ATE498908T1 - Verfahren zur herstellung einer halbleitervorrichtung mit einem leiterrahmen und vorrichtung hierzu - Google Patents

Verfahren zur herstellung einer halbleitervorrichtung mit einem leiterrahmen und vorrichtung hierzu

Info

Publication number
ATE498908T1
ATE498908T1 AT04736788T AT04736788T ATE498908T1 AT E498908 T1 ATE498908 T1 AT E498908T1 AT 04736788 T AT04736788 T AT 04736788T AT 04736788 T AT04736788 T AT 04736788T AT E498908 T1 ATE498908 T1 AT E498908T1
Authority
AT
Austria
Prior art keywords
conductor
semiconductor device
producing
conductor frame
therefor
Prior art date
Application number
AT04736788T
Other languages
English (en)
Inventor
Paulus Hesen
De Water Peter Van
Cornelis Schriks
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE498908T1 publication Critical patent/ATE498908T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Ladders (AREA)
  • Wire Bonding (AREA)
AT04736788T 2003-06-18 2004-06-14 Verfahren zur herstellung einer halbleitervorrichtung mit einem leiterrahmen und vorrichtung hierzu ATE498908T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP03101790 2003-06-18
PCT/IB2004/050896 WO2004112132A1 (en) 2003-06-18 2004-06-14 Lead frame, semiconductor device comprising the lead frame and method of manufacturing a semiconductor device with the leadframe

Publications (1)

Publication Number Publication Date
ATE498908T1 true ATE498908T1 (de) 2011-03-15

Family

ID=33547739

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04736788T ATE498908T1 (de) 2003-06-18 2004-06-14 Verfahren zur herstellung einer halbleitervorrichtung mit einem leiterrahmen und vorrichtung hierzu

Country Status (8)

Country Link
US (1) US20060157829A1 (de)
EP (1) EP1639641B1 (de)
JP (1) JP2006527916A (de)
KR (1) KR20060025558A (de)
CN (1) CN1806328B (de)
AT (1) ATE498908T1 (de)
DE (1) DE602004031422D1 (de)
WO (1) WO2004112132A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5111089B2 (ja) * 2007-12-17 2012-12-26 三洋電機株式会社 固体電解コンデンサの製造方法
US7776658B2 (en) * 2008-08-07 2010-08-17 Alpha And Omega Semiconductor, Inc. Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates
KR20240125955A (ko) * 2021-12-17 2024-08-20 비쉐이 실리코닉스, 엘엘씨 반도체 디바이스 및 반도체 디바이스의 부품을 형성하는 방법
CN115255214B (zh) * 2022-09-14 2025-03-18 柏兆(吉安)电子有限责任公司 一种dip器件引脚切割装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3736367A (en) * 1971-04-09 1973-05-29 Amp Inc Lead frames and method of making same
US4252864A (en) * 1979-11-05 1981-02-24 Amp Incorporated Lead frame having integral terminal tabs
JPH0493055A (ja) 1990-08-08 1992-03-25 Nec Corp ２端子型半導体装置
US5225897A (en) * 1991-10-02 1993-07-06 Unitrode Corporation Molded package for semiconductor devices with leadframe locking structure
US6005287A (en) * 1995-11-24 1999-12-21 Nec Corporation Semiconductor device, and lead frame used therefor
FR2745954B1 (fr) 1996-03-06 1999-10-22 Itt Composants Instr Bande metallique predecoupee pour la fabrication de composants electroniques, procede de fabrication de tels composants ainsi obtenus
JP2001244292A (ja) * 2000-03-01 2001-09-07 Mitsubishi Electric Corp 半導体装置のワイヤボンデイング装置およびワイヤボンデイング方法
JP3883784B2 (ja) * 2000-05-24 2007-02-21 三洋電機株式会社 板状体および半導体装置の製造方法

Also Published As

Publication number Publication date
CN1806328B (zh) 2010-07-28
EP1639641B1 (de) 2011-02-16
WO2004112132A1 (en) 2004-12-23
US20060157829A1 (en) 2006-07-20
DE602004031422D1 (de) 2011-03-31
EP1639641A1 (de) 2006-03-29
CN1806328A (zh) 2006-07-19
JP2006527916A (ja) 2006-12-07
KR20060025558A (ko) 2006-03-21

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Legal Events

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