ATE506697T1 - Interposer zur entkoppelung von integrierten schaltkreisen auf einer leiterplatte - Google Patents

Interposer zur entkoppelung von integrierten schaltkreisen auf einer leiterplatte

Info

Publication number
ATE506697T1
ATE506697T1 AT05290242T AT05290242T ATE506697T1 AT E506697 T1 ATE506697 T1 AT E506697T1 AT 05290242 T AT05290242 T AT 05290242T AT 05290242 T AT05290242 T AT 05290242T AT E506697 T1 ATE506697 T1 AT E506697T1
Authority
AT
Austria
Prior art keywords
interposer
pcb
integrated circuits
decoupling
microchip
Prior art date
Application number
AT05290242T
Other languages
English (en)
Inventor
Hans Hoffmann
Werner Woelfel
Original Assignee
Alcatel Lucent
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Lucent filed Critical Alcatel Lucent
Application granted granted Critical
Publication of ATE506697T1 publication Critical patent/ATE506697T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
AT05290242T 2005-02-04 2005-02-04 Interposer zur entkoppelung von integrierten schaltkreisen auf einer leiterplatte ATE506697T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05290242A EP1688995B1 (de) 2005-02-04 2005-02-04 Interposer zur Entkoppelung von integrierten Schaltkreisen auf einer Leiterplatte

Publications (1)

Publication Number Publication Date
ATE506697T1 true ATE506697T1 (de) 2011-05-15

Family

ID=34941928

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05290242T ATE506697T1 (de) 2005-02-04 2005-02-04 Interposer zur entkoppelung von integrierten schaltkreisen auf einer leiterplatte

Country Status (5)

Country Link
US (1) US7964802B2 (de)
EP (1) EP1688995B1 (de)
CN (1) CN100405594C (de)
AT (1) ATE506697T1 (de)
DE (1) DE602005027534D1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008100940A1 (en) * 2007-02-12 2008-08-21 Kemet Electronics Corporation Electronic passive device
US8723047B2 (en) * 2007-03-23 2014-05-13 Huawei Technologies Co., Ltd. Printed circuit board, design method thereof and mainboard of terminal product
US9282646B2 (en) * 2012-05-24 2016-03-08 Unimicron Technology Corp. Interposed substrate and manufacturing method thereof
JP6084475B2 (ja) * 2013-02-04 2017-02-22 株式会社神戸製鋼所 溶接金属および溶接構造体
US9583426B2 (en) 2014-11-05 2017-02-28 Invensas Corporation Multi-layer substrates suitable for interconnection between circuit modules
US10283492B2 (en) 2015-06-23 2019-05-07 Invensas Corporation Laminated interposers and packages with embedded trace interconnects
US9852994B2 (en) 2015-12-14 2017-12-26 Invensas Corporation Embedded vialess bridges
US10916493B2 (en) * 2018-11-27 2021-02-09 International Business Machines Corporation Direct current blocking capacitors

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2622346B1 (fr) * 1987-10-23 1993-05-28 Eurofarad Condensateur pour micro-circuit electronique et montage incorporant un tel condensateur
JP3701138B2 (ja) * 1999-04-23 2005-09-28 松下電器産業株式会社 電子部品の製造方法
US6292351B1 (en) * 1999-11-17 2001-09-18 Tdk Corporation Multilayer ceramic capacitor for three-dimensional mounting
US6525922B2 (en) * 2000-12-29 2003-02-25 Intel Corporation High performance via capacitor and method for manufacturing same
US6512182B2 (en) * 2001-03-12 2003-01-28 Ngk Spark Plug Co., Ltd. Wiring circuit board and method for producing same
US6791035B2 (en) * 2002-02-21 2004-09-14 Intel Corporation Interposer to couple a microelectronic device package to a circuit board
US7463474B2 (en) * 2002-04-15 2008-12-09 Avx Corporation System and method of plating ball grid array and isolation features for electronic components
US7030481B2 (en) * 2002-12-09 2006-04-18 Internation Business Machines Corporation High density chip carrier with integrated passive devices
KR100467834B1 (ko) * 2002-12-23 2005-01-25 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조 방법
US7068490B2 (en) * 2004-04-16 2006-06-27 Kemet Electronics Corporation Thermal dissipating capacitor and electrical component comprising same
US7545623B2 (en) * 2006-11-27 2009-06-09 Kemet Electronics Corporation Interposer decoupling array having reduced electrical shorts

Also Published As

Publication number Publication date
EP1688995A1 (de) 2006-08-09
CN1822356A (zh) 2006-08-23
US7964802B2 (en) 2011-06-21
EP1688995B1 (de) 2011-04-20
CN100405594C (zh) 2008-07-23
US20060176674A1 (en) 2006-08-10
DE602005027534D1 (de) 2011-06-01

Similar Documents

Publication Publication Date Title
FI20031201L (fi) Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
EP1705972A4 (de) Mehrschichtige leiterplatte
DE60210980D1 (de) Verdrahtungsverfahren und gerät für eine ultraschallsonde
WO2008157143A3 (en) Edge connection structure for printed circuit boards
ATE557576T1 (de) Leiterplatine mit elektronischem bauelement
TW200704331A (en) Printed circuit board having embedded RF module power stage circuit
TW200709766A (en) Flexible circuit board with heat sink
AT500259A3 (de) Dünnschichtanordnung und verfahren zum herstellen einer solchen dünnschichtanordnung
KR950030325A (ko) 반도체 패키지
EP2079108A4 (de) Elektronische halbleiterkomponente und halbleiteranordnung damit
EP1884992A4 (de) Leiterplatte
ATE242954T1 (de) Mehrschichtleiterplatte
EP1770773A3 (de) Wärmeverteilmodul und seine Herstellung
DE602006017214D1 (de) Optisches transpondermodul mit flexibler schaltung mit doppelter platte
ATE506697T1 (de) Interposer zur entkoppelung von integrierten schaltkreisen auf einer leiterplatte
DE60335448D1 (de) Elektronische baugruppe mit zusammengesetzten elektronischen kontakten zur anbringung eines kapselungssubstrats an einer leiterplatte
TW200616738A (en) Drill and method of producing printed circuit board
WO2006110634A3 (en) Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method
TW200505309A (en) Printed wiring board for mounting semiconductor
EP2533617A4 (de) Chipverpackungskomponente und schweisskomponente zur montage einer bestückten leiterplatte
EP1510965A4 (de) Kartenadapter
DE60128537D1 (de) Zusammenbau zur verbindung von mindestens zwei gedruckten schaltungen
DK1775769T3 (da) Effekthalvledermodul
ATE516246T1 (de) Verfahren zur herstellung einer elektronischen baugruppe; elektronische baugruppe, abdeckung und substrat
ATE385170T1 (de) Montage einer sperrkreisanordnung mit diskreten, passiven elektronischen bauteilen

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties