ATE495531T1 - Induktivität für integrierte schaltung und herstellungsverfahren - Google Patents
Induktivität für integrierte schaltung und herstellungsverfahrenInfo
- Publication number
- ATE495531T1 ATE495531T1 AT00982186T AT00982186T ATE495531T1 AT E495531 T1 ATE495531 T1 AT E495531T1 AT 00982186 T AT00982186 T AT 00982186T AT 00982186 T AT00982186 T AT 00982186T AT E495531 T1 ATE495531 T1 AT E495531T1
- Authority
- AT
- Austria
- Prior art keywords
- integrated circuit
- inductor
- row
- segments
- inductivity
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/20—Inductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/042—Printed circuit coils by thin film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/497—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W42/281—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials
- H10W42/287—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials materials for magnetic shielding, e.g. ferromagnetic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/501—Inductive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0046—Printed inductances with a conductive path having a bridge
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
- Coils Or Transformers For Communication (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Networks Using Active Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/444,608 US6452247B1 (en) | 1999-11-23 | 1999-11-23 | Inductor for integrated circuit |
| PCT/US2000/031984 WO2001039220A1 (en) | 1999-11-23 | 2000-11-21 | Inductor for integrated circuit and methods of manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE495531T1 true ATE495531T1 (de) | 2011-01-15 |
Family
ID=23765605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT00982186T ATE495531T1 (de) | 1999-11-23 | 2000-11-21 | Induktivität für integrierte schaltung und herstellungsverfahren |
Country Status (6)
| Country | Link |
|---|---|
| US (4) | US6452247B1 (de) |
| EP (1) | EP1234314B1 (de) |
| AT (1) | ATE495531T1 (de) |
| AU (1) | AU1924901A (de) |
| DE (1) | DE60045520D1 (de) |
| WO (1) | WO2001039220A1 (de) |
Families Citing this family (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6815220B2 (en) | 1999-11-23 | 2004-11-09 | Intel Corporation | Magnetic layer processing |
| US6891461B2 (en) | 1999-11-23 | 2005-05-10 | Intel Corporation | Integrated transformer |
| US6856228B2 (en) | 1999-11-23 | 2005-02-15 | Intel Corporation | Integrated inductor |
| US6870456B2 (en) | 1999-11-23 | 2005-03-22 | Intel Corporation | Integrated transformer |
| US6452247B1 (en) * | 1999-11-23 | 2002-09-17 | Intel Corporation | Inductor for integrated circuit |
| US6903617B2 (en) | 2000-05-25 | 2005-06-07 | Silicon Laboratories Inc. | Method and apparatus for synthesizing high-frequency signals for wireless communications |
| US6458611B1 (en) | 2001-03-07 | 2002-10-01 | Intel Corporation | Integrated circuit device characterization |
| JP4215495B2 (ja) * | 2002-01-10 | 2009-01-28 | 三洋電機株式会社 | 配線構造およびその製造方法ならびに配線構造を備えた半導体装置と配線基板 |
| US6734074B2 (en) * | 2002-01-24 | 2004-05-11 | Industrial Technology Research Institute | Micro fabrication with vortex shaped spirally topographically tapered spirally patterned conductor layer and method for fabrication thereof |
| US6853079B1 (en) * | 2002-08-15 | 2005-02-08 | National Semiconductor Corporation | Conductive trace with reduced RF impedance resulting from the skin effect |
| US7852185B2 (en) * | 2003-05-05 | 2010-12-14 | Intel Corporation | On-die micro-transformer structures with magnetic materials |
| US7202648B2 (en) * | 2003-05-05 | 2007-04-10 | Intel Corporation | Fully integrated DC-to-DC regulator utilizing on-chip inductors with high frequency magnetic materials |
| TWI226647B (en) * | 2003-06-11 | 2005-01-11 | Via Tech Inc | Inductor formed between two layout layers |
| US7061359B2 (en) * | 2003-06-30 | 2006-06-13 | International Business Machines Corporation | On-chip inductor with magnetic core |
| DE10354760A1 (de) * | 2003-11-21 | 2005-06-23 | Enthone Inc., West Haven | Verfahren zur Abscheidung von Nickel und Chrom(VI)freien metallischen Mattschichten |
| US7209026B2 (en) * | 2004-09-01 | 2007-04-24 | Intel Corporation | Integrated package inductor for integrated circuit devices |
| KR100768919B1 (ko) * | 2004-12-23 | 2007-10-19 | 삼성전자주식회사 | 전원 생성 장치 |
| US7564954B2 (en) * | 2005-02-07 | 2009-07-21 | Adomo, Inc. | Form-based user interface for controlling messaging |
| US7482792B2 (en) * | 2005-06-14 | 2009-01-27 | Intel Corporation | IC with fully integrated DC-to-DC power converter |
| US8134548B2 (en) | 2005-06-30 | 2012-03-13 | Micron Technology, Inc. | DC-DC converter switching transistor current measurement technique |
| US7410894B2 (en) * | 2005-07-27 | 2008-08-12 | International Business Machines Corporation | Post last wiring level inductor using patterned plate process |
| US7598630B2 (en) * | 2005-07-29 | 2009-10-06 | Intel Corporation | IC with on-die power-gating circuit |
| US7705421B1 (en) * | 2005-11-18 | 2010-04-27 | National Semiconductor Corporation | Semiconductor die with an integrated inductor |
| KR100818994B1 (ko) | 2006-01-24 | 2008-04-02 | 삼성전자주식회사 | 반도체 소자의 제조 방법 |
| TWI302027B (en) * | 2006-03-17 | 2008-10-11 | Ind Tech Res Inst | A wafer level packaging structure with inductors and manufacture method thereof |
| US7636242B2 (en) * | 2006-06-29 | 2009-12-22 | Intel Corporation | Integrated inductor |
| US8368501B2 (en) * | 2006-06-29 | 2013-02-05 | Intel Corporation | Integrated inductors |
| US7949887B2 (en) | 2006-11-01 | 2011-05-24 | Intel Corporation | Independent power control of processing cores |
| US8397090B2 (en) * | 2006-12-08 | 2013-03-12 | Intel Corporation | Operating integrated circuit logic blocks at independent voltages with single voltage supply |
| EP2104378B2 (de) * | 2008-02-19 | 2017-05-10 | Starkey Laboratories, Inc. | Funkbakensystem zur Identifizierung der akustischen Umgebung für Hörgeräte |
| US9999129B2 (en) | 2009-11-12 | 2018-06-12 | Intel Corporation | Microelectronic device and method of manufacturing same |
| US10111333B2 (en) * | 2010-03-16 | 2018-10-23 | Intersil Americas Inc. | Molded power-supply module with bridge inductor over other components |
| US9723766B2 (en) | 2010-09-10 | 2017-08-01 | Intersil Americas LLC | Power supply module with electromagnetic-interference (EMI) shielding, cooling, or both shielding and cooling, along two or more sides |
| US8338913B2 (en) | 2010-11-10 | 2012-12-25 | National Semiconductor Corporation | Semiconductor inductor with a serpentine shaped conductive wire interlaced with a serpentine shaped ferromagnetic core |
| JP2012186440A (ja) * | 2011-02-18 | 2012-09-27 | Ibiden Co Ltd | インダクタ部品とその部品を内蔵しているプリント配線板及びインダクタ部品の製造方法 |
| US8314676B1 (en) * | 2011-05-02 | 2012-11-20 | National Semiconductor Corporation | Method of making a controlled seam laminated magnetic core for high frequency on-chip power inductors |
| US8450830B2 (en) * | 2011-09-12 | 2013-05-28 | National Semiconductor Corporation | Forming a ferromagnetic alloy core for high frequency micro fabricated inductors and transformers |
| US8686522B2 (en) | 2011-10-13 | 2014-04-01 | International Business Machines Corporation | Semiconductor trench inductors and transformers |
| US8900964B2 (en) * | 2012-02-07 | 2014-12-02 | International Business Machines Corporation | Inductors and wiring structures fabricated with limited wiring material |
| US9258907B2 (en) | 2012-08-09 | 2016-02-09 | Lockheed Martin Corporation | Conformal 3D non-planar multi-layer circuitry |
| US9124173B2 (en) | 2012-08-20 | 2015-09-01 | International Business Machines Corporation | Slab inductor device providing efficient on-chip supply voltage conversion and regulation |
| US8803283B2 (en) | 2012-09-27 | 2014-08-12 | Intel Corporation | Vertical meander inductor for small core voltage regulators |
| US8704576B1 (en) | 2013-02-05 | 2014-04-22 | International Business Machines Corporation | Variable resistance switch for wide bandwidth resonant global clock distribution |
| US9054682B2 (en) | 2013-02-05 | 2015-06-09 | International Business Machines Corporation | Wide bandwidth resonant global clock distribution |
| US9058130B2 (en) | 2013-02-05 | 2015-06-16 | International Business Machines Corporation | Tunable sector buffer for wide bandwidth resonant global clock distribution |
| US8772745B1 (en) | 2013-03-14 | 2014-07-08 | Lockheed Martin Corporation | X-ray obscuration film and related techniques |
| US10123410B2 (en) * | 2014-10-10 | 2018-11-06 | Lockheed Martin Corporation | Fine line 3D non-planar conforming circuit |
| US20230197644A1 (en) * | 2021-12-17 | 2023-06-22 | Intel Corporation | Semiconductor Package, Semiconductor Die and Method for Forming a Semiconductor Package or a Semiconductor Die |
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| JP3779406B2 (ja) | 1996-11-20 | 2006-05-31 | 松下電器産業株式会社 | 画像処理装置および画像処理方法 |
| KR100243658B1 (ko) * | 1996-12-06 | 2000-02-01 | 정선종 | 기판 변환기술을 이용한 인덕터 소자 및 그 제조 방법 |
| US5801100A (en) | 1997-03-07 | 1998-09-01 | Industrial Technology Research Institute | Electroless copper plating method for forming integrated circuit structures |
| US5892425A (en) * | 1997-04-10 | 1999-04-06 | Virginia Tech Intellectual Properties, Inc. | Interwound center-tapped spiral inductor |
| US6040226A (en) | 1997-05-27 | 2000-03-21 | General Electric Company | Method for fabricating a thin film inductor |
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| JP3600415B2 (ja) * | 1997-07-15 | 2004-12-15 | 株式会社東芝 | 分布定数素子 |
| EP0941545B1 (de) | 1997-08-05 | 2006-01-11 | Koninklijke Philips Electronics N.V. | Verfahren zur herstellung mehrerer elektronischer bauteile |
| FR2771843B1 (fr) * | 1997-11-28 | 2000-02-11 | Sgs Thomson Microelectronics | Transformateur en circuit integre |
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| US6166422A (en) * | 1998-05-13 | 2000-12-26 | Lsi Logic Corporation | Inductor with cobalt/nickel core for integrated circuit structure with high inductance and high Q-factor |
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| US6566731B2 (en) * | 1999-02-26 | 2003-05-20 | Micron Technology, Inc. | Open pattern inductor |
| US6037649A (en) * | 1999-04-01 | 2000-03-14 | Winbond Electronics Corp. | Three-dimension inductor structure in integrated circuit technology |
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| US6291305B1 (en) * | 1999-06-11 | 2001-09-18 | S3 Graphics Co., Ltd. | Method for implementing resistance, capacitance and/or inductance in an integrated circuit |
| US6239482B1 (en) * | 1999-06-21 | 2001-05-29 | General Electric Company | Integrated circuit package including window frame |
| US6452247B1 (en) | 1999-11-23 | 2002-09-17 | Intel Corporation | Inductor for integrated circuit |
| US6344125B1 (en) * | 2000-04-06 | 2002-02-05 | International Business Machines Corporation | Pattern-sensitive electrolytic metal plating |
-
1999
- 1999-11-23 US US09/444,608 patent/US6452247B1/en not_active Expired - Lifetime
-
2000
- 2000-11-21 WO PCT/US2000/031984 patent/WO2001039220A1/en not_active Ceased
- 2000-11-21 AT AT00982186T patent/ATE495531T1/de not_active IP Right Cessation
- 2000-11-21 AU AU19249/01A patent/AU1924901A/en not_active Abandoned
- 2000-11-21 DE DE60045520T patent/DE60045520D1/de not_active Expired - Lifetime
- 2000-11-21 EP EP00982186A patent/EP1234314B1/de not_active Expired - Lifetime
-
2002
- 2002-09-10 US US10/238,539 patent/US6727154B2/en not_active Expired - Lifetime
-
2004
- 2004-02-09 US US10/774,956 patent/US7087976B2/en not_active Expired - Fee Related
-
2006
- 2006-03-27 US US11/390,020 patent/US7327010B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20030006474A1 (en) | 2003-01-09 |
| US20040157370A1 (en) | 2004-08-12 |
| US6727154B2 (en) | 2004-04-27 |
| US7087976B2 (en) | 2006-08-08 |
| US7327010B2 (en) | 2008-02-05 |
| US6452247B1 (en) | 2002-09-17 |
| WO2001039220A9 (en) | 2002-08-15 |
| AU1924901A (en) | 2001-06-04 |
| EP1234314A1 (de) | 2002-08-28 |
| US20060163695A1 (en) | 2006-07-27 |
| EP1234314B1 (de) | 2011-01-12 |
| DE60045520D1 (de) | 2011-02-24 |
| WO2001039220A1 (en) | 2001-05-31 |
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