ATE48777T1 - Apparat zum verzinnen von ''dips''. - Google Patents

Apparat zum verzinnen von ''dips''.

Info

Publication number
ATE48777T1
ATE48777T1 AT85300274T AT85300274T ATE48777T1 AT E48777 T1 ATE48777 T1 AT E48777T1 AT 85300274 T AT85300274 T AT 85300274T AT 85300274 T AT85300274 T AT 85300274T AT E48777 T1 ATE48777 T1 AT E48777T1
Authority
AT
Austria
Prior art keywords
tining
dips
fingers
components
actuated
Prior art date
Application number
AT85300274T
Other languages
English (en)
Inventor
Rene Cornellier
Original Assignee
Corfin Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corfin Technologies Inc filed Critical Corfin Technologies Inc
Application granted granted Critical
Publication of ATE48777T1 publication Critical patent/ATE48777T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • B23K3/0676—Conveyors therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Specific Conveyance Elements (AREA)
  • Coating With Molten Metal (AREA)
  • Stacking Of Articles And Auxiliary Devices (AREA)
  • Molten Solder (AREA)
  • Supply And Installment Of Electrical Components (AREA)
AT85300274T 1984-01-17 1985-01-16 Apparat zum verzinnen von ''dips''. ATE48777T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CA445474 1984-01-17
EP85300274A EP0150954B1 (de) 1984-01-17 1985-01-16 Apparat zum Verzinnen von "Dips"

Publications (1)

Publication Number Publication Date
ATE48777T1 true ATE48777T1 (de) 1990-01-15

Family

ID=4126966

Family Applications (1)

Application Number Title Priority Date Filing Date
AT85300274T ATE48777T1 (de) 1984-01-17 1985-01-16 Apparat zum verzinnen von ''dips''.

Country Status (5)

Country Link
US (1) US4654227A (de)
EP (1) EP0150954B1 (de)
JP (1) JPH0675772B2 (de)
AT (1) ATE48777T1 (de)
DE (1) DE3574836D1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4887762A (en) * 1987-03-12 1989-12-19 British Aerospace Public Limted Company Solder coating processes
US4869202A (en) * 1988-11-18 1989-09-26 Baker Jess J Solder dip fixture
US4934677A (en) * 1989-08-24 1990-06-19 Dow Corning Corporation Holder for electronic devices
US5048664A (en) * 1990-02-12 1991-09-17 Micron Technology, Inc. Reciprocating staging fixture
US5782337A (en) * 1991-01-15 1998-07-21 Raychem Corporation Conveyor belt system and heater utilizing said system
EP0567565B1 (de) * 1991-01-15 1997-12-03 Raychem Corporation Förderbandsystem und heizapparat in dem das system anwendung findet
US5577909A (en) * 1991-01-15 1996-11-26 Raychem Corporation Conveyor belt system and heater utilizing said system
JP2712960B2 (ja) * 1991-11-08 1998-02-16 株式会社村田製作所 ディップ装置
US5509965A (en) * 1992-03-18 1996-04-23 Continental Pet Technologies, Inc. Preform coating apparatus and method
US5490591A (en) * 1995-01-04 1996-02-13 Faulkner; William G. Conveyor with cleats having a product-carrying surface and an opposite product-releasing surface
WO1998051597A1 (en) * 1997-05-13 1998-11-19 Ser-Tek Systems, Inc. Conveyor with integrated self-actuating clamp
WO2002011936A1 (en) * 2000-08-08 2002-02-14 Advance Micro Devices, Inc. Solder plating system with plating carrier belt roller with locking sprocket pins
WO2008076433A1 (en) * 2006-12-19 2008-06-26 Heller Industries Systems and methods for printed circuit board support
US8220618B2 (en) * 2009-02-27 2012-07-17 Neopost Technologies Conveyor chain and conveyor for gripping and conveying paper material
EP2746170B1 (de) * 2012-12-21 2016-04-27 Tetra Laval Holdings & Finance S.A. Falteinheit für Maschinen zur Verpackung gießbarer Lebensmittel
CN104064285A (zh) * 2014-06-13 2014-09-24 安徽省宁国天成电工有限公司 一种圆铜线热镀锡的生产工艺
CN115007960B (zh) * 2022-07-19 2024-09-06 河北申科电子股份有限公司 浸锡检测装置
CN115418591B (zh) * 2022-08-29 2023-11-14 西安微电子技术研究所 一种用于元器件的搪锡系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2918197A (en) * 1955-04-29 1959-12-22 Koerber & Co Kg Conveyor apparatus
US3722060A (en) * 1971-07-27 1973-03-27 F Gaiser Machine
CH639580A5 (de) * 1979-01-23 1983-11-30 Karl Flury Loetanlage zum loeten von leiterplatten und verfahren zu deren betrieb.
DE3027896C2 (de) * 1980-07-23 1984-07-05 Texas Instruments Deutschland Gmbh, 8050 Freising Vorrichtung zum Transportieren von Werkstücken durch eine Bearbeitungsanlage
JPS58199593A (ja) * 1982-05-17 1983-11-19 近藤　権士 はんだ付け装置のキヤリア

Also Published As

Publication number Publication date
JPS6114075A (ja) 1986-01-22
US4654227A (en) 1987-03-31
JPH0675772B2 (ja) 1994-09-28
EP0150954A1 (de) 1985-08-07
EP0150954B1 (de) 1989-12-20
DE3574836D1 (de) 1990-01-25

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