ATE492051T1 - Schweissverfahren und struktur für leitfähiges endgerät - Google Patents

Schweissverfahren und struktur für leitfähiges endgerät

Info

Publication number
ATE492051T1
ATE492051T1 AT07117936T AT07117936T ATE492051T1 AT E492051 T1 ATE492051 T1 AT E492051T1 AT 07117936 T AT07117936 T AT 07117936T AT 07117936 T AT07117936 T AT 07117936T AT E492051 T1 ATE492051 T1 AT E492051T1
Authority
AT
Austria
Prior art keywords
conductive terminal
conductive
tip end
molded
projection
Prior art date
Application number
AT07117936T
Other languages
English (en)
Inventor
Akihiko Nishioka
Takeshi Yasuda
Original Assignee
Omron Automotive Electronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Automotive Electronics filed Critical Omron Automotive Electronics
Application granted granted Critical
Publication of ATE492051T1 publication Critical patent/ATE492051T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0214—Resistance welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
AT07117936T 2006-10-30 2007-10-05 Schweissverfahren und struktur für leitfähiges endgerät ATE492051T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006293682A JP4939899B2 (ja) 2006-10-30 2006-10-30 導電端子の溶接方法、および導電端子構造

Publications (1)

Publication Number Publication Date
ATE492051T1 true ATE492051T1 (de) 2011-01-15

Family

ID=38921703

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07117936T ATE492051T1 (de) 2006-10-30 2007-10-05 Schweissverfahren und struktur für leitfähiges endgerät

Country Status (6)

Country Link
US (1) US7858880B2 (de)
EP (1) EP1926185B1 (de)
JP (1) JP4939899B2 (de)
CN (1) CN100566024C (de)
AT (1) ATE492051T1 (de)
DE (1) DE602007011187D1 (de)

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JP2011062723A (ja) 2009-09-17 2011-03-31 Hitachi Automotive Systems Ltd 制御装置の端子と回路導体の溶接方法
JP5627303B2 (ja) * 2010-06-11 2014-11-19 矢崎総業株式会社 配索材の接合構造
CN102354891A (zh) * 2011-08-18 2012-02-15 无锡亿能电力设备有限公司 高压线圈接线柱焊接架
US10128720B2 (en) 2012-12-28 2018-11-13 Mitsuba Corporation Electric motor and electric pump
JP6302649B2 (ja) * 2013-01-11 2018-03-28 株式会社ミツバ 電動モータおよび電動ポンプ
JP6217226B2 (ja) * 2013-08-09 2017-10-25 日立金属株式会社 熱式質量流量計、質量流量制御装置、及び熱式質量流量計の製造方法
JP6065157B2 (ja) * 2014-04-17 2017-01-25 日本精工株式会社 抵抗溶接装置及び抵抗溶接方法並びにプロジェクション溶接のための突起の形状
JP2016049562A (ja) * 2014-09-02 2016-04-11 三菱マテリアル株式会社 抵抗溶接用タングステン電極材料
DE102014222597A1 (de) 2014-11-05 2016-05-12 Mahle International Gmbh Verfahren zum Herstellen einer Anordnung mit einem Gehäuseteil und wenigstens zwei Leiterbahnen
JP6978329B2 (ja) * 2018-01-11 2021-12-08 株式会社トーキン インダクタの製造方法

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Also Published As

Publication number Publication date
EP1926185B1 (de) 2010-12-15
CN101174735A (zh) 2008-05-07
US20080102716A1 (en) 2008-05-01
CN100566024C (zh) 2009-12-02
US7858880B2 (en) 2010-12-28
JP4939899B2 (ja) 2012-05-30
DE602007011187D1 (de) 2011-01-27
JP2008110357A (ja) 2008-05-15
EP1926185A1 (de) 2008-05-28

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