SG102716A1 - Method for producing a captive wired test fixture and fixture therefor - Google Patents
Method for producing a captive wired test fixture and fixture thereforInfo
- Publication number
- SG102716A1 SG102716A1 SG200303783A SG200303783A SG102716A1 SG 102716 A1 SG102716 A1 SG 102716A1 SG 200303783 A SG200303783 A SG 200303783A SG 200303783 A SG200303783 A SG 200303783A SG 102716 A1 SG102716 A1 SG 102716A1
- Authority
- SG
- Singapore
- Prior art keywords
- fixture
- locations
- plate
- hole
- wired
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49151—Assembling terminal to base by deforming or shaping
- Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/532—Conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/532—Conductor
- Y10T29/53209—Terminal or connector
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/532—Conductor
- Y10T29/53209—Terminal or connector
- Y10T29/53213—Assembled to wire-type conductor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Installation Of Indoor Wiring (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Multi-Conductor Connections (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US39109702P | 2002-06-24 | 2002-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG102716A1 true SG102716A1 (en) | 2004-03-26 |
Family
ID=29718065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG200303783A SG102716A1 (en) | 2002-06-24 | 2003-06-17 | Method for producing a captive wired test fixture and fixture therefor |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US7059046B2 (de) |
| EP (1) | EP1376141B1 (de) |
| JP (1) | JP4098676B2 (de) |
| CN (1) | CN1320369C (de) |
| AT (1) | ATE511096T1 (de) |
| MY (1) | MY134274A (de) |
| SG (1) | SG102716A1 (de) |
| TW (1) | TWI223098B (de) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7059046B2 (en) * | 2002-06-24 | 2006-06-13 | Delaware Capital Formation, Inc. | Method for producing a captive wired test fixture and fixture therefor |
| US8181906B2 (en) * | 2009-04-02 | 2012-05-22 | Raytheon Company | Method and apparatus for ram deceleration in a launch system |
| US8648616B2 (en) * | 2009-12-22 | 2014-02-11 | Ltx-Credence Corporation | Loaded printed circuit board test fixture and method for manufacturing the same |
| TWI426366B (zh) * | 2011-01-17 | 2014-02-11 | Hon Hai Prec Ind Co Ltd | 測試點自動查找與優化系統及方法 |
| US9658252B2 (en) * | 2011-02-21 | 2017-05-23 | United Microelectronics Corp. | Probe insertion auxiliary and method of probe insertion |
| US9182425B2 (en) | 2012-05-21 | 2015-11-10 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Probe supporting and aligning apparatus |
| CN102768293B (zh) * | 2012-07-24 | 2015-03-25 | 上海交通大学 | 一种有机电致发光器件测量夹具 |
| CN107564829B (zh) * | 2017-08-24 | 2020-09-04 | 北京智芯微电子科技有限公司 | 用于tsv封装芯片的内部信号量测的方法 |
| CN110429401A (zh) * | 2019-08-07 | 2019-11-08 | 广东电网有限责任公司 | 一种可调节线夹 |
| CN111286846B (zh) * | 2020-04-15 | 2021-04-16 | 扬州市郭氏精密机械制造有限公司 | 一种织布用纱夹 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0233992A1 (de) * | 1985-11-01 | 1987-09-02 | Hewlett-Packard Company | Halterung für Leiterplattentest |
| US4897598A (en) * | 1987-03-31 | 1990-01-30 | Siemens Aktiengesellschaft | Apparatus for electrical function testing of wiring matrices, particularly of printed circuit boards |
| US4977370A (en) * | 1988-12-06 | 1990-12-11 | Genrad, Inc. | Apparatus and method for circuit board testing |
| JPH09281139A (ja) * | 1996-09-13 | 1997-10-31 | Furukawa Electric Co Ltd:The | プローバーの製造方法 |
| JP2001047001A (ja) * | 1999-08-09 | 2001-02-20 | Unitika Ltd | 飛灰の再資源化処理法 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3142817A1 (de) | 1980-10-30 | 1982-07-08 | Everett/Charles, Inc., 91730 Rancho Cucamonga, Calif. | Uebertragungseinrichtung, test-spannvorrichtung mit uebertragungseinrichtung und verfahren zur bildung einer uebertragungseinrichtung |
| US4353536A (en) * | 1981-02-04 | 1982-10-12 | Peter Mazzotta | Miter clamp |
| US4423376A (en) * | 1981-03-20 | 1983-12-27 | International Business Machines Corporation | Contact probe assembly having rotatable contacting probe elements |
| US4788496A (en) * | 1982-11-05 | 1988-11-29 | Martin Maelzer | Adapter for a printed circuit board testing device |
| US4535536A (en) * | 1983-11-03 | 1985-08-20 | Augat Inc. | Method of assembling adaptor for automatic testing equipment |
| US4774462A (en) * | 1984-06-11 | 1988-09-27 | Black Thomas J | Automatic test system |
| US4622514A (en) * | 1984-06-15 | 1986-11-11 | Ibm | Multiple mode buckling beam probe assembly |
| DE3539720A1 (de) * | 1985-11-08 | 1987-05-14 | Martin Maelzer | Adapter fuer ein leiterplattenpruefgeraet |
| US4935696A (en) * | 1987-04-16 | 1990-06-19 | Teradyne, Inc. | Test pin assembly for circuit board tester |
| US4963822A (en) * | 1988-06-01 | 1990-10-16 | Manfred Prokopp | Method of testing circuit boards and the like |
| US4904935A (en) * | 1988-11-14 | 1990-02-27 | Eaton Corporation | Electrical circuit board text fixture having movable platens |
| US5399982A (en) * | 1989-11-13 | 1995-03-21 | Mania Gmbh & Co. | Printed circuit board testing device with foil adapter |
| JPH0675415B2 (ja) * | 1991-03-15 | 1994-09-21 | 山一電機株式会社 | リードレス形icパッケージ用接続器 |
| DE4337500A1 (de) | 1993-11-03 | 1995-05-04 | Test Plus Electronic Gmbh | Zweiteilige Adaptereinrichtung |
| US5442299A (en) * | 1994-01-06 | 1995-08-15 | International Business Machines Corporation | Printed circuit board test fixture and method |
| US5493230A (en) * | 1994-02-25 | 1996-02-20 | Everett Charles Technologies, Inc. | Retention of test probes in translator fixtures |
| US5729146A (en) * | 1995-09-21 | 1998-03-17 | Everett Charles Technologies, Inc. | Quick stacking translator fixture |
| IT1282689B1 (it) * | 1996-02-26 | 1998-03-31 | Circuit Line Spa | Dispositivo di conversione della griglia di punti di test di una macchina per il test elettrico di circuiti stampati non montati |
| US5818248A (en) * | 1996-07-29 | 1998-10-06 | Delaware Capital Formation, Inc | Loaded board test fixture with integral translator fixture for testing closely spaced test sites |
| US5804984A (en) * | 1996-08-02 | 1998-09-08 | International Business Machines Corporation | Electronic component test apparatus with rotational probe |
| US5773988A (en) * | 1996-10-29 | 1998-06-30 | Hewlett-Packard Company | Standard- and limited-access hybrid test fixture |
| US6407565B1 (en) * | 1996-10-29 | 2002-06-18 | Agilent Technologies, Inc. | Loaded-board, guided-probe test fixture |
| US5945836A (en) * | 1996-10-29 | 1999-08-31 | Hewlett-Packard Company | Loaded-board, guided-probe test fixture |
| US6222377B1 (en) * | 1998-01-13 | 2001-04-24 | Masatoshi Kato | Circuit board probe device |
| US6024579A (en) * | 1998-05-29 | 2000-02-15 | The Whitaker Corporation | Electrical connector having buckling beam contacts |
| US6208158B1 (en) * | 1998-06-03 | 2001-03-27 | Schein Research, Inc. | Zero static force assembly for wireless test fixtures |
| DE19907727A1 (de) * | 1999-02-23 | 2000-08-24 | Test Plus Electronic Gmbh | Testadapter zur Kontaktierung von bestückten Leiterplatinen |
| US6414504B2 (en) * | 1999-05-20 | 2002-07-02 | Delaware Capital Formation, Inc. | Coaxial tilt pin fixture for testing high frequency circuit boards |
| FR2815127B1 (fr) * | 2000-10-05 | 2002-12-20 | Andre Sabatier | Connecteur electrique a contacts multiples |
| US6559664B2 (en) * | 2001-08-13 | 2003-05-06 | Desimone Peter | Probe plate assembly for a circuit board test fixture |
| US6878530B2 (en) * | 2002-02-07 | 2005-04-12 | Panomics, Inc. | Methods for detecting polymorphisms in nucleic acids |
| US7059046B2 (en) * | 2002-06-24 | 2006-06-13 | Delaware Capital Formation, Inc. | Method for producing a captive wired test fixture and fixture therefor |
-
2003
- 2003-06-05 US US10/454,930 patent/US7059046B2/en not_active Expired - Fee Related
- 2003-06-17 SG SG200303783A patent/SG102716A1/en unknown
- 2003-06-18 AT AT03253864T patent/ATE511096T1/de not_active IP Right Cessation
- 2003-06-18 EP EP03253864A patent/EP1376141B1/de not_active Expired - Lifetime
- 2003-06-23 MY MYPI20032339A patent/MY134274A/en unknown
- 2003-06-23 TW TW092116954A patent/TWI223098B/zh not_active IP Right Cessation
- 2003-06-24 JP JP2003179972A patent/JP4098676B2/ja not_active Expired - Fee Related
- 2003-06-24 CN CNB03148705XA patent/CN1320369C/zh not_active Expired - Fee Related
-
2006
- 2006-02-28 US US11/365,300 patent/US20060143909A1/en not_active Abandoned
- 2006-03-09 US US11/373,595 patent/US7424775B2/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0233992A1 (de) * | 1985-11-01 | 1987-09-02 | Hewlett-Packard Company | Halterung für Leiterplattentest |
| US4897598A (en) * | 1987-03-31 | 1990-01-30 | Siemens Aktiengesellschaft | Apparatus for electrical function testing of wiring matrices, particularly of printed circuit boards |
| US4977370A (en) * | 1988-12-06 | 1990-12-11 | Genrad, Inc. | Apparatus and method for circuit board testing |
| JPH09281139A (ja) * | 1996-09-13 | 1997-10-31 | Furukawa Electric Co Ltd:The | プローバーの製造方法 |
| JP2001047001A (ja) * | 1999-08-09 | 2001-02-20 | Unitika Ltd | 飛灰の再資源化処理法 |
Also Published As
| Publication number | Publication date |
|---|---|
| MY134274A (en) | 2007-11-30 |
| CN1320369C (zh) | 2007-06-06 |
| US7059046B2 (en) | 2006-06-13 |
| US20060143909A1 (en) | 2006-07-06 |
| JP2004029024A (ja) | 2004-01-29 |
| TW200401900A (en) | 2004-02-01 |
| US20030234640A1 (en) | 2003-12-25 |
| US7424775B2 (en) | 2008-09-16 |
| JP4098676B2 (ja) | 2008-06-11 |
| ATE511096T1 (de) | 2011-06-15 |
| TWI223098B (en) | 2004-11-01 |
| EP1376141A1 (de) | 2004-01-02 |
| EP1376141B1 (de) | 2011-05-25 |
| US20060151444A1 (en) | 2006-07-13 |
| CN1472540A (zh) | 2004-02-04 |
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