ATE488027T1 - Elektrolumineszente vorrichtung mit lichtauskoppelung - Google Patents
Elektrolumineszente vorrichtung mit lichtauskoppelungInfo
- Publication number
- ATE488027T1 ATE488027T1 AT02726265T AT02726265T ATE488027T1 AT E488027 T1 ATE488027 T1 AT E488027T1 AT 02726265 T AT02726265 T AT 02726265T AT 02726265 T AT02726265 T AT 02726265T AT E488027 T1 ATE488027 T1 AT E488027T1
- Authority
- AT
- Austria
- Prior art keywords
- mirrors
- photons
- electroluminescent device
- converting
- light extraction
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/821—Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/852—Arrangements for extracting light from the devices comprising a resonant cavity structure, e.g. Bragg reflector pair
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/872—Periodic patterns for optical field-shaping, e.g. photonic bandgap structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Devices (AREA)
- Electroluminescent Light Sources (AREA)
- Optical Integrated Circuits (AREA)
- Radiation-Therapy Devices (AREA)
- Control Of El Displays (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0105652A FR2824228B1 (fr) | 2001-04-26 | 2001-04-26 | Dispositif electroluminescent a extracteur de lumiere |
| PCT/FR2002/001341 WO2002089218A2 (fr) | 2001-04-26 | 2002-04-18 | Dispositif electroluminescent a extracteur de lumiere |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE488027T1 true ATE488027T1 (de) | 2010-11-15 |
Family
ID=8862739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT02726265T ATE488027T1 (de) | 2001-04-26 | 2002-04-18 | Elektrolumineszente vorrichtung mit lichtauskoppelung |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6987288B2 (de) |
| EP (1) | EP1382074B1 (de) |
| JP (1) | JP4163004B2 (de) |
| AT (1) | ATE488027T1 (de) |
| AU (1) | AU2002256752A1 (de) |
| CA (1) | CA2444338C (de) |
| DE (1) | DE60238245D1 (de) |
| FR (1) | FR2824228B1 (de) |
| WO (1) | WO2002089218A2 (de) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3956918B2 (ja) | 2002-10-03 | 2007-08-08 | 日亜化学工業株式会社 | 発光ダイオード |
| JP2004172506A (ja) | 2002-11-22 | 2004-06-17 | Sony Corp | 半導体レーザ素子 |
| JP4610863B2 (ja) * | 2003-03-19 | 2011-01-12 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | フォトニック結晶構造を使用するled効率の改良 |
| JP4263121B2 (ja) * | 2003-03-27 | 2009-05-13 | 三洋電機株式会社 | 発光素子および照明装置 |
| US7078735B2 (en) | 2003-03-27 | 2006-07-18 | Sanyo Electric Co., Ltd. | Light-emitting device and illuminator |
| US7262550B2 (en) * | 2003-04-15 | 2007-08-28 | Luminus Devices, Inc. | Light emitting diode utilizing a physical pattern |
| US6831302B2 (en) * | 2003-04-15 | 2004-12-14 | Luminus Devices, Inc. | Light emitting devices with improved extraction efficiency |
| US7098589B2 (en) * | 2003-04-15 | 2006-08-29 | Luminus Devices, Inc. | Light emitting devices with high light collimation |
| US7166871B2 (en) * | 2003-04-15 | 2007-01-23 | Luminus Devices, Inc. | Light emitting systems |
| US7083993B2 (en) * | 2003-04-15 | 2006-08-01 | Luminus Devices, Inc. | Methods of making multi-layer light emitting devices |
| US7250635B2 (en) * | 2004-02-06 | 2007-07-31 | Dicon Fiberoptics, Inc. | Light emitting system with high extraction efficency |
| US20050173714A1 (en) * | 2004-02-06 | 2005-08-11 | Ho-Shang Lee | Lighting system with high and improved extraction efficiency |
| US7582910B2 (en) * | 2005-02-28 | 2009-09-01 | The Regents Of The University Of California | High efficiency light emitting diode (LED) with optimized photonic crystal extractor |
| US7442964B2 (en) | 2004-08-04 | 2008-10-28 | Philips Lumileds Lighting Company, Llc | Photonic crystal light emitting device with multiple lattices |
| JP2006059864A (ja) * | 2004-08-17 | 2006-03-02 | Yokohama National Univ | 発光素子 |
| US7509012B2 (en) * | 2004-09-22 | 2009-03-24 | Luxtaltek Corporation | Light emitting diode structures |
| JP4410123B2 (ja) | 2005-02-10 | 2010-02-03 | 株式会社東芝 | 有機elディスプレイ |
| JP2008311687A (ja) * | 2005-03-28 | 2008-12-25 | Stanley Electric Co Ltd | 自発光デバイス |
| KR100706796B1 (ko) * | 2005-08-19 | 2007-04-12 | 삼성전자주식회사 | 질화물계 탑에미트형 발광소자 및 그 제조 방법 |
| JP4843284B2 (ja) * | 2005-09-22 | 2011-12-21 | パナソニック電工株式会社 | 半導体発光素子およびその製造方法 |
| JP2007088273A (ja) * | 2005-09-22 | 2007-04-05 | Matsushita Electric Works Ltd | 半導体発光素子およびその製造方法 |
| US7717343B2 (en) * | 2006-01-12 | 2010-05-18 | Hand Held Products, Inc. | High-efficiency illumination in data collection devices |
| DE102006017573A1 (de) * | 2006-04-13 | 2007-10-18 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper und Verfahren zu dessen Herstellung |
| KR100736623B1 (ko) | 2006-05-08 | 2007-07-09 | 엘지전자 주식회사 | 수직형 발광 소자 및 그 제조방법 |
| WO2007148866A1 (en) | 2006-06-23 | 2007-12-27 | Lg Electronics Inc. | Light emitting diode having vertical topology and method of making the same |
| JP5168890B2 (ja) * | 2006-11-24 | 2013-03-27 | 日亜化学工業株式会社 | 半導体発光素子及び半導体発光素子の製造方法 |
| US8941566B2 (en) * | 2007-03-08 | 2015-01-27 | 3M Innovative Properties Company | Array of luminescent elements |
| JP5242975B2 (ja) * | 2007-09-03 | 2013-07-24 | 独立行政法人科学技術振興機構 | 回折格子型発光ダイオード |
| JP2009170508A (ja) * | 2008-01-11 | 2009-07-30 | Furukawa Electric Co Ltd:The | 面発光半導体レーザ及びその製造方法 |
| JP2011523212A (ja) * | 2008-06-05 | 2011-08-04 | スリーエム イノベイティブ プロパティズ カンパニー | 半導体波長変換器が接合された発光ダイオード |
| EP2308103A4 (de) * | 2008-06-26 | 2014-04-30 | 3M Innovative Properties Co | Lichtumwandlungskonstruktion |
| EP2308101A4 (de) * | 2008-06-26 | 2014-04-30 | 3M Innovative Properties Co | Halbleiter-lichtumwandlungskonstruktion |
| US8324000B2 (en) * | 2008-06-26 | 2012-12-04 | 3M Innovative Properties Company | Method of fabricating light extractor |
| US20110101402A1 (en) * | 2008-06-26 | 2011-05-05 | Jun-Ying Zhang | Semiconductor light converting construction |
| KR20100030472A (ko) * | 2008-09-10 | 2010-03-18 | 삼성전자주식회사 | 발광 소자 및 발광 장치의 제조 방법, 상기 방법을 이용하여 제조한 발광 소자 및 발광 장치 |
| EP2460191A2 (de) | 2009-07-30 | 2012-06-06 | 3M Innovative Properties Company | Gepixelte led |
| JP2011187616A (ja) * | 2010-03-08 | 2011-09-22 | Toshiba Corp | 半導体発光素子およびその製造方法 |
| DE102014110069A1 (de) * | 2014-07-17 | 2016-01-21 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen einer Strukturierungsmaske und einer Oberflächenstrukturierung |
| WO2017175201A2 (en) * | 2016-04-08 | 2017-10-12 | Novagan | Low etendue high brightness light emitting devices |
| FR3059788B1 (fr) | 2016-12-02 | 2019-01-25 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif optoelectronique a diode electroluminescente a extraction augmentee |
| FR3059787B1 (fr) * | 2016-12-02 | 2019-01-25 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif optoelectronique a diode electroluminescente a extraction augmentee |
| CN117316564B (zh) * | 2023-09-26 | 2025-04-04 | 南京大学 | 一种CoMnSi基磁致伸缩复合材料及其制备方法 |
| CN118352450A (zh) * | 2024-04-03 | 2024-07-16 | 江苏宜兴德融科技有限公司 | 一种红光led结构及其制备方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5405710A (en) | 1993-11-22 | 1995-04-11 | At&T Corp. | Article comprising microcavity light sources |
| US5955749A (en) * | 1996-12-02 | 1999-09-21 | Massachusetts Institute Of Technology | Light emitting device utilizing a periodic dielectric structure |
| DK1371120T3 (da) * | 2001-03-09 | 2013-07-22 | Alight Photonics Aps | Bølgetypekontrol ved anvendelse af transversal båndgabsstruktur i vcsels |
-
2001
- 2001-04-26 FR FR0105652A patent/FR2824228B1/fr not_active Expired - Fee Related
-
2002
- 2002-04-18 AT AT02726265T patent/ATE488027T1/de not_active IP Right Cessation
- 2002-04-18 DE DE60238245T patent/DE60238245D1/de not_active Expired - Lifetime
- 2002-04-18 AU AU2002256752A patent/AU2002256752A1/en not_active Abandoned
- 2002-04-18 CA CA2444338A patent/CA2444338C/fr not_active Expired - Fee Related
- 2002-04-18 JP JP2002586411A patent/JP4163004B2/ja not_active Expired - Fee Related
- 2002-04-18 WO PCT/FR2002/001341 patent/WO2002089218A2/fr not_active Ceased
- 2002-04-18 EP EP02726265A patent/EP1382074B1/de not_active Expired - Lifetime
-
2003
- 2003-10-21 US US10/689,784 patent/US6987288B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1382074B1 (de) | 2010-11-10 |
| FR2824228B1 (fr) | 2003-08-01 |
| US20040141333A1 (en) | 2004-07-22 |
| FR2824228A1 (fr) | 2002-10-31 |
| AU2002256752A1 (en) | 2002-11-11 |
| CA2444338C (fr) | 2012-10-30 |
| DE60238245D1 (de) | 2010-12-23 |
| CA2444338A1 (fr) | 2002-11-07 |
| US6987288B2 (en) | 2006-01-17 |
| JP2004521509A (ja) | 2004-07-15 |
| WO2002089218A3 (fr) | 2003-01-09 |
| JP4163004B2 (ja) | 2008-10-08 |
| WO2002089218A2 (fr) | 2002-11-07 |
| EP1382074A2 (de) | 2004-01-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |