ATE489412T1 - Neue phenolharze - Google Patents
Neue phenolharzeInfo
- Publication number
- ATE489412T1 ATE489412T1 AT04757370T AT04757370T ATE489412T1 AT E489412 T1 ATE489412 T1 AT E489412T1 AT 04757370 T AT04757370 T AT 04757370T AT 04757370 T AT04757370 T AT 04757370T AT E489412 T1 ATE489412 T1 AT E489412T1
- Authority
- AT
- Austria
- Prior art keywords
- phenolic resins
- hardeners
- new phenolic
- catalysts
- new
- Prior art date
Links
- 239000005011 phenolic resin Substances 0.000 title abstract 3
- 229920001568 phenolic resin Polymers 0.000 title abstract 3
- -1 aminonitroalcohols Chemical class 0.000 abstract 3
- 239000003054 catalyst Substances 0.000 abstract 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 2
- DKYBVKMIZODYKL-UHFFFAOYSA-N 1,3-diazinane Chemical class C1CNCNC1 DKYBVKMIZODYKL-UHFFFAOYSA-N 0.000 abstract 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical class O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000002131 composite material Substances 0.000 abstract 1
- 230000009970 fire resistant effect Effects 0.000 abstract 1
- 239000003063 flame retardant Substances 0.000 abstract 1
- 150000002443 hydroxylamines Chemical class 0.000 abstract 1
- 150000002466 imines Chemical class 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- SFDJOSRHYKHMOK-UHFFFAOYSA-N nitramide Chemical class N[N+]([O-])=O SFDJOSRHYKHMOK-UHFFFAOYSA-N 0.000 abstract 1
- 150000002917 oxazolidines Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/10—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Nitrogen And Oxygen As The Only Ring Hetero Atoms (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/830,808 US7317063B2 (en) | 2003-03-07 | 2004-04-23 | Phenolic resins |
| PCT/US2004/024470 WO2005108453A1 (en) | 2004-04-23 | 2004-07-28 | Novel phenolic resins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE489412T1 true ATE489412T1 (de) | 2010-12-15 |
Family
ID=35320192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04757370T ATE489412T1 (de) | 2004-04-23 | 2004-07-28 | Neue phenolharze |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7317063B2 (de) |
| EP (2) | EP1751199B1 (de) |
| JP (2) | JP2007533819A (de) |
| KR (2) | KR20070026467A (de) |
| CN (2) | CN1942495A (de) |
| AT (1) | ATE489412T1 (de) |
| DE (1) | DE602004030281D1 (de) |
| MX (2) | MXPA06012124A (de) |
| WO (2) | WO2005108454A1 (de) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7319131B2 (en) | 2003-03-07 | 2008-01-15 | Angus Chemical Company | Phenolic resins |
| US20040116647A1 (en) * | 2002-12-04 | 2004-06-17 | Swedo Raymond J. | Novel phenolic resins |
| US7595364B2 (en) | 2005-12-07 | 2009-09-29 | Univation Technologies, Llc | High density polyethylene |
| FR2921666B1 (fr) * | 2007-10-01 | 2012-11-09 | Saint Gobain Abrasives Inc | Composition resinique liquide pour articles abrasifs |
| EP2217632A4 (de) * | 2007-12-04 | 2013-11-27 | Saint Gobain Abrasives Inc | Auf alkanolaminmodifiziertem phenolharz basierende formulierung und beschichtungen für schleifprodukte |
| FR2930948B1 (fr) | 2008-05-06 | 2013-07-12 | Saint Gobain Abrasives Inc | Composition resinique liquide sans formaldehyde pour articles abrasifs |
| WO2009136920A1 (en) * | 2008-05-07 | 2009-11-12 | Henkel Corporation | Multifunctional nitrones in non-radical systems |
| GB0902863D0 (en) * | 2009-02-20 | 2009-04-08 | Bac2 Ltd | Improved polymer preparation |
| FR2956664B1 (fr) | 2010-02-19 | 2013-04-26 | L Aveyron Composite Atel | Nouveaux materiaux composites, leurs procedes de fabrication et leurs utilisations |
| BR112013014873B8 (pt) * | 2010-12-17 | 2019-08-06 | Angus Chemical | método para inibir o crescimento ou a propagação de microrganismos, exterminar microorganismos, desinfectar e/ou evitar o crescimento de novos microorganismos em um sistema aquoso ou contendo água, e, composto |
| AU2011341525B2 (en) * | 2010-12-17 | 2015-11-19 | Dow Global Technologies Llc | Protected antimicrobial compounds for high temperature applications |
| TWI448544B (zh) * | 2011-04-26 | 2014-08-11 | Ind Tech Res Inst | 耐燃劑與耐燃材料 |
| JP6206677B2 (ja) * | 2012-12-14 | 2017-10-04 | 日産化学工業株式会社 | カルボニル基含有ポリヒドロキシ芳香環ノボラック樹脂を含むレジスト下層膜形成組成物 |
| CN104673152B (zh) * | 2013-11-26 | 2019-07-23 | 罗门哈斯公司 | 脂族或脂环族二甲醛和间苯二酚的水性粘合剂组合物 |
| KR101648460B1 (ko) | 2015-02-24 | 2016-08-16 | 주식회사 나노코 | 단열재 바인더용 수지 조성물, 이를 이용한 단열재 바인더용 코폴리머 수지, 이를 포함하는 단열재용 바인더 수지 및 이를 포함하는 내수성이 우수한 친환경 단열재 |
| JP6736313B2 (ja) * | 2016-03-02 | 2020-08-05 | 群栄化学工業株式会社 | 鋳型造型用キットおよび鋳型造型用砂組成物の製造方法 |
| CN106397700B (zh) * | 2016-10-07 | 2018-07-17 | 河南工业大学 | 一种环三磷腈改性酚醛树脂的制备方法 |
| WO2020053818A1 (en) * | 2018-09-14 | 2020-03-19 | New Zealand Forest Research Institute Limited | Impregnated wood product |
| CN110498999B (zh) * | 2019-09-02 | 2022-09-09 | 福建天利高新材料有限公司 | 一种氮氧分离载体酚醛泡沫制品及其制备方法 |
| CN111410814B (zh) * | 2020-05-11 | 2021-08-24 | 武汉理工大学 | 一种低温固化酚醛树脂及其制备方法 |
| WO2022261956A1 (en) | 2021-06-18 | 2022-12-22 | Givaudan Sa | Fragrance compounds |
| CN118406201B (zh) * | 2024-06-26 | 2024-08-30 | 四川大学 | 一种单原子仿酶生物催化剂及其制备方法和应用 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3305413A (en) | 1967-02-21 | Solid propellant formulation based on hydroxylamine perchlorates | ||
| US2363466A (en) | 1942-05-07 | 1944-11-21 | Commercial Solvents Corp | Aminoalkanediols |
| US2415046A (en) | 1944-04-21 | 1947-01-28 | Commercial Solvents Corp | Acetals of nitro alcohols |
| US4250267A (en) | 1977-11-10 | 1981-02-10 | W. R. Grace & Co. | Immobilized biological material |
| JPH0651824B2 (ja) * | 1987-03-18 | 1994-07-06 | アイシン化工株式会社 | フエノ−ル樹脂結合剤 |
| JPH0222332A (ja) * | 1988-07-12 | 1990-01-25 | Nichigou Rubber Kako Kk | 繊維強化ゴム組成物の製造法 |
| JPH04127131A (ja) * | 1989-07-07 | 1992-04-28 | Sumitomo Electric Ind Ltd | 非線形光学活性ポリマーおよびその製造方法 |
| JPH0328243A (ja) * | 1989-10-18 | 1991-02-06 | Sumitomo Rubber Ind Ltd | 硬質ゴム組成物 |
| US5178646A (en) * | 1992-01-22 | 1993-01-12 | Minnesota Mining And Manufacturing Company | Coatable thermally curable binder presursor solutions modified with a reactive diluent, abrasive articles incorporating same, and methods of making said abrasive articles |
| US5296520A (en) * | 1992-12-09 | 1994-03-22 | Borden, Inc. | Latent acid curable compositions |
| JPH06192479A (ja) * | 1992-12-24 | 1994-07-12 | Bridgestone Corp | ゴム組成物及びそれを用いた空気入りタイヤ |
| US5605757A (en) * | 1994-01-27 | 1997-02-25 | Ppg Industries, Inc. | Glass fiber sizing compositions, sized glass fibers and methods of reinforcing polymeric materials using the same |
| US6150492A (en) * | 1994-02-04 | 2000-11-21 | Borden Chemical, Inc. | Cross-catalyzed phenol-resorcinol adhesive |
| SG41939A1 (en) | 1994-10-07 | 1997-08-15 | Shell Int Research | Epoxy resin composition for semiconductor encapsulation |
| US5686506A (en) * | 1995-04-04 | 1997-11-11 | Borden Chemical, Inc. | Mixtures of phenolic novolaks for use with refractory aggregate and methods for making same |
| AU700953B2 (en) | 1995-11-13 | 1999-01-14 | Borden Chemical, Inc. | Composition and method for curing a resorcinol resin |
| US5912317A (en) * | 1997-04-02 | 1999-06-15 | Angus Chemical Company | Oxazolidine-based hardeners for the room temperature cure of resorcinol resins in the bonding of wood articles--II |
| US5858553A (en) * | 1997-04-02 | 1999-01-12 | Angus Chemical Company | Oxazolidine-based hardeners for the room temperature cure of resorcinol resins in the bonding of wood articles |
| JPH10298404A (ja) * | 1997-04-25 | 1998-11-10 | Hitachi Chem Co Ltd | 成形材料用樹脂組成物及びこれを硬化させて得られる成形品 |
| WO2001048085A1 (fr) * | 1999-12-27 | 2001-07-05 | Kanebo, Limited | Composition ou compose de resine phenolique thermodurcissable, ou son composite de carbone |
| DE10101305A1 (de) | 2000-01-12 | 2001-08-30 | Yokohama Rubber Co Ltd | Latenthärter und feuchtigkeitshärtende Epoxyharzmasse |
| AU2001291198A1 (en) * | 2000-09-25 | 2002-04-08 | Stepan Company | Alkoxylated phosphate esters useful as secondary adhesion promoters, internal mold release agents and viscosity modifiers |
| US6559269B2 (en) | 2001-03-09 | 2003-05-06 | The Yokohama Rubber Co., Ltd. | Curable resin composition and novel latent curing agent |
| GB2382588A (en) * | 2001-11-28 | 2003-06-04 | Illinois Tool Works | Slideway lubricant with anti-microbial additive |
| JP2003252943A (ja) * | 2002-02-27 | 2003-09-10 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物及びその硬化物 |
| WO2004029119A1 (en) * | 2002-08-26 | 2004-04-08 | Shea Lawrence E | Non-formaldehyde reinforced thermoset plastic composites |
| US20040116647A1 (en) * | 2002-12-04 | 2004-06-17 | Swedo Raymond J. | Novel phenolic resins |
-
2004
- 2004-04-23 US US10/830,808 patent/US7317063B2/en not_active Expired - Fee Related
- 2004-07-28 CN CNA2004800428184A patent/CN1942495A/zh active Pending
- 2004-07-28 MX MXPA06012124A patent/MXPA06012124A/es active IP Right Grant
- 2004-07-28 KR KR1020067021962A patent/KR20070026467A/ko not_active Ceased
- 2004-07-28 DE DE602004030281T patent/DE602004030281D1/de not_active Expired - Lifetime
- 2004-07-28 JP JP2007509447A patent/JP2007533819A/ja active Pending
- 2004-07-28 WO PCT/US2004/024471 patent/WO2005108454A1/en not_active Ceased
- 2004-07-28 JP JP2007509448A patent/JP2007533820A/ja active Pending
- 2004-07-28 WO PCT/US2004/024470 patent/WO2005108453A1/en not_active Ceased
- 2004-07-28 CN CNA2004800428199A patent/CN1942496A/zh active Pending
- 2004-07-28 EP EP04757370A patent/EP1751199B1/de not_active Expired - Lifetime
- 2004-07-28 KR KR1020067021976A patent/KR20070026468A/ko not_active Ceased
- 2004-07-28 MX MXPA06012123A patent/MXPA06012123A/es unknown
- 2004-07-28 EP EP04821969A patent/EP1751200A1/de not_active Withdrawn
- 2004-07-28 AT AT04757370T patent/ATE489412T1/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1751199A1 (de) | 2007-02-14 |
| WO2005108453A1 (en) | 2005-11-17 |
| EP1751199B1 (de) | 2010-11-24 |
| CN1942495A (zh) | 2007-04-04 |
| KR20070026468A (ko) | 2007-03-08 |
| MXPA06012123A (es) | 2007-01-17 |
| CN1942496A (zh) | 2007-04-04 |
| DE602004030281D1 (de) | 2011-01-05 |
| EP1751200A1 (de) | 2007-02-14 |
| US7317063B2 (en) | 2008-01-08 |
| MXPA06012124A (es) | 2007-01-31 |
| JP2007533819A (ja) | 2007-11-22 |
| US20040198926A1 (en) | 2004-10-07 |
| JP2007533820A (ja) | 2007-11-22 |
| KR20070026467A (ko) | 2007-03-08 |
| WO2005108454A1 (en) | 2005-11-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |