ATE510870T1 - Härtbare zusammensetzung - Google Patents

Härtbare zusammensetzung

Info

Publication number
ATE510870T1
ATE510870T1 AT04807332T AT04807332T ATE510870T1 AT E510870 T1 ATE510870 T1 AT E510870T1 AT 04807332 T AT04807332 T AT 04807332T AT 04807332 T AT04807332 T AT 04807332T AT E510870 T1 ATE510870 T1 AT E510870T1
Authority
AT
Austria
Prior art keywords
continuous phase
normal temperatures
epoxy
compound
molecule
Prior art date
Application number
AT04807332T
Other languages
English (en)
Inventor
Takefumi Yoshida
Masayuki Tsutsumi
Satoshi Maeda
Keizo Kawahara
Original Assignee
Toyo Boseki
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Boseki filed Critical Toyo Boseki
Application granted granted Critical
Publication of ATE510870T1 publication Critical patent/ATE510870T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
AT04807332T 2003-12-16 2004-12-14 Härtbare zusammensetzung ATE510870T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003418789A JP4151573B2 (ja) 2003-12-16 2003-12-16 硬化型組成物
PCT/JP2004/018975 WO2005059001A1 (ja) 2003-12-16 2004-12-14 硬化型組成物

Publications (1)

Publication Number Publication Date
ATE510870T1 true ATE510870T1 (de) 2011-06-15

Family

ID=34697147

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04807332T ATE510870T1 (de) 2003-12-16 2004-12-14 Härtbare zusammensetzung

Country Status (6)

Country Link
US (1) US20070293588A1 (de)
EP (1) EP1700874B1 (de)
JP (1) JP4151573B2 (de)
KR (1) KR100774059B1 (de)
AT (1) ATE510870T1 (de)
WO (1) WO2005059001A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4779112B2 (ja) * 2005-02-01 2011-09-28 国立大学法人 千葉大学 エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP4986485B2 (ja) 2006-03-28 2012-07-25 株式会社Ａｄｅｋａ エポキシ樹脂硬化性組成物
US9068040B2 (en) 2010-10-12 2015-06-30 Hexcel Corporation Solvent resistant thermoplastic toughened epoxy
JP6725787B2 (ja) * 2016-05-20 2020-07-22 学校法人東邦大学 芳香族ジアミンおよびこれを用いた液晶性エポキシ樹脂熱硬化物
AU2016420190B2 (en) * 2016-08-17 2020-02-13 Dow Global Technologies Llc Benzophenone derivative, aqueous copolymer dispersion and aqueous coating composition
CN112384546B (zh) * 2018-10-17 2024-01-16 东洋纺株式会社 导热性树脂组合物
EP3950763B1 (de) * 2019-03-27 2025-10-22 NHK Spring Co., Ltd. Wärmehärtende epoxidharzzusammensetzung, schichtplatte für eine leiterplatte, metallbasierte leiterplatte und leistungsmodul

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2773048A (en) * 1952-08-25 1956-12-04 Honeywell Regulator Co Epoxy resin composition containing para, para' diamino diphenylmethane
US3996175A (en) * 1971-06-25 1976-12-07 Ciba-Geigy Corporation Storage-stable, quick-curing epoxide resin moulding materials
SU852914A1 (ru) * 1979-12-20 1981-08-07 Ленинградский Ордена Октябрьскойреволюции И Ордена Трудовогокрасного Знамени Технологический Институтим. Ленсовета Эпоксидна композици
JPS5734118A (en) * 1980-08-07 1982-02-24 Dainippon Jushi Kenkyusho:Kk One-component epoxy resin composition
DE3424700A1 (de) * 1984-07-05 1986-02-06 Basf Ag, 6700 Ludwigshafen Faserverbundwerkstoffe auf basis von epoxidharzen
US4656208A (en) * 1985-02-19 1987-04-07 Hercules Incorporated Thermosetting epoxy resin compositions and thermosets therefrom
US4725663A (en) * 1985-06-17 1988-02-16 The Dow Chemical Company Use of n-glycidyl benzoxazoles as latently cross-linkable reactive diluents for epoxy resins
US4746718A (en) * 1987-04-06 1988-05-24 Amoco Corporation Novel oligomeric diamine hardeners and their use for curing epoxy resin systems
DK0660861T3 (da) * 1992-09-14 1997-08-25 Cytec Tech Corp Vandige VOC-frie epoxygrundersammensætninger
US5554714A (en) * 1993-02-18 1996-09-10 W. R. Grace & Co.-Conn. Spherical curing agent for epoxy resin, curing agent masterbatch for epoxy resin and their preparation.
EP0757067B1 (de) * 1994-03-28 1999-09-22 Sunstar Giken Kabushiki Kaisha Wärmehärtende zusammensetzung
TW353674B (en) * 1996-12-31 1999-03-01 Shell Int Research Prereacted surfactant composition and water borne curing agent composition for self-curing epoxy resins at ambient or sub-ambient temperatures, comprising said surfactant composition
EP1082391B1 (de) * 1998-03-24 2002-06-12 Resolution Research Nederland B.V. Wärmehärtbare harzartige bindemittelzusammensetzungen, deren herstellung und deren verwendung als beschichtungen
CA2269378C (en) * 1998-04-17 2008-04-01 Ajinomoto Co., Inc. Curable resin composition
JP4207101B2 (ja) * 1999-05-25 2009-01-14 日立化成工業株式会社 半導体封止用樹脂組成物及び樹脂封止型半導体装置
JP3585819B2 (ja) * 2000-06-05 2004-11-04 住友電工スチールワイヤー株式会社 プレストレストコンクリート緊張材用硬化性組成物及び緊張材
EP1217049A1 (de) * 2000-12-23 2002-06-26 Sika AG, vorm. Kaspar Winkler & Co. Voranstrich für Beton
JP3723483B2 (ja) * 2001-10-16 2005-12-07 日本電気株式会社 電子部品装置
JP2003213086A (ja) * 2002-01-28 2003-07-30 Sumitomo Bakelite Co Ltd 半導体用樹脂ペースト及び半導体装置
JP4036011B2 (ja) * 2002-02-26 2008-01-23 日立化成工業株式会社 難燃性熱硬化樹脂組成物，それを用いたプリプレグ及び電気配線板用積層板
TWI313684B (en) * 2002-10-03 2009-08-21 Chang Chun Plastics Co Ltd Nitrogen-oxygen heterocyclic compound
US7060357B2 (en) * 2002-10-04 2006-06-13 Basf Corporation Powder coatings containing symmetrical additives
TW576854B (en) * 2002-10-25 2004-02-21 Chang Chun Plastics Co Ltd Halogen-free resin composition
JP4986485B2 (ja) * 2006-03-28 2012-07-25 株式会社Ａｄｅｋａ エポキシ樹脂硬化性組成物

Also Published As

Publication number Publication date
KR20060134025A (ko) 2006-12-27
JP2005179404A (ja) 2005-07-07
US20070293588A1 (en) 2007-12-20
JP4151573B2 (ja) 2008-09-17
EP1700874A4 (de) 2007-10-24
WO2005059001A1 (ja) 2005-06-30
EP1700874A1 (de) 2006-09-13
KR100774059B1 (ko) 2007-11-06
EP1700874B1 (de) 2011-05-25

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