ATE504069T1 - Hochleistungswiderstand mit verbessertem betriebstemperaturbereich und herstellungsverfahren dafür - Google Patents

Hochleistungswiderstand mit verbessertem betriebstemperaturbereich und herstellungsverfahren dafür

Info

Publication number
ATE504069T1
ATE504069T1 AT04785520T AT04785520T ATE504069T1 AT E504069 T1 ATE504069 T1 AT E504069T1 AT 04785520 T AT04785520 T AT 04785520T AT 04785520 T AT04785520 T AT 04785520T AT E504069 T1 ATE504069 T1 AT E504069T1
Authority
AT
Austria
Prior art keywords
resistance element
manufacturing process
temperature range
high performance
operating temperature
Prior art date
Application number
AT04785520T
Other languages
English (en)
Inventor
Greg Schneekloth
Nathan Welk
Brandon Traudt
Joel Smejkal
Ronald Miksch
Steve Hendricks
David Lange
Original Assignee
Vishay Dale Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vishay Dale Electronics Inc filed Critical Vishay Dale Electronics Inc
Application granted granted Critical
Publication of ATE504069T1 publication Critical patent/ATE504069T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/08Cooling, heating or ventilating arrangements
    • H01C1/084Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/06Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • Y10T29/49083Heater type
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • Y10T29/49085Thermally variable
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • Y10T29/49087Resistor making with envelope or housing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • Y10T29/49099Coating resistive material on a base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49121Beam lead frame or beam lead device
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49162Manufacturing circuit on or in base by using wire as conductive path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Details Of Resistors (AREA)
  • Thermistors And Varistors (AREA)
  • Resistance Heating (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
AT04785520T 2003-05-20 2004-05-11 Hochleistungswiderstand mit verbessertem betriebstemperaturbereich und herstellungsverfahren dafür ATE504069T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/441,649 US7102484B2 (en) 2003-05-20 2003-05-20 High power resistor having an improved operating temperature range
PCT/US2004/014569 WO2004105059A1 (en) 2003-05-20 2004-05-11 High power resistor having an improved operating temperature range and method for making same

Publications (1)

Publication Number Publication Date
ATE504069T1 true ATE504069T1 (de) 2011-04-15

Family

ID=33450038

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04785520T ATE504069T1 (de) 2003-05-20 2004-05-11 Hochleistungswiderstand mit verbessertem betriebstemperaturbereich und herstellungsverfahren dafür

Country Status (7)

Country Link
US (3) US7102484B2 (de)
EP (2) EP2228807B1 (de)
JP (1) JP4390806B2 (de)
CN (2) CN100583315C (de)
AT (1) ATE504069T1 (de)
DE (1) DE602004032019D1 (de)
WO (1) WO2004105059A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7190252B2 (en) * 2005-02-25 2007-03-13 Vishay Dale Electronics, Inc. Surface mount electrical resistor with thermally conductive, electrically insulative filler and method for using same
DE102006033710B4 (de) * 2006-07-20 2013-04-11 Epcos Ag Verfahren zur Herstellung einer Widerstandsanordnung
US7948355B2 (en) * 2007-05-24 2011-05-24 Industrial Technology Research Institute Embedded resistor devices
US7843309B2 (en) * 2007-09-27 2010-11-30 Vishay Dale Electronics, Inc. Power resistor
WO2009041974A1 (en) * 2007-09-27 2009-04-02 Vishay Dale Electronics, Inc. Power resistor
CN103093908B (zh) * 2007-09-27 2017-04-26 韦沙戴尔电子公司 功率电阻器
US8248202B2 (en) * 2009-03-19 2012-08-21 Vishay Dale Electronics, Inc. Metal strip resistor for mitigating effects of thermal EMF
US8325007B2 (en) * 2009-12-28 2012-12-04 Vishay Dale Electronics, Inc. Surface mount resistor with terminals for high-power dissipation and method for making same
DE102010030317B4 (de) * 2010-06-21 2016-09-01 Infineon Technologies Ag Schaltungsanordnung mit Shuntwiderstand
CN102097193B (zh) * 2010-12-17 2012-07-04 江苏浩峰汽车附件有限公司 蚀刻电阻的生产方法
JP6038439B2 (ja) * 2011-10-14 2016-12-07 ローム株式会社 チップ抵抗器、チップ抵抗器の実装構造
TWI428940B (zh) * 2011-11-15 2014-03-01 Ta I Technology Co Ltd 電流感應電阻及其製造方法
EP2602798B1 (de) * 2011-12-05 2020-01-22 Isabellenhütte Heusler GmbH & Co.KG Strommesswiderstand
US8823483B2 (en) 2012-12-21 2014-09-02 Vishay Dale Electronics, Inc. Power resistor with integrated heat spreader
US10319501B2 (en) * 2014-02-27 2019-06-11 Panasonic Intellectual Property Management Co., Ltd. Chip resistor
CN105590712A (zh) * 2014-11-15 2016-05-18 旺诠股份有限公司 微阻抗电阻的制作方法及微阻抗电阻
US10083781B2 (en) 2015-10-30 2018-09-25 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation
CN110666040A (zh) * 2019-09-17 2020-01-10 中国航空制造技术研究院 一种热拉弯模具及钛合金型材的拉弯成形方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3541489A (en) 1968-12-26 1970-11-17 Dale Electronics Resistor
US3525065A (en) 1969-02-03 1970-08-18 Dale Electronics Heat dissipating resistor
US3649944A (en) * 1970-05-25 1972-03-14 Richard E Caddock Film-type power resistor
US3955169A (en) 1974-11-08 1976-05-04 The United States Of America As Represented By The Secretary Of The Air Force High power resistor
US4064477A (en) * 1975-08-25 1977-12-20 American Components Inc. Metal foil resistor
US4196411A (en) * 1978-06-26 1980-04-01 Gentron Corporation Dual resistor element
US4455744A (en) * 1979-09-04 1984-06-26 Vishay Intertechnology, Inc. Method of making a precision resistor with improved temperature characteristics
US4529958A (en) * 1983-05-02 1985-07-16 Dale Electronics, Inc. Electrical resistor
US4719443A (en) 1986-04-03 1988-01-12 General Electric Company Low capacitance power resistor using beryllia dielectric heat sink layer and low toxicity method for its manufacture
US4829553A (en) * 1988-01-19 1989-05-09 Matsushita Electric Industrial Co., Ltd. Chip type component
US5179366A (en) * 1991-06-24 1993-01-12 Motorola, Inc. End terminated high power chip resistor assembly
US5304977A (en) * 1991-09-12 1994-04-19 Caddock Electronics, Inc. Film-type power resistor combination with anchored exposed substrate/heatsink
US5287083A (en) * 1992-03-30 1994-02-15 Dale Electronics, Inc. Bulk metal chip resistor
JP2899180B2 (ja) 1992-09-01 1999-06-02 キヤノン株式会社 像加熱装置及び像加熱用ヒーター
US5291175A (en) * 1992-09-28 1994-03-01 Ohmite Manufacturing Co. Limiting heat flow in planar, high-density power resistors
DE4234022C2 (de) * 1992-10-09 1995-05-24 Telefunken Microelectron Schichtschaltung mit mindestens einem Leistungswiderstand
US5355281A (en) * 1993-06-29 1994-10-11 E.B.G. Elektronische Bauelemente Gesellschaft M.B.H. Electrical device having a bonded ceramic-copper heat transfer medium
US5481241A (en) * 1993-11-12 1996-01-02 Caddock Electronics, Inc. Film-type heat sink-mounted power resistor combination having only a thin encapsulant, and having an enlarged internal heat sink
US5621378A (en) * 1995-04-20 1997-04-15 Caddock Electronics, Inc. Heatsink-mountable power resistor having improved heat-transfer interface with the heatsink
US5739743A (en) * 1996-02-05 1998-04-14 Emc Technology, Inc. Asymmetric resistor terminal
US6148502A (en) 1997-10-02 2000-11-21 Vishay Sprague, Inc. Surface mount resistor and a method of making the same
US5999085A (en) 1998-02-13 1999-12-07 Vishay Dale Electronics, Inc. Surface mounted four terminal resistor
TW393744B (en) * 1998-11-10 2000-06-11 Siliconware Precision Industries Co Ltd A semicondutor packaging
US5945905A (en) * 1998-12-21 1999-08-31 Emc Technology Llc High power resistor
US6404324B1 (en) * 1999-09-07 2002-06-11 General Motors Corporation Resistive component for use with short duration, high-magnitude currents
US6510605B1 (en) 1999-12-21 2003-01-28 Vishay Dale Electronics, Inc. Method for making formed surface mount resistor
JP3803025B2 (ja) * 2000-12-05 2006-08-02 富士電機ホールディングス株式会社 抵抗器
US6600651B1 (en) * 2001-06-05 2003-07-29 Macronix International Co., Ltd. Package with high heat dissipation
US6340927B1 (en) * 2001-06-29 2002-01-22 Elektronische Bauelemente Gesellschaft M.B.H High thermal efficiency power resistor
US6660651B1 (en) 2001-11-08 2003-12-09 Advanced Micro Devices, Inc. Adjustable wafer stage, and a method and system for performing process operations using same

Also Published As

Publication number Publication date
US7102484B2 (en) 2006-09-05
HK1142990A1 (en) 2010-12-17
EP1625599B1 (de) 2011-03-30
US20050212649A1 (en) 2005-09-29
WO2004105059A1 (en) 2004-12-02
DE602004032019D1 (de) 2011-05-12
JP2006529059A (ja) 2006-12-28
JP4390806B2 (ja) 2009-12-24
US20040233032A1 (en) 2004-11-25
CN1823395A (zh) 2006-08-23
US7042328B2 (en) 2006-05-09
EP2228807B1 (de) 2016-07-27
CN101702355B (zh) 2012-05-23
EP2228807A1 (de) 2010-09-15
EP1625599A1 (de) 2006-02-15
CN101702355A (zh) 2010-05-05
CN100583315C (zh) 2010-01-20
US6925704B1 (en) 2005-08-09

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties