ATE505705T1 - Vorrichtung und verfahren zum prüfen von dickeabmessungen eines elements, während es maschinenbearbeitet wird - Google Patents

Vorrichtung und verfahren zum prüfen von dickeabmessungen eines elements, während es maschinenbearbeitet wird

Info

Publication number
ATE505705T1
ATE505705T1 AT08775214T AT08775214T ATE505705T1 AT E505705 T1 ATE505705 T1 AT E505705T1 AT 08775214 T AT08775214 T AT 08775214T AT 08775214 T AT08775214 T AT 08775214T AT E505705 T1 ATE505705 T1 AT E505705T1
Authority
AT
Austria
Prior art keywords
wafer
machined
thickness dimensions
reflected
cushion
Prior art date
Application number
AT08775214T
Other languages
English (en)
Inventor
Aglio Carlo Dall
Original Assignee
Marposs Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marposs Spa filed Critical Marposs Spa
Application granted granted Critical
Publication of ATE505705T1 publication Critical patent/ATE505705T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Ceramic Capacitors (AREA)
AT08775214T 2007-07-20 2008-07-18 Vorrichtung und verfahren zum prüfen von dickeabmessungen eines elements, während es maschinenbearbeitet wird ATE505705T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT000504A ITBO20070504A1 (it) 2007-07-20 2007-07-20 Apparecchiatura e metodo per il controllo dello spessore di un elemento in lavorazione
PCT/EP2008/059438 WO2009013231A1 (en) 2007-07-20 2008-07-18 Apparatus and method for checking thickness dimensions of an element while it is being machined

Publications (1)

Publication Number Publication Date
ATE505705T1 true ATE505705T1 (de) 2011-04-15

Family

ID=39717703

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08775214T ATE505705T1 (de) 2007-07-20 2008-07-18 Vorrichtung und verfahren zum prüfen von dickeabmessungen eines elements, während es maschinenbearbeitet wird

Country Status (9)

Country Link
US (1) US8546760B2 (de)
EP (2) EP2174092B1 (de)
JP (1) JP5335787B2 (de)
KR (1) KR101526311B1 (de)
CN (2) CN101755189B (de)
AT (1) ATE505705T1 (de)
DE (2) DE602008006196D1 (de)
IT (1) ITBO20070504A1 (de)
WO (1) WO2009013231A1 (de)

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ITBO20070504A1 (it) * 2007-07-20 2009-01-21 Marposs Spa Apparecchiatura e metodo per il controllo dello spessore di un elemento in lavorazione
DE102009015878A1 (de) * 2009-04-01 2010-10-07 Peter Wolters Gmbh Verfahren zum materialabtragenden Bearbeiten von flachen Werkstücken
GB2478590A (en) 2010-03-12 2011-09-14 Precitec Optronik Gmbh Apparatus and method for monitoring a thickness of a silicon wafer
IT1399875B1 (it) * 2010-05-18 2013-05-09 Marposs Spa Metodo e apparecchiatura per la misura ottica mediante interferometria dello spessore di un oggetto
SG185368A1 (en) 2010-05-18 2012-12-28 Marposs Spa Method and apparatus for optically measuring by interferometry the thickness of an object
IT1399876B1 (it) * 2010-05-18 2013-05-09 Marposs Spa Metodo e apparecchiatura per la misura ottica mediante interferometria dello spessore di un oggetto
CN103221813B (zh) 2010-11-12 2017-05-17 Ev 集团 E·索尔纳有限责任公司 用于测量晶片堆叠的层厚度和晶格缺陷的测量装置和方法
JP5731806B2 (ja) * 2010-12-02 2015-06-10 株式会社ディスコ 研削装置
US9157730B2 (en) * 2012-10-26 2015-10-13 Applied Materials, Inc. PECVD process
JP6145342B2 (ja) * 2013-07-12 2017-06-07 株式会社荏原製作所 膜厚測定装置、膜厚測定方法、および膜厚測定装置を備えた研磨装置
ITBO20130403A1 (it) 2013-07-26 2015-01-27 Marposs Spa Metodo e apparecchiatura per il controllo ottico mediante interferometria dello spessore di un oggetto in lavorazione
JP6374169B2 (ja) * 2014-01-23 2018-08-15 株式会社荏原製作所 研磨方法および研磨装置
CN105825902B (zh) * 2015-01-08 2017-08-25 哈电集团（秦皇岛）重型装备有限公司 Ap1000 核电设备部件表面的清洁度检测方法
CN104690637A (zh) * 2015-03-18 2015-06-10 合肥京东方光电科技有限公司 一种柔性基板研磨控制方法及装置
US10234265B2 (en) 2016-12-12 2019-03-19 Precitec Optronik Gmbh Distance measuring device and method for measuring distances
DE102017126310A1 (de) 2017-11-09 2019-05-09 Precitec Optronik Gmbh Abstandsmessvorrichtung
JP7018506B2 (ja) * 2018-07-26 2022-02-10 東京エレクトロン株式会社 基板処理システム及び基板処理方法
DE102018130901A1 (de) 2018-12-04 2020-06-04 Precitec Optronik Gmbh Optische Messeinrichtung
CN109540897B (zh) * 2018-12-29 2024-04-02 镇江奥博通信设备有限公司 一种光纤适配器检测装置
CN110757278B (zh) * 2019-10-23 2020-09-18 清华大学 一种晶圆厚度测量装置和磨削机台
CN110695849B (zh) * 2019-10-23 2020-09-15 清华大学 一种晶圆厚度测量装置和磨削机台
CN115735091A (zh) 2020-06-19 2023-03-03 普瑞斯特光电公司 彩色共焦测量装置
CN117140236B (zh) * 2023-10-25 2024-01-26 苏州博宏源机械制造有限公司 一种晶圆厚度在线测量装置及方法
CN117438331B (zh) * 2023-12-20 2024-04-12 武汉芯极客软件技术有限公司 一种半导体cp测试程序的混版本兼容方法
CN118254097B (zh) * 2024-05-29 2024-09-10 北京特思迪半导体设备有限公司 用于原位测量膜厚的方法及化学机械抛光设备
US12416490B1 (en) 2024-05-29 2025-09-16 Beijing Tsd Semiconductor Co., Ltd. Method and chemical mechanical planarization device for in-situ measurement of film thickness

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JP4020739B2 (ja) * 2002-09-27 2007-12-12 株式会社荏原製作所 ポリッシング装置
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JP4714427B2 (ja) 2004-05-14 2011-06-29 株式会社荏原製作所 基板上に形成された薄膜の研磨方法
DE102004034693B4 (de) 2004-07-17 2006-05-18 Schott Ag Verfahren und Vorrichtung zur berührungslosen optischen Messung der Dicke von heißen Glaskörpern mittels der chromatischen Aberration
US7432513B2 (en) * 2005-10-21 2008-10-07 Asml Netherlands B.V. Gas shower, lithographic apparatus and use of a gas shower
ITBO20070504A1 (it) * 2007-07-20 2009-01-21 Marposs Spa Apparecchiatura e metodo per il controllo dello spessore di un elemento in lavorazione

Also Published As

Publication number Publication date
CN101755189A (zh) 2010-06-23
EP2174092B1 (de) 2011-04-13
EP2174092A1 (de) 2010-04-14
CN101755189B (zh) 2013-01-02
US8546760B2 (en) 2013-10-01
CN103029030B (zh) 2016-03-16
CN103029030A (zh) 2013-04-10
EP2322898A3 (de) 2011-08-31
EP2322898A2 (de) 2011-05-18
ITBO20070504A1 (it) 2009-01-21
WO2009013231A1 (en) 2009-01-29
US20100182592A1 (en) 2010-07-22
KR20100051070A (ko) 2010-05-14
KR101526311B1 (ko) 2015-06-05
JP5335787B2 (ja) 2013-11-06
DE602008006196D1 (de) 2011-05-26
JP2010533605A (ja) 2010-10-28
DE202008018535U1 (de) 2015-06-15

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