SG102716A1 - Method for producing a captive wired test fixture and fixture therefor - Google Patents

Method for producing a captive wired test fixture and fixture therefor

Info

Publication number
SG102716A1
SG102716A1 SG200303783A SG200303783A SG102716A1 SG 102716 A1 SG102716 A1 SG 102716A1 SG 200303783 A SG200303783 A SG 200303783A SG 200303783 A SG200303783 A SG 200303783A SG 102716 A1 SG102716 A1 SG 102716A1
Authority
SG
Singapore
Prior art keywords
fixture
locations
plate
hole
wired
Prior art date
Application number
SG200303783A
Other languages
English (en)
Inventor
Miczek Gregory
Newhall Thomas
St Onge Gary
P Rogers David
Original Assignee
Capital Formation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Capital Formation Inc filed Critical Capital Formation Inc
Publication of SG102716A1 publication Critical patent/SG102716A1/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126Assembling bases
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base
    • Y10T29/49151Assembling terminal to base by deforming or shaping
    • Y10T29/49153Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49162Manufacturing circuit on or in base by using wire as conductive path
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/532Conductor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/532Conductor
    • Y10T29/53209Terminal or connector
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/532Conductor
    • Y10T29/53209Terminal or connector
    • Y10T29/53213Assembled to wire-type conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Installation Of Indoor Wiring (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Multi-Conductor Connections (AREA)
SG200303783A 2002-06-24 2003-06-17 Method for producing a captive wired test fixture and fixture therefor SG102716A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US39109702P 2002-06-24 2002-06-24

Publications (1)

Publication Number Publication Date
SG102716A1 true SG102716A1 (en) 2004-03-26

Family

ID=29718065

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200303783A SG102716A1 (en) 2002-06-24 2003-06-17 Method for producing a captive wired test fixture and fixture therefor

Country Status (8)

Country Link
US (3) US7059046B2 (de)
EP (1) EP1376141B1 (de)
JP (1) JP4098676B2 (de)
CN (1) CN1320369C (de)
AT (1) ATE511096T1 (de)
MY (1) MY134274A (de)
SG (1) SG102716A1 (de)
TW (1) TWI223098B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7059046B2 (en) * 2002-06-24 2006-06-13 Delaware Capital Formation, Inc. Method for producing a captive wired test fixture and fixture therefor
US8181906B2 (en) * 2009-04-02 2012-05-22 Raytheon Company Method and apparatus for ram deceleration in a launch system
US8648616B2 (en) * 2009-12-22 2014-02-11 Ltx-Credence Corporation Loaded printed circuit board test fixture and method for manufacturing the same
TWI426366B (zh) * 2011-01-17 2014-02-11 Hon Hai Prec Ind Co Ltd 測試點自動查找與優化系統及方法
US9658252B2 (en) * 2011-02-21 2017-05-23 United Microelectronics Corp. Probe insertion auxiliary and method of probe insertion
US9182425B2 (en) 2012-05-21 2015-11-10 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Probe supporting and aligning apparatus
CN102768293B (zh) * 2012-07-24 2015-03-25 上海交通大学 一种有机电致发光器件测量夹具
CN107564829B (zh) * 2017-08-24 2020-09-04 北京智芯微电子科技有限公司 用于tsv封装芯片的内部信号量测的方法
CN110429401A (zh) * 2019-08-07 2019-11-08 广东电网有限责任公司 一种可调节线夹
CN111286846B (zh) * 2020-04-15 2021-04-16 扬州市郭氏精密机械制造有限公司 一种织布用纱夹

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0233992A1 (de) * 1985-11-01 1987-09-02 Hewlett-Packard Company Halterung für Leiterplattentest
US4897598A (en) * 1987-03-31 1990-01-30 Siemens Aktiengesellschaft Apparatus for electrical function testing of wiring matrices, particularly of printed circuit boards
US4977370A (en) * 1988-12-06 1990-12-11 Genrad, Inc. Apparatus and method for circuit board testing
JPH09281139A (ja) * 1996-09-13 1997-10-31 Furukawa Electric Co Ltd:The プローバーの製造方法
JP2001047001A (ja) * 1999-08-09 2001-02-20 Unitika Ltd 飛灰の再資源化処理法

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US4353536A (en) * 1981-02-04 1982-10-12 Peter Mazzotta Miter clamp
US4423376A (en) * 1981-03-20 1983-12-27 International Business Machines Corporation Contact probe assembly having rotatable contacting probe elements
US4788496A (en) * 1982-11-05 1988-11-29 Martin Maelzer Adapter for a printed circuit board testing device
US4535536A (en) * 1983-11-03 1985-08-20 Augat Inc. Method of assembling adaptor for automatic testing equipment
US4774462A (en) * 1984-06-11 1988-09-27 Black Thomas J Automatic test system
US4622514A (en) * 1984-06-15 1986-11-11 Ibm Multiple mode buckling beam probe assembly
DE3539720A1 (de) * 1985-11-08 1987-05-14 Martin Maelzer Adapter fuer ein leiterplattenpruefgeraet
US4935696A (en) * 1987-04-16 1990-06-19 Teradyne, Inc. Test pin assembly for circuit board tester
US4963822A (en) * 1988-06-01 1990-10-16 Manfred Prokopp Method of testing circuit boards and the like
US4904935A (en) * 1988-11-14 1990-02-27 Eaton Corporation Electrical circuit board text fixture having movable platens
US5399982A (en) * 1989-11-13 1995-03-21 Mania Gmbh & Co. Printed circuit board testing device with foil adapter
JPH0675415B2 (ja) * 1991-03-15 1994-09-21 山一電機株式会社 リードレス形icパッケージ用接続器
DE4337500A1 (de) 1993-11-03 1995-05-04 Test Plus Electronic Gmbh Zweiteilige Adaptereinrichtung
US5442299A (en) * 1994-01-06 1995-08-15 International Business Machines Corporation Printed circuit board test fixture and method
US5493230A (en) * 1994-02-25 1996-02-20 Everett Charles Technologies, Inc. Retention of test probes in translator fixtures
US5729146A (en) * 1995-09-21 1998-03-17 Everett Charles Technologies, Inc. Quick stacking translator fixture
IT1282689B1 (it) * 1996-02-26 1998-03-31 Circuit Line Spa Dispositivo di conversione della griglia di punti di test di una macchina per il test elettrico di circuiti stampati non montati
US5818248A (en) * 1996-07-29 1998-10-06 Delaware Capital Formation, Inc Loaded board test fixture with integral translator fixture for testing closely spaced test sites
US5804984A (en) * 1996-08-02 1998-09-08 International Business Machines Corporation Electronic component test apparatus with rotational probe
US5773988A (en) * 1996-10-29 1998-06-30 Hewlett-Packard Company Standard- and limited-access hybrid test fixture
US6407565B1 (en) * 1996-10-29 2002-06-18 Agilent Technologies, Inc. Loaded-board, guided-probe test fixture
US5945836A (en) * 1996-10-29 1999-08-31 Hewlett-Packard Company Loaded-board, guided-probe test fixture
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US6024579A (en) * 1998-05-29 2000-02-15 The Whitaker Corporation Electrical connector having buckling beam contacts
US6208158B1 (en) * 1998-06-03 2001-03-27 Schein Research, Inc. Zero static force assembly for wireless test fixtures
DE19907727A1 (de) * 1999-02-23 2000-08-24 Test Plus Electronic Gmbh Testadapter zur Kontaktierung von bestückten Leiterplatinen
US6414504B2 (en) * 1999-05-20 2002-07-02 Delaware Capital Formation, Inc. Coaxial tilt pin fixture for testing high frequency circuit boards
FR2815127B1 (fr) * 2000-10-05 2002-12-20 Andre Sabatier Connecteur electrique a contacts multiples
US6559664B2 (en) * 2001-08-13 2003-05-06 Desimone Peter Probe plate assembly for a circuit board test fixture
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0233992A1 (de) * 1985-11-01 1987-09-02 Hewlett-Packard Company Halterung für Leiterplattentest
US4897598A (en) * 1987-03-31 1990-01-30 Siemens Aktiengesellschaft Apparatus for electrical function testing of wiring matrices, particularly of printed circuit boards
US4977370A (en) * 1988-12-06 1990-12-11 Genrad, Inc. Apparatus and method for circuit board testing
JPH09281139A (ja) * 1996-09-13 1997-10-31 Furukawa Electric Co Ltd:The プローバーの製造方法
JP2001047001A (ja) * 1999-08-09 2001-02-20 Unitika Ltd 飛灰の再資源化処理法

Also Published As

Publication number Publication date
MY134274A (en) 2007-11-30
CN1320369C (zh) 2007-06-06
US7059046B2 (en) 2006-06-13
US20060143909A1 (en) 2006-07-06
JP2004029024A (ja) 2004-01-29
TW200401900A (en) 2004-02-01
US20030234640A1 (en) 2003-12-25
US7424775B2 (en) 2008-09-16
JP4098676B2 (ja) 2008-06-11
ATE511096T1 (de) 2011-06-15
TWI223098B (en) 2004-11-01
EP1376141A1 (de) 2004-01-02
EP1376141B1 (de) 2011-05-25
US20060151444A1 (en) 2006-07-13
CN1472540A (zh) 2004-02-04

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