ATE510872T1 - Sperrdichtstoffe aus strahlungs- oder wärmehärtbarem oxetan - Google Patents
Sperrdichtstoffe aus strahlungs- oder wärmehärtbarem oxetanInfo
- Publication number
- ATE510872T1 ATE510872T1 AT06749108T AT06749108T ATE510872T1 AT E510872 T1 ATE510872 T1 AT E510872T1 AT 06749108 T AT06749108 T AT 06749108T AT 06749108 T AT06749108 T AT 06749108T AT E510872 T1 ATE510872 T1 AT E510872T1
- Authority
- AT
- Austria
- Prior art keywords
- oxetane
- radiation
- heat curing
- sealants made
- barrier sealants
- Prior art date
Links
- 239000000565 sealant Substances 0.000 title abstract 2
- 230000004888 barrier function Effects 0.000 title 1
- 238000013007 heat curing Methods 0.000 title 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 title 1
- 230000005855 radiation Effects 0.000 title 1
- 238000003847 radiation curing Methods 0.000 title 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 125000002091 cationic group Chemical group 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- -1 oxetane compound Chemical class 0.000 abstract 1
- 230000035699 permeability Effects 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Polyethers (AREA)
- Sealing Material Composition (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/098,116 US20060223978A1 (en) | 2005-04-04 | 2005-04-04 | Radiation- or thermally-curable oxetane barrier sealants |
| PCT/US2006/012182 WO2006107803A2 (en) | 2005-04-04 | 2006-04-03 | Radiation-or thermally-curable oxetane barrier sealants |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE510872T1 true ATE510872T1 (de) | 2011-06-15 |
Family
ID=36950282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT06749108T ATE510872T1 (de) | 2005-04-04 | 2006-04-03 | Sperrdichtstoffe aus strahlungs- oder wärmehärtbarem oxetan |
Country Status (9)
| Country | Link |
|---|---|
| US (4) | US20060223978A1 (de) |
| EP (2) | EP1992654B1 (de) |
| JP (1) | JP5297185B2 (de) |
| KR (2) | KR101470473B1 (de) |
| CN (2) | CN101155853A (de) |
| AT (1) | ATE510872T1 (de) |
| PT (2) | PT1866360E (de) |
| TW (1) | TWI393731B (de) |
| WO (1) | WO2006107803A2 (de) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007111606A1 (en) * | 2006-03-29 | 2007-10-04 | National Starch And Chemical Investment Holding Corporation | Radiation-or thermally-curable barrier sealants |
| EP2004746B1 (de) * | 2006-03-29 | 2018-08-01 | Henkel AG & Co. KGaA | Strahlungshärtbarer kautschuk-klebstoff/dichtstoff |
| WO2007124073A2 (en) * | 2006-04-21 | 2007-11-01 | Ndsu Research Foundation | Polyol photosensitizers, carrier gas uv laser ablation sensitizers, and other additives and methods for making and using same |
| KR100946606B1 (ko) * | 2007-01-12 | 2010-03-09 | 세키스이가가쿠 고교가부시키가이샤 | 전자 부품용 접착제 |
| EP1972622A3 (de) * | 2007-03-23 | 2009-07-01 | Daicel Chemical Industries, Ltd. | Vinylether-Verbindungen und polymerisierbare Verbindungen |
| US20090203283A1 (en) * | 2008-02-07 | 2009-08-13 | Margaret Helen Gentile | Method for sealing an electronic device |
| TWI370525B (en) * | 2008-04-25 | 2012-08-11 | Ind Tech Res Inst | Encapsulant composition and method for fabricating encapsulant material |
| US20110200918A1 (en) * | 2008-11-08 | 2011-08-18 | Tomoya Mizuta | Photosensitive composition for volume hologram recording and producing method thereof |
| GB2466251B (en) * | 2008-12-16 | 2011-03-09 | Ind Tech Res Inst | Encapsulant compositions and method for fabricating encapsulant materials |
| DE102009013710A1 (de) | 2009-03-20 | 2010-09-23 | Merck Patent Gmbh | Polymere aus Mischungen mit Vinylether-Monomeren |
| US9136195B2 (en) | 2009-07-17 | 2015-09-15 | Tyco Electronics Corporation | Oxygen barrier compositions and related methods |
| US8525635B2 (en) | 2009-07-17 | 2013-09-03 | Tyco Electronics Corporation | Oxygen-barrier packaged surface mount device |
| EP2439240A1 (de) | 2010-10-06 | 2012-04-11 | Henkel AG & Co. KGaA | Strahlungshärtbare Zusammensetzung |
| TWI537356B (zh) * | 2010-12-17 | 2016-06-11 | Toagosei Co Ltd | Photo-curable adhesive composition, polarizing plate and manufacturing method thereof, optical member and liquid crystal display device (1) |
| US8558436B2 (en) | 2011-09-13 | 2013-10-15 | Switch Bulb Company, Inc. | Scavengers for reducing contaminants in liquid-filled LED bulbs |
| CA2906984A1 (en) | 2013-03-15 | 2014-09-18 | Cargill, Incorporated | Carbohydrate compositions |
| KR20190114042A (ko) * | 2013-08-27 | 2019-10-08 | 헨켈 아게 운트 코. 카게아아 | 경화성 조성물 및 전자 소자에서의 용도 |
| CN103500755A (zh) * | 2013-10-16 | 2014-01-08 | 京东方科技集团股份有限公司 | Oled显示屏、oled显示屏的制造方法及显示装置 |
| CN106459575B (zh) * | 2014-06-27 | 2018-12-04 | 株式会社大赛璐 | 单体组合物及含有其的固化性组合物 |
| EP3162830B1 (de) | 2014-06-27 | 2021-02-24 | Daicel Corporation | Monomerzusammensetzung und härtbare zusammensetzung damit |
| CN104084061B (zh) * | 2014-08-06 | 2016-03-09 | 哈尔滨工业大学 | 一种纳米bn改性超滤膜的制备方法 |
| TWI519560B (zh) | 2014-11-24 | 2016-02-01 | 財團法人工業技術研究院 | 含氧雜環丁烷基與環氧基之樹脂與樹脂組成物 |
| CN104693685B (zh) * | 2015-03-19 | 2017-10-20 | 西安交通大学 | 一种丙烯酰胺接枝改性纳米氧化铝环氧复合绝缘材料的制备方法 |
| CN105185922B (zh) * | 2015-06-12 | 2018-09-21 | 合肥京东方光电科技有限公司 | 一种封装结构及封装方法、oled装置 |
| DE102015112233B4 (de) | 2015-07-27 | 2021-12-09 | Granula Polymer Gmbh | Verfahren zur Herstellung von Folien und Membranen umfassend hyperverzweigte Copolymere auf Basis von Oxetan, Folien und Membranen, die nach diesem Verfahren erhalten werden, sowie deren Verwendung |
| JP6657716B2 (ja) * | 2015-09-29 | 2020-03-04 | 日立化成株式会社 | 封止用液状組成物、封止材、及び電子部品装置 |
| CN107621752B (zh) | 2016-07-13 | 2019-11-12 | 常州强力先端电子材料有限公司 | 一种混杂型光敏树脂及其制备方法 |
| CN107619399B (zh) | 2016-07-13 | 2021-04-27 | 常州强力先端电子材料有限公司 | 多官能度氧杂环丁烷类化合物及其制备方法 |
| CN106187953B (zh) * | 2016-07-29 | 2018-06-29 | 湖北固润科技股份有限公司 | 一种阳离子聚合单体及合成和应用 |
| CN106396478A (zh) * | 2016-08-30 | 2017-02-15 | 裴寿益 | 一种散热材料 |
| CN109891312B (zh) * | 2016-10-28 | 2021-12-07 | 夏普株式会社 | 密封材料组成物、液晶单元和扫描天线 |
| TWI687448B (zh) * | 2016-12-09 | 2020-03-11 | 南韓商Lg化學股份有限公司 | 封裝組成物 |
| US10913874B2 (en) * | 2016-12-09 | 2021-02-09 | Lg Chem, Ltd. | Encapsulating composition |
| US11171309B2 (en) * | 2016-12-09 | 2021-11-09 | Lg Chem, Ltd. | Encapsulating composition |
| US10647899B2 (en) * | 2017-06-26 | 2020-05-12 | Shin-Etsu Chemical Co., Ltd. | Heat-curable fluoropolyether-based adhesive composition and electric/electronic component |
| EP3421567B1 (de) * | 2017-06-28 | 2024-09-18 | Henkel AG & Co. KGaA | Uv vorhärtbare epoxid-zusammensetzung für zweistufigen montageprozess |
| US10858541B2 (en) * | 2017-12-19 | 2020-12-08 | Rohm And Haas Electronic Materials Llc | Curable composition |
| CN112218931B (zh) * | 2018-06-12 | 2024-02-13 | 株式会社Lg化学 | 封装组合物 |
| KR102389442B1 (ko) * | 2018-08-10 | 2022-04-21 | 미쓰이 가가쿠 가부시키가이샤 | 봉지제 |
| CN109825034B (zh) * | 2019-01-21 | 2020-10-30 | 江南大学 | 一种实现巯基-环氧深层光固化的方法及其组合物 |
| CN111410455A (zh) * | 2020-04-03 | 2020-07-14 | 杨云 | 一种蛭石高温密封胶及其制备方法和制备装置 |
| CN114635128A (zh) * | 2020-12-16 | 2022-06-17 | 常州强力电子新材料股份有限公司 | 可紫外光固化的表面钝化剂、金属制品及应用 |
| EP4050061B1 (de) | 2021-02-26 | 2025-10-15 | Henkel AG & Co. KGaA | Im nahinfrarotbereich (nir) sensibilisierte kleb- und dichtstoffzusammensetzungen |
| EP4050060A1 (de) | 2021-02-26 | 2022-08-31 | Henkel AG & Co. KGaA | Photohärtbare klebe- oder dichtungsmasse |
| CN117099198A (zh) * | 2021-04-05 | 2023-11-21 | 松下知识产权经营株式会社 | 侧填充用树脂组合物、半导体装置、侧填充构件的除去方法和半导体装置的制造方法 |
| JP2023030729A (ja) * | 2021-08-24 | 2023-03-08 | 四国化成ホールディングス株式会社 | エポキシ・オキセタン化合物、その合成方法および該化合物の利用 |
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-
2005
- 2005-04-04 US US11/098,116 patent/US20060223978A1/en not_active Abandoned
-
2006
- 2006-04-03 AT AT06749108T patent/ATE510872T1/de not_active IP Right Cessation
- 2006-04-03 PT PT06749108T patent/PT1866360E/pt unknown
- 2006-04-03 CN CNA2006800112960A patent/CN101155853A/zh active Pending
- 2006-04-03 WO PCT/US2006/012182 patent/WO2006107803A2/en not_active Ceased
- 2006-04-03 CN CN2010101147683A patent/CN101891945B/zh not_active Expired - Fee Related
- 2006-04-03 PT PT08013766T patent/PT1992654E/pt unknown
- 2006-04-03 EP EP08013766A patent/EP1992654B1/de not_active Not-in-force
- 2006-04-03 TW TW095111704A patent/TWI393731B/zh not_active IP Right Cessation
- 2006-04-03 JP JP2008505404A patent/JP5297185B2/ja not_active Expired - Fee Related
- 2006-04-03 KR KR1020137007969A patent/KR101470473B1/ko not_active Expired - Fee Related
- 2006-04-03 KR KR1020077025367A patent/KR101306213B1/ko not_active Expired - Fee Related
- 2006-04-03 EP EP06749108A patent/EP1866360B1/de not_active Not-in-force
- 2006-08-10 US US11/502,707 patent/US20070034515A1/en not_active Abandoned
-
2008
- 2008-06-26 US US12/147,032 patent/US7902305B2/en not_active Expired - Fee Related
- 2008-07-25 US US12/179,924 patent/US7887716B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| PT1992654E (pt) | 2012-11-08 |
| CN101155853A (zh) | 2008-04-02 |
| US7887716B2 (en) | 2011-02-15 |
| PT1866360E (pt) | 2011-07-12 |
| EP1866360A2 (de) | 2007-12-19 |
| CN101891945A (zh) | 2010-11-24 |
| KR20130054393A (ko) | 2013-05-24 |
| US20080296159A1 (en) | 2008-12-04 |
| US20070034515A1 (en) | 2007-02-15 |
| US20060223978A1 (en) | 2006-10-05 |
| US20080272328A1 (en) | 2008-11-06 |
| JP2008535975A (ja) | 2008-09-04 |
| EP1992654B1 (de) | 2012-09-12 |
| EP1992654A1 (de) | 2008-11-19 |
| TW200702354A (en) | 2007-01-16 |
| KR101306213B1 (ko) | 2013-09-09 |
| WO2006107803A3 (en) | 2006-12-07 |
| US7902305B2 (en) | 2011-03-08 |
| TWI393731B (zh) | 2013-04-21 |
| WO2006107803A2 (en) | 2006-10-12 |
| KR101470473B1 (ko) | 2014-12-08 |
| KR20070122526A (ko) | 2007-12-31 |
| JP5297185B2 (ja) | 2013-09-25 |
| EP1866360B1 (de) | 2011-05-25 |
| CN101891945B (zh) | 2012-10-24 |
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