ATE511096T1 - Verfahren zur herstellung einer unverlierbaren leitungsgebundenen prüfeinrichtung - Google Patents

Verfahren zur herstellung einer unverlierbaren leitungsgebundenen prüfeinrichtung

Info

Publication number
ATE511096T1
ATE511096T1 AT03253864T AT03253864T ATE511096T1 AT E511096 T1 ATE511096 T1 AT E511096T1 AT 03253864 T AT03253864 T AT 03253864T AT 03253864 T AT03253864 T AT 03253864T AT E511096 T1 ATE511096 T1 AT E511096T1
Authority
AT
Austria
Prior art keywords
locations
fixture
plate
hole
wired
Prior art date
Application number
AT03253864T
Other languages
English (en)
Inventor
Gregory Miczek
Onge Gary St
Thomas Newhall
David P Rogers
Original Assignee
Capital Formation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Capital Formation Inc filed Critical Capital Formation Inc
Application granted granted Critical
Publication of ATE511096T1 publication Critical patent/ATE511096T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/532—Conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/532—Conductor
    • Y10T29/53209—Terminal or connector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/532—Conductor
    • Y10T29/53209—Terminal or connector
    • Y10T29/53213—Assembled to wire-type conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Multi-Conductor Connections (AREA)
  • Installation Of Indoor Wiring (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
AT03253864T 2002-06-24 2003-06-18 Verfahren zur herstellung einer unverlierbaren leitungsgebundenen prüfeinrichtung ATE511096T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US39109702P 2002-06-24 2002-06-24

Publications (1)

Publication Number Publication Date
ATE511096T1 true ATE511096T1 (de) 2011-06-15

Family

ID=29718065

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03253864T ATE511096T1 (de) 2002-06-24 2003-06-18 Verfahren zur herstellung einer unverlierbaren leitungsgebundenen prüfeinrichtung

Country Status (8)

Country Link
US (3) US7059046B2 (de)
EP (1) EP1376141B1 (de)
JP (1) JP4098676B2 (de)
CN (1) CN1320369C (de)
AT (1) ATE511096T1 (de)
MY (1) MY134274A (de)
SG (1) SG102716A1 (de)
TW (1) TWI223098B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7059046B2 (en) * 2002-06-24 2006-06-13 Delaware Capital Formation, Inc. Method for producing a captive wired test fixture and fixture therefor
US8181906B2 (en) * 2009-04-02 2012-05-22 Raytheon Company Method and apparatus for ram deceleration in a launch system
US8648616B2 (en) * 2009-12-22 2014-02-11 Ltx-Credence Corporation Loaded printed circuit board test fixture and method for manufacturing the same
TWI426366B (zh) * 2011-01-17 2014-02-11 Hon Hai Prec Ind Co Ltd 測試點自動查找與優化系統及方法
US9658252B2 (en) * 2011-02-21 2017-05-23 United Microelectronics Corp. Probe insertion auxiliary and method of probe insertion
US9182425B2 (en) 2012-05-21 2015-11-10 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Probe supporting and aligning apparatus
CN102768293B (zh) * 2012-07-24 2015-03-25 上海交通大学 一种有机电致发光器件测量夹具
CN107564829B (zh) * 2017-08-24 2020-09-04 北京智芯微电子科技有限公司 用于tsv封装芯片的内部信号量测的方法
CN110429401A (zh) * 2019-08-07 2019-11-08 广东电网有限责任公司 一种可调节线夹
CN111286846B (zh) * 2020-04-15 2021-04-16 扬州市郭氏精密机械制造有限公司 一种织布用纱夹

Family Cites Families (37)

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JPS57101769A (en) 1980-10-30 1982-06-24 Everett Charles Inc Translation apparatus and test mount apparatus and manufacture of translation apparatus
US4353536A (en) * 1981-02-04 1982-10-12 Peter Mazzotta Miter clamp
US4423376A (en) * 1981-03-20 1983-12-27 International Business Machines Corporation Contact probe assembly having rotatable contacting probe elements
US4788496A (en) * 1982-11-05 1988-11-29 Martin Maelzer Adapter for a printed circuit board testing device
US4535536A (en) * 1983-11-03 1985-08-20 Augat Inc. Method of assembling adaptor for automatic testing equipment
US4774462A (en) * 1984-06-11 1988-09-27 Black Thomas J Automatic test system
US4622514A (en) * 1984-06-15 1986-11-11 Ibm Multiple mode buckling beam probe assembly
EP0233992B1 (de) * 1985-11-01 1991-04-17 Hewlett-Packard Company Halterung für Leiterplattentest
DE3539720A1 (de) * 1985-11-08 1987-05-14 Martin Maelzer Adapter fuer ein leiterplattenpruefgeraet
DE3882563D1 (de) * 1987-03-31 1993-09-02 Siemens Ag Vorrichtung fuer die elektrische funktionspruefung von verdrahtungsfeldern, insbesondere von leiterplatten.
US4935696A (en) * 1987-04-16 1990-06-19 Teradyne, Inc. Test pin assembly for circuit board tester
US4963822A (en) * 1988-06-01 1990-10-16 Manfred Prokopp Method of testing circuit boards and the like
US4904935A (en) * 1988-11-14 1990-02-27 Eaton Corporation Electrical circuit board text fixture having movable platens
US4977370A (en) * 1988-12-06 1990-12-11 Genrad, Inc. Apparatus and method for circuit board testing
US5399982A (en) * 1989-11-13 1995-03-21 Mania Gmbh & Co. Printed circuit board testing device with foil adapter
JPH0675415B2 (ja) * 1991-03-15 1994-09-21 山一電機株式会社 リードレス形ｉｃパッケージ用接続器
DE4337500A1 (de) 1993-11-03 1995-05-04 Test Plus Electronic Gmbh Zweiteilige Adaptereinrichtung
US5442299A (en) * 1994-01-06 1995-08-15 International Business Machines Corporation Printed circuit board test fixture and method
US5493230A (en) * 1994-02-25 1996-02-20 Everett Charles Technologies, Inc. Retention of test probes in translator fixtures
US5729146A (en) * 1995-09-21 1998-03-17 Everett Charles Technologies, Inc. Quick stacking translator fixture
IT1282689B1 (it) * 1996-02-26 1998-03-31 Circuit Line Spa Dispositivo di conversione della griglia di punti di test di una macchina per il test elettrico di circuiti stampati non montati
US5818248A (en) * 1996-07-29 1998-10-06 Delaware Capital Formation, Inc Loaded board test fixture with integral translator fixture for testing closely spaced test sites
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JPH09281139A (ja) * 1996-09-13 1997-10-31 Furukawa Electric Co Ltd:The プローバーの製造方法
US6407565B1 (en) * 1996-10-29 2002-06-18 Agilent Technologies, Inc. Loaded-board, guided-probe test fixture
US5945836A (en) * 1996-10-29 1999-08-31 Hewlett-Packard Company Loaded-board, guided-probe test fixture
US5773988A (en) * 1996-10-29 1998-06-30 Hewlett-Packard Company Standard- and limited-access hybrid test fixture
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US7059046B2 (en) * 2002-06-24 2006-06-13 Delaware Capital Formation, Inc. Method for producing a captive wired test fixture and fixture therefor

Also Published As

Publication number Publication date
CN1472540A (zh) 2004-02-04
EP1376141A1 (de) 2004-01-02
JP2004029024A (ja) 2004-01-29
TWI223098B (en) 2004-11-01
US20060143909A1 (en) 2006-07-06
SG102716A1 (en) 2004-03-26
US20060151444A1 (en) 2006-07-13
US20030234640A1 (en) 2003-12-25
EP1376141B1 (de) 2011-05-25
JP4098676B2 (ja) 2008-06-11
US7424775B2 (en) 2008-09-16
US7059046B2 (en) 2006-06-13
TW200401900A (en) 2004-02-01
CN1320369C (zh) 2007-06-06
MY134274A (en) 2007-11-30

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