ATE486489T1 - Flexible leiterplattenanordnung - Google Patents
Flexible leiterplattenanordnungInfo
- Publication number
- ATE486489T1 ATE486489T1 AT05705493T AT05705493T ATE486489T1 AT E486489 T1 ATE486489 T1 AT E486489T1 AT 05705493 T AT05705493 T AT 05705493T AT 05705493 T AT05705493 T AT 05705493T AT E486489 T1 ATE486489 T1 AT E486489T1
- Authority
- AT
- Austria
- Prior art keywords
- flexible pcb
- grooves
- circuit board
- bending region
- pcb arrangement
- Prior art date
Links
- 238000005452 bending Methods 0.000 abstract 4
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
- Y10T428/24537—Parallel ribs and/or grooves
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Air Bags (AREA)
- Pens And Brushes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/789,522 US6927344B1 (en) | 2004-02-27 | 2004-02-27 | Flexible circuit board assembly |
| PCT/US2005/000861 WO2005094143A1 (en) | 2004-02-27 | 2005-01-11 | Flexible circuit board assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE486489T1 true ATE486489T1 (de) | 2010-11-15 |
Family
ID=34808672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT05705493T ATE486489T1 (de) | 2004-02-27 | 2005-01-11 | Flexible leiterplattenanordnung |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6927344B1 (de) |
| EP (1) | EP1726191B1 (de) |
| JP (1) | JP2007525841A (de) |
| KR (1) | KR20060123597A (de) |
| CN (1) | CN1918951A (de) |
| AT (1) | ATE486489T1 (de) |
| AU (1) | AU2005226496B2 (de) |
| CA (1) | CA2553559A1 (de) |
| DE (1) | DE602005024372D1 (de) |
| WO (1) | WO2005094143A1 (de) |
Families Citing this family (92)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050043627A1 (en) * | 2003-07-17 | 2005-02-24 | Angelsen Bjorn A.J. | Curved ultrasound transducer arrays manufactured with planar technology |
| US7309943B2 (en) * | 2003-09-08 | 2007-12-18 | New Scale Technologies, Inc. | Mechanism comprised of ultrasonic lead screw motor |
| US6940209B2 (en) * | 2003-09-08 | 2005-09-06 | New Scale Technologies | Ultrasonic lead screw motor |
| US7071419B2 (en) * | 2003-10-08 | 2006-07-04 | Motorola, Inc. | Tear resistant flexible substrate |
| US8068346B2 (en) * | 2004-05-04 | 2011-11-29 | Hamilton Sundstrand Corporation | Circuit board with high density power semiconductors |
| JP2006100302A (ja) * | 2004-09-28 | 2006-04-13 | Sharp Corp | 高周波モジュールおよびその製造方法 |
| US7292453B2 (en) * | 2004-10-14 | 2007-11-06 | Kyocera Mita Corporation | Bi-fold mounted printed wiring board |
| US7492044B2 (en) * | 2005-10-06 | 2009-02-17 | Lenovo (Singapore) Pte. Ltd. | System and method for decreasing stress on solder holding BGA module to computer motherboard |
| US20070096333A1 (en) * | 2005-10-31 | 2007-05-03 | Amir Motamedi | Optimal stacked die organization |
| US7507923B2 (en) * | 2005-12-05 | 2009-03-24 | Omron Dualtec Automotive Electronics Inc. | Electrical switch |
| JP4907179B2 (ja) * | 2006-01-27 | 2012-03-28 | 株式会社 日立ディスプレイズ | 表示装置 |
| JP2007258682A (ja) * | 2006-02-24 | 2007-10-04 | Sanyo Electric Co Ltd | フレキシブル基板 |
| JP2007273582A (ja) * | 2006-03-30 | 2007-10-18 | Toshiba Corp | プリント配線板、プリント配線板の製造方法および電子機器 |
| JP2008047674A (ja) * | 2006-08-14 | 2008-02-28 | Three M Innovative Properties Co | 折り曲げ部を有するプリント配線板及びその製造方法 |
| CN101518163B (zh) | 2006-09-21 | 2011-06-08 | 株式会社大昌电子 | 刚挠性印刷电路板及该刚挠性印刷电路板的制造方法 |
| TWI342063B (en) * | 2007-06-08 | 2011-05-11 | Ind Tech Res Inst | A bonding structure of flexible films and bonding method therefor |
| KR100885976B1 (ko) * | 2007-06-25 | 2009-03-03 | 삼성전자주식회사 | 인쇄회로기판, 이를 구비한 메모리 모듈 및 이의 제조방법 |
| JP2009076663A (ja) * | 2007-09-20 | 2009-04-09 | Three M Innovative Properties Co | 可撓性回路基板、その製造方法およびそれを使用した電子機器 |
| JP5144210B2 (ja) * | 2007-10-29 | 2013-02-13 | 富士通株式会社 | 半導体装置 |
| US7643305B2 (en) * | 2008-03-07 | 2010-01-05 | Qualcomm Mems Technologies, Inc. | System and method of preventing damage to metal traces of flexible printed circuits |
| DE102008016133B4 (de) * | 2008-03-28 | 2013-12-19 | Continental Automotive Gmbh | Leiterplatte und Verfahren zum Herstellen einer Leiterplatte |
| FI20085468A0 (fi) * | 2008-05-16 | 2008-05-16 | Polar Electro Oy | Sähköpiirijärjestely |
| KR20090121711A (ko) | 2008-05-22 | 2009-11-26 | 삼성전자주식회사 | 디스플레이 장치와 그 제조 방법 |
| CN101636046B (zh) * | 2008-07-24 | 2011-07-13 | 比亚迪股份有限公司 | 一种多层柔性线路板的加工方法 |
| USD603812S1 (en) * | 2008-08-26 | 2009-11-10 | Clevx, Llc | Foldable electronic package |
| TWI415044B (zh) * | 2008-12-15 | 2013-11-11 | Ind Tech Res Inst | 基板、製造方法、及使用該基板的顯示器 |
| DE102009006757B3 (de) * | 2009-01-30 | 2010-08-19 | Continental Automotive Gmbh | Lötstopplack-Beschichtung für starrbiegsame Leiterplatten |
| DE102009018447A1 (de) * | 2009-04-22 | 2010-11-04 | Automotive Lighting Reutlingen Gmbh | Leiterplatte |
| JP5360223B2 (ja) * | 2009-10-05 | 2013-12-04 | 株式会社村田製作所 | 回路基板 |
| KR101093282B1 (ko) * | 2009-10-30 | 2011-12-14 | 삼성에스디아이 주식회사 | 이차전지 팩 |
| FR2952473B1 (fr) * | 2009-11-06 | 2011-11-18 | Commissariat Energie Atomique | Procede de realisation d'un circuit courbe |
| DE102009060780A1 (de) * | 2009-12-22 | 2011-06-30 | Automotive Lighting Reutlingen GmbH, 72762 | Elektronisches Steuergerät und Gasentladungslampe für eine Beleuchtungseinrichtung eines Kraftfahrzeugs mit einem solchen Steuergerät |
| DE102009060777A1 (de) * | 2009-12-22 | 2011-06-30 | Automotive Lighting Reutlingen GmbH, 72762 | Elektronisches Steuergerät und Verfahren zur Herstellung einer Einheit aus einem Grundkörper und einer Leiterplatte zum Einsatz in einem solchen Steuergerät |
| DE102010027149A1 (de) * | 2010-07-14 | 2012-01-19 | Fela Hilzinger Gmbh | Verbiegbare Metallkernleiterplatte |
| US9320130B2 (en) * | 2010-10-25 | 2016-04-19 | Korea Electric Terminal Co., Ltd. | Printed circuit board, and board block for vehicles using the same |
| NZ611197A (en) | 2010-10-29 | 2015-07-31 | Orpyx Medical Technologies Inc | Peripheral sensory and supersensory replacement system |
| FR2969898B1 (fr) * | 2010-12-28 | 2014-05-09 | Eads Europ Aeronautic Defence | Reseau electrique integre a un element de structure |
| KR101159218B1 (ko) * | 2011-04-08 | 2012-06-25 | 안복만 | 다층 인쇄회로기판 및 그 제조방법 |
| US8686297B2 (en) * | 2011-08-29 | 2014-04-01 | Apple Inc. | Laminated flex circuit layers for electronic device components |
| JP2013084729A (ja) * | 2011-10-07 | 2013-05-09 | Fujitsu Ltd | 多層配線基板、電子装置、及び多層配線基板の製造方法 |
| KR101330770B1 (ko) * | 2011-11-16 | 2013-11-18 | 엘지이노텍 주식회사 | 백라이트 유닛용 절곡 인쇄회로기판 |
| JP5406908B2 (ja) * | 2011-11-28 | 2014-02-05 | 株式会社フジクラ | プリント配線板 |
| KR20130062197A (ko) * | 2011-12-02 | 2013-06-12 | 삼성에스디아이 주식회사 | 배터리 팩 및 배터리 팩의 제조방법 |
| KR101876540B1 (ko) * | 2011-12-28 | 2018-07-10 | 삼성디스플레이 주식회사 | 가요성 표시 장치 및 가요성 표시 장치의 제조 방법 |
| KR101897829B1 (ko) * | 2012-03-15 | 2018-09-12 | 삼성에스디아이 주식회사 | 절연부재를 구비하는 배터리 팩 |
| ITMI20121591A1 (it) * | 2012-09-25 | 2014-03-26 | St Microelectronics Srl | Scheda elettrica piana con alette piegabili e sistema di rilevazione delle componenti lungo tre assi coordinati di forze interne in un manufatto di materiale di costruzione |
| US9019710B2 (en) * | 2012-10-11 | 2015-04-28 | Apple Inc. | Devices having flexible printed circuits with bent stiffeners |
| JP6300442B2 (ja) * | 2013-01-18 | 2018-03-28 | オリンパス株式会社 | 光伝送モジュールおよび撮像装置 |
| CA2912586C (en) | 2013-05-21 | 2020-06-09 | Orpyx Medical Technologies Inc. | Pressure data acquisition assembly |
| KR102150611B1 (ko) * | 2013-07-02 | 2020-09-01 | 엘지이노텍 주식회사 | 인쇄회로기판 |
| KR102127341B1 (ko) * | 2013-07-02 | 2020-06-26 | 엘지이노텍 주식회사 | 인쇄회로기판 |
| US9554465B1 (en) | 2013-08-27 | 2017-01-24 | Flextronics Ap, Llc | Stretchable conductor design and methods of making |
| AU2014334574B2 (en) * | 2013-10-15 | 2017-07-06 | Boston Scientific Scimed, Inc. | Medical device balloon |
| KR102151634B1 (ko) | 2013-11-28 | 2020-09-04 | 삼성디스플레이 주식회사 | 플렉서블 표시장치 |
| US9811120B2 (en) | 2013-11-28 | 2017-11-07 | Samsung Display Co., Ltd. | Flexible display device |
| US9521748B1 (en) * | 2013-12-09 | 2016-12-13 | Multek Technologies, Ltd. | Mechanical measures to limit stress and strain in deformable electronics |
| US9338915B1 (en) | 2013-12-09 | 2016-05-10 | Flextronics Ap, Llc | Method of attaching electronic module on fabrics by stitching plated through holes |
| CN103987186A (zh) * | 2014-04-30 | 2014-08-13 | 美的集团武汉制冷设备有限公司 | 电路板、显示组件和空调 |
| KR101460475B1 (ko) | 2014-05-26 | 2014-11-10 | 정윤화 | 3차원 안테나 장치 |
| US9276055B1 (en) * | 2014-08-31 | 2016-03-01 | Lg Display Co., Ltd. | Display device with micro cover layer and manufacturing method for the same |
| DE102014218821A1 (de) * | 2014-09-18 | 2016-03-24 | Continental Automotive Gmbh | Leiterplatte |
| CN104486902B (zh) * | 2014-11-27 | 2018-01-16 | 深圳市华星光电技术有限公司 | 弯折型印刷电路板 |
| KR102371358B1 (ko) | 2015-01-23 | 2022-03-08 | 삼성전자주식회사 | 반도체 패키지 및 이를 사용하는 패키지 모듈 |
| KR102250053B1 (ko) | 2015-05-19 | 2021-05-11 | 삼성디스플레이 주식회사 | 플렉시블 디스플레이 장치 및 그 제조방법 |
| CN105050316A (zh) * | 2015-06-17 | 2015-11-11 | 安徽达胜电子有限公司 | 一种双层线路板 |
| CN104991369B (zh) * | 2015-08-06 | 2019-02-05 | 京东方科技集团股份有限公司 | 显示模组及显示装置 |
| JP6439636B2 (ja) * | 2015-09-10 | 2018-12-19 | 株式会社デンソー | プリント基板の製造方法 |
| KR101887754B1 (ko) * | 2016-08-29 | 2018-09-11 | 주식회사 코리아써키트 | 리지드 플렉시블 회로기판 제조방법 |
| KR102614599B1 (ko) | 2016-11-07 | 2023-12-18 | 삼성디스플레이 주식회사 | 롤러블 디스플레이 장치 |
| KR102327991B1 (ko) * | 2016-12-16 | 2021-11-18 | 삼성디스플레이 주식회사 | 디스플레이 장치의 제조방법 |
| KR102708773B1 (ko) | 2016-12-26 | 2024-09-23 | 엘지디스플레이 주식회사 | 플렉서블 표시장치 |
| DE102017214780A1 (de) * | 2017-08-23 | 2019-02-28 | Conti Temic Microelectronic Gmbh | Sensorbauteil, Vormontageanordnung für ein Sensorbauteil und Verfahren zur Herstellung eines Sensorbauteils |
| KR102423192B1 (ko) | 2017-09-06 | 2022-07-21 | 삼성디스플레이 주식회사 | 폴딩 가능한 디스플레이 장치 및 그 제조방법 |
| GB201718070D0 (en) * | 2017-11-01 | 2017-12-13 | Smith & Nephew | Negative pressure wound treatment apparatuses and methods with integrated electronics |
| KR102481385B1 (ko) | 2017-09-27 | 2022-12-27 | 삼성디스플레이 주식회사 | 폴딩 가능한 디스플레이 장치 및 그 제조방법 |
| WO2019086332A1 (en) | 2017-11-01 | 2019-05-09 | Smith & Nephew Plc | Negative pressure wound treatment apparatuses and methods with integrated electronics |
| US10880995B2 (en) | 2017-12-15 | 2020-12-29 | 2449049 Ontario Inc. | Printed circuit board with stress relief zones for component and solder joint protection |
| KR102573780B1 (ko) * | 2018-09-28 | 2023-08-31 | 엘지디스플레이 주식회사 | 표시 장치 |
| US20220103670A1 (en) * | 2019-02-01 | 2022-03-31 | Huawei Technologies Co., Ltd. | Support sheet used for foldable terminal device and foldable terminal device |
| US20200296840A1 (en) * | 2019-03-13 | 2020-09-17 | OSI Electronics, Inc. | Folded Multilayered Flexible Circuit Board and Methods of Manufacturing Thereof |
| EP3826153A1 (de) | 2019-11-22 | 2021-05-26 | Siemens Aktiengesellschaft | Antrieb mit segmentiertem umrichtergehäuse |
| CN113365412B (zh) * | 2020-03-05 | 2022-06-24 | 宏启胜精密电子(秦皇岛)有限公司 | 复合电路板及其制作方法 |
| WO2021199866A1 (ja) * | 2020-03-30 | 2021-10-07 | 株式会社村田製作所 | 回路モジュール |
| FI20205672A1 (fi) | 2020-06-25 | 2021-12-26 | Epec Oy | Elektroniikkalaite ja menetelmä elektroniikkalaitteen muodostamiseksi |
| WO2022019557A1 (ko) | 2020-07-22 | 2022-01-27 | 삼성전자 주식회사 | 연성회로기판 및 이를 포함하는 전자 장치 |
| KR20220112603A (ko) * | 2021-02-04 | 2022-08-11 | 삼성전자주식회사 | 연성회로기판 및 이를 포함하는 폴더블 전자 장치 |
| US11497118B2 (en) | 2021-02-12 | 2022-11-08 | Raytheon Company | Method for manufacturing non-planar arrays with a single flex-hybrid circuit card |
| JP7684867B2 (ja) * | 2021-08-26 | 2025-05-28 | Tdk株式会社 | プリント基板 |
| CN113823190B (zh) * | 2021-09-30 | 2023-11-28 | 武汉华星光电半导体显示技术有限公司 | 支撑复合板及显示模组 |
| CN116013169A (zh) * | 2023-02-16 | 2023-04-25 | 成都京东方光电科技有限公司 | 曲面显示模组及显示装置 |
| CN118945996B (zh) * | 2023-05-12 | 2025-10-14 | 庆鼎精密电子(淮安)有限公司 | 软硬结合电路板及其制备方法 |
| CN116669467A (zh) * | 2023-05-30 | 2023-08-29 | 京东方科技集团股份有限公司 | 车载显示装置和车辆 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4404059A (en) * | 1982-05-26 | 1983-09-13 | Livshits Vladimir I | Process for manufacturing panels to be used in microelectronic systems |
| WO1990006609A1 (en) * | 1988-11-16 | 1990-06-14 | Motorola, Inc. | Flexible substrate electronic assembly |
| US5170326A (en) * | 1990-02-05 | 1992-12-08 | Motorola, Inc. | Electronic module assembly |
| US5159751A (en) * | 1990-02-05 | 1992-11-03 | Motorola, Inc. | Method of manufacturing electronic module assembly |
| US5265322A (en) * | 1990-02-05 | 1993-11-30 | Motorola, Inc. | Electronic module assembly and method of forming same |
| US5103375A (en) * | 1990-02-05 | 1992-04-07 | Motorola, Inc. | Electronic module assembly and method of manufacture |
| US5216581A (en) * | 1990-02-05 | 1993-06-01 | Motorola, Inc. | Electronic module assembly and method of forming same |
| JPH0422075A (ja) * | 1990-05-17 | 1992-01-27 | Seiko Epson Corp | 配線接続装置 |
| DE4131935A1 (de) * | 1991-09-25 | 1993-04-08 | Degussa | Starre, in teilbereichen biegbare gedruckte schaltungen und verfahren zu deren herstellung |
| US5179501A (en) * | 1992-02-24 | 1993-01-12 | Motorola, Inc. | Laminated electronic module assembly |
| JP2989410B2 (ja) * | 1993-02-25 | 1999-12-13 | シャープ株式会社 | 可撓性フィルム基板 |
| US5416278A (en) * | 1993-03-01 | 1995-05-16 | Motorola, Inc. | Feedthrough via connection |
| US5386341A (en) * | 1993-11-01 | 1995-01-31 | Motorola, Inc. | Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape |
| US5434362A (en) * | 1994-09-06 | 1995-07-18 | Motorola, Inc. | Flexible circuit board assembly and method |
| US5925298A (en) * | 1995-06-26 | 1999-07-20 | Ford Motor Company | Method for reworking a multi-layer circuit board using a shape memory alloy material |
| US5998738A (en) * | 1996-08-30 | 1999-12-07 | Motorola Inc. | Electronic control module |
| US5754409A (en) * | 1996-11-06 | 1998-05-19 | Dynamem, Inc. | Foldable electronic assembly module |
| US6528736B1 (en) * | 1997-01-21 | 2003-03-04 | Visteon Global Technologies, Inc. | Multi-layer printed circuit board and method of making same |
| US6061245A (en) | 1998-01-22 | 2000-05-09 | International Business Machines Corporation | Free standing, three dimensional, multi-chip, carrier package with air flow baffle |
| US6099745A (en) * | 1998-06-05 | 2000-08-08 | Parlex Corporation | Rigid/flex printed circuit board and manufacturing method therefor |
| US6256322B1 (en) * | 1998-10-02 | 2001-07-03 | Canon Kabushiki Kaisha | Bundling multiple network management packets |
| SE9900164D0 (sv) * | 1999-01-20 | 1999-01-20 | Piezomotors Uppsala Ab | Flexible microsystem and building techniques |
| US6292370B1 (en) * | 1999-10-01 | 2001-09-18 | Motorola, Inc. | Flexible circuit board and method for making a flexible circuit board |
| WO2001080375A1 (en) | 2000-04-14 | 2001-10-25 | Reipur Technology A/S | An element for holding electric circuits |
| US6320128B1 (en) * | 2000-05-25 | 2001-11-20 | Visteon Global Technology, Inc. | Environmentally-sealed electronic assembly and method of making same |
| ES2187285B1 (es) * | 2001-08-24 | 2004-08-16 | Lear Automotive (Eeds) Spain, S.L. | Procedimiento de multifresado para la fabricacion de circuitos impresos y circuito impreso asi obtenido. |
| FI20012052A0 (fi) | 2001-10-23 | 2001-10-23 | Mika Matti Sippola | Menetelmä monikerrosrakenteen valmistamiseksi |
| US6483037B1 (en) * | 2001-11-13 | 2002-11-19 | Motorola, Inc. | Multilayer flexible FR4 circuit |
| US6483713B2 (en) * | 2001-11-20 | 2002-11-19 | St. Jude Children's Research Hospital | Multilayered board comprising folded flexible circuits |
| US6501661B1 (en) * | 2001-12-21 | 2002-12-31 | Motorola, Inc. | Electronic control unit |
-
2004
- 2004-02-27 US US10/789,522 patent/US6927344B1/en not_active Expired - Fee Related
-
2005
- 2005-01-11 KR KR1020067017262A patent/KR20060123597A/ko not_active Ceased
- 2005-01-11 CA CA002553559A patent/CA2553559A1/en not_active Abandoned
- 2005-01-11 WO PCT/US2005/000861 patent/WO2005094143A1/en not_active Ceased
- 2005-01-11 AU AU2005226496A patent/AU2005226496B2/en not_active Ceased
- 2005-01-11 JP JP2007500758A patent/JP2007525841A/ja active Pending
- 2005-01-11 CN CNA2005800043858A patent/CN1918951A/zh active Pending
- 2005-01-11 DE DE602005024372T patent/DE602005024372D1/de not_active Expired - Lifetime
- 2005-01-11 EP EP05705493A patent/EP1726191B1/de not_active Expired - Lifetime
- 2005-01-11 AT AT05705493T patent/ATE486489T1/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US6927344B1 (en) | 2005-08-09 |
| JP2007525841A (ja) | 2007-09-06 |
| EP1726191A1 (de) | 2006-11-29 |
| EP1726191B1 (de) | 2010-10-27 |
| DE602005024372D1 (de) | 2010-12-09 |
| CA2553559A1 (en) | 2005-10-06 |
| EP1726191A4 (de) | 2007-07-04 |
| KR20060123597A (ko) | 2006-12-01 |
| AU2005226496A1 (en) | 2005-10-06 |
| WO2005094143A1 (en) | 2005-10-06 |
| US20050190531A1 (en) | 2005-09-01 |
| CN1918951A (zh) | 2007-02-21 |
| AU2005226496B2 (en) | 2009-04-02 |
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| Date | Code | Title | Description |
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| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |