ATE498476T1 - Verfahren und vorrichtung zur materialverarbeitung - Google Patents

Verfahren und vorrichtung zur materialverarbeitung

Info

Publication number
ATE498476T1
ATE498476T1 AT04757620T AT04757620T ATE498476T1 AT E498476 T1 ATE498476 T1 AT E498476T1 AT 04757620 T AT04757620 T AT 04757620T AT 04757620 T AT04757620 T AT 04757620T AT E498476 T1 ATE498476 T1 AT E498476T1
Authority
AT
Austria
Prior art keywords
laser
base unit
coupled
interaction region
head
Prior art date
Application number
AT04757620T
Other languages
English (en)
Inventor
Paul Denney
Jay Eastman
Paul Fallara
Andrew Joseph
John Phillips
Ta-Chieh Huang
Michael Patena
Tim Burnham
Paul Coleman
Original Assignee
Univ Loma Linda Med
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Loma Linda Med filed Critical Univ Loma Linda Med
Application granted granted Critical
Publication of ATE498476T1 publication Critical patent/ATE498476T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure in an enclosure
    • B23K26/128—Laser beam path enclosures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Working Measures On Existing Buildindgs (AREA)
  • Processing Of Solid Wastes (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Forging (AREA)
  • Laser Surgery Devices (AREA)
AT04757620T 2003-03-18 2004-03-18 Verfahren und vorrichtung zur materialverarbeitung ATE498476T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US45604303P 2003-03-18 2003-03-18
US47105703P 2003-05-16 2003-05-16
US49646003P 2003-08-20 2003-08-20
US10/690,983 US7060932B2 (en) 2003-03-18 2003-10-22 Method and apparatus for material processing
PCT/US2004/008312 WO2004084423A2 (en) 2003-03-18 2004-03-18 Method and apparatus for material processing

Publications (1)

Publication Number Publication Date
ATE498476T1 true ATE498476T1 (de) 2011-03-15

Family

ID=32996384

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04757620T ATE498476T1 (de) 2003-03-18 2004-03-18 Verfahren und vorrichtung zur materialverarbeitung

Country Status (9)

Country Link
US (5) US7060932B2 (de)
EP (1) EP1616390B1 (de)
JP (1) JP2007524510A (de)
KR (1) KR101061228B1 (de)
AT (1) ATE498476T1 (de)
AU (1) AU2004221095B2 (de)
CA (1) CA2519544C (de)
DE (1) DE602004031412D1 (de)
WO (1) WO2004084423A2 (de)

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EP1616390B1 (de) 2011-02-16
US20040182840A1 (en) 2004-09-23
US7620085B2 (en) 2009-11-17
US20100078415A1 (en) 2010-04-01
US20070189347A1 (en) 2007-08-16
WO2004084423A3 (en) 2005-04-07
CA2519544C (en) 2012-07-17
US7180920B2 (en) 2007-02-20
EP1616390A2 (de) 2006-01-18
AU2004221095A1 (en) 2004-09-30
KR101061228B1 (ko) 2011-09-01
US7060932B2 (en) 2006-06-13
JP2007524510A (ja) 2007-08-30
US8306079B2 (en) 2012-11-06
WO2004084423A2 (en) 2004-09-30
KR20060013489A (ko) 2006-02-10
US7880114B2 (en) 2011-02-01
CA2519544A1 (en) 2004-09-30
US20060278620A1 (en) 2006-12-14
AU2004221095B2 (en) 2010-03-18
DE602004031412D1 (de) 2011-03-31

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