) 2010-12-09
US6630282B2 (en) 2003-10-07
US20020034704A1 (en) 2002-03-21
EP1182506B1 (de) 2010-10-27
EP1182506A1 (de) 2002-02-27

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