ATE506693T1 - Silizium-befestigungen für scheibenhaltervorrichtung zur wärmebehandlung und herstellungsverfahren - Google Patents

Silizium-befestigungen für scheibenhaltervorrichtung zur wärmebehandlung und herstellungsverfahren

Info

Publication number
ATE506693T1
ATE506693T1 AT01950554T AT01950554T ATE506693T1 AT E506693 T1 ATE506693 T1 AT E506693T1 AT 01950554 T AT01950554 T AT 01950554T AT 01950554 T AT01950554 T AT 01950554T AT E506693 T1 ATE506693 T1 AT E506693T1
Authority
AT
Austria
Prior art keywords
silicon
legs
tower
parts
fasteners
Prior art date
Application number
AT01950554T
Other languages
English (en)
Inventor
James Boyle
Robert L Davis
Laurence Delaney
Raanan Zehavi
Original Assignee
Integrated Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/608,557 external-priority patent/US6450346B1/en
Priority claimed from US09/608,291 external-priority patent/US6455395B1/en
Application filed by Integrated Materials Inc filed Critical Integrated Materials Inc
Application granted granted Critical
Publication of ATE506693T1 publication Critical patent/ATE506693T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H10P72/123—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterised by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/13—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/13—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H10P72/135—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements characterised by a material, a roughness, a coating or the like

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Silicon Compounds (AREA)
  • Furnace Charging Or Discharging (AREA)
AT01950554T 2000-06-30 2001-06-26 Silizium-befestigungen für scheibenhaltervorrichtung zur wärmebehandlung und herstellungsverfahren ATE506693T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/608,557 US6450346B1 (en) 2000-06-30 2000-06-30 Silicon fixtures for supporting wafers during thermal processing
US09/608,291 US6455395B1 (en) 2000-06-30 2000-06-30 Method of fabricating silicon structures including fixtures for supporting wafers
PCT/US2001/020474 WO2002003428A2 (en) 2000-06-30 2001-06-26 Silicon fixtures for supporting wafers during thermal processing and method of fabrication

Publications (1)

Publication Number Publication Date
ATE506693T1 true ATE506693T1 (de) 2011-05-15

Family

ID=27085718

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01950554T ATE506693T1 (de) 2000-06-30 2001-06-26 Silizium-befestigungen für scheibenhaltervorrichtung zur wärmebehandlung und herstellungsverfahren

Country Status (5)

Country Link
EP (1) EP1297558B1 (de)
AT (1) ATE506693T1 (de)
DE (1) DE60144476D1 (de)
TW (1) TW563221B (de)
WO (1) WO2002003428A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101969085A (zh) * 2010-06-18 2011-02-09 常州亿晶光电科技有限公司 轻便型面接触式防污石英舟
CN102064233A (zh) * 2010-10-29 2011-05-18 常州亿晶光电科技有限公司 面接触式石英舟
CN110666992A (zh) * 2019-08-27 2020-01-10 北京灵禾科技发展有限公司 一种长晶舟及制备工艺

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3640398A (en) * 1970-03-30 1972-02-08 Edward J Mellen Jr Wafer boat
NL7206014A (de) * 1971-07-07 1973-01-09
US4566839A (en) * 1983-05-18 1986-01-28 Microglass, Inc. Semiconductor wafer diffusion boat and method
US4767251A (en) * 1986-05-06 1988-08-30 Amtech Systems, Inc. Cantilever apparatus and method for loading wafer boats into cantilever diffusion tubes
US5492229A (en) * 1992-11-27 1996-02-20 Toshiba Ceramics Co., Ltd. Vertical boat and a method for making the same
JP3245246B2 (ja) * 1993-01-27 2002-01-07 東京エレクトロン株式会社 熱処理装置
GB9509930D0 (en) 1995-05-17 1995-07-12 Smithkline Beecham Corp Method for preparing certain acetonitriles
US5900062A (en) * 1995-12-28 1999-05-04 Applied Materials, Inc. Lift pin for dechucking substrates
EP0884769A1 (de) * 1996-02-29 1998-12-16 Tokyo Electron Limited Wärme behandlungshalter für halbleiterscheiben
JPH09306980A (ja) * 1996-05-17 1997-11-28 Asahi Glass Co Ltd 縦型ウエハボート
US5931666A (en) 1998-02-27 1999-08-03 Saint-Gobain Industrial Ceramics, Inc. Slip free vertical rack design having rounded horizontal arms
US6171400B1 (en) * 1998-10-02 2001-01-09 Union Oil Company Of California Vertical semiconductor wafer carrier
DE19856468C1 (de) * 1998-11-30 2000-06-15 Sico Jena Gmbh Quarzschmelze Verfahren zur Herstellung einer Haltevorrichtung für Halbleiterscheiben
US6196211B1 (en) 1999-04-15 2001-03-06 Integrated Materials, Inc. Support members for wafer processing fixtures
US6205993B1 (en) 1999-04-15 2001-03-27 Integrated Materials, Inc. Method and apparatus for fabricating elongate crystalline members

Also Published As

Publication number Publication date
DE60144476D1 (de) 2011-06-01
TW563221B (en) 2003-11-21
EP1297558B1 (de) 2011-04-20
EP1297558A2 (de) 2003-04-02
WO2002003428A3 (en) 2002-04-11
WO2002003428A2 (en) 2002-01-10

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