ATE511213T1 - Halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelements - Google Patents
Halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelementsInfo
- Publication number
- ATE511213T1 ATE511213T1 AT05777611T AT05777611T ATE511213T1 AT E511213 T1 ATE511213 T1 AT E511213T1 AT 05777611 T AT05777611 T AT 05777611T AT 05777611 T AT05777611 T AT 05777611T AT E511213 T1 ATE511213 T1 AT E511213T1
- Authority
- AT
- Austria
- Prior art keywords
- high voltage
- semiconductor component
- voltage terminal
- junctions
- membranes
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000012528 membrane Substances 0.000 abstract 5
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/40—Resistors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
- H10D10/311—Thin-film BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/421—Insulated-gate bipolar transistors [IGBT] on insulating layers or insulating substrates, e.g. thin-film IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/65—Lateral DMOS [LDMOS] FETs
- H10D30/657—Lateral DMOS [LDMOS] FETs having substrates comprising insulating layers, e.g. SOI-LDMOS transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
- H10D62/109—Reduced surface field [RESURF] PN junction structures
- H10D62/111—Multiple RESURF structures, e.g. double RESURF or 3D-RESURF structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/50—PIN diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US60689904P | 2004-09-03 | 2004-09-03 | |
| PCT/GB2005/003382 WO2006024857A1 (en) | 2004-09-03 | 2005-09-01 | Semiconductor device and method of forming a semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE511213T1 true ATE511213T1 (de) | 2011-06-15 |
Family
ID=35455735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT05777611T ATE511213T1 (de) | 2004-09-03 | 2005-09-01 | Halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelements |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7679160B2 (de) |
| EP (1) | EP1794799B1 (de) |
| AT (1) | ATE511213T1 (de) |
| WO (1) | WO2006024857A1 (de) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7994657B2 (en) | 2006-12-22 | 2011-08-09 | Solarbridge Technologies, Inc. | Modular system for unattended energy generation and storage |
| US7897998B2 (en) * | 2007-09-06 | 2011-03-01 | International Rectifier Corporation | III-nitride power semiconductor device |
| US7755916B2 (en) | 2007-10-11 | 2010-07-13 | Solarbridge Technologies, Inc. | Methods for minimizing double-frequency ripple power in single-phase power conditioners |
| US8304316B2 (en) * | 2007-12-20 | 2012-11-06 | Cambridge Semiconductor Limited | Semiconductor device and method of forming a semiconductor device |
| US8174069B2 (en) * | 2008-08-05 | 2012-05-08 | Cambridge Semiconductor Limited | Power semiconductor device and a method of forming a power semiconductor device |
| US8279642B2 (en) | 2009-07-31 | 2012-10-02 | Solarbridge Technologies, Inc. | Apparatus for converting direct current to alternating current using an active filter to reduce double-frequency ripple power of bus waveform |
| US8462518B2 (en) | 2009-10-12 | 2013-06-11 | Solarbridge Technologies, Inc. | Power inverter docking system for photovoltaic modules |
| US8859337B2 (en) * | 2009-12-15 | 2014-10-14 | Soitec | Thermal matching in semiconductor devices using heat distribution structures |
| US8415712B2 (en) * | 2009-12-29 | 2013-04-09 | Cambridge Semiconductor Limited | Lateral insulated gate bipolar transistor (LIGBT) |
| US8824178B1 (en) | 2009-12-31 | 2014-09-02 | Solarbridge Technologies, Inc. | Parallel power converter topology |
| US9160408B2 (en) | 2010-10-11 | 2015-10-13 | Sunpower Corporation | System and method for establishing communication with an array of inverters |
| US8279649B2 (en) | 2010-10-11 | 2012-10-02 | Solarbridge Technologies, Inc. | Apparatus and method for controlling a power inverter |
| US8503200B2 (en) | 2010-10-11 | 2013-08-06 | Solarbridge Technologies, Inc. | Quadrature-corrected feedforward control apparatus and method for DC-AC power conversion |
| US8842454B2 (en) | 2010-11-29 | 2014-09-23 | Solarbridge Technologies, Inc. | Inverter array with localized inverter control |
| US9467063B2 (en) | 2010-11-29 | 2016-10-11 | Sunpower Corporation | Technologies for interleaved control of an inverter array |
| US8318550B2 (en) | 2011-04-08 | 2012-11-27 | Micron Technology, Inc. | Multilayer select devices and methods related thereto |
| US8599587B2 (en) | 2011-04-27 | 2013-12-03 | Solarbridge Technologies, Inc. | Modular photovoltaic power supply assembly |
| US8611107B2 (en) | 2011-04-27 | 2013-12-17 | Solarbridge Technologies, Inc. | Method and system for controlling a multi-stage power inverter |
| US9065354B2 (en) | 2011-04-27 | 2015-06-23 | Sunpower Corporation | Multi-stage power inverter for power bus communication |
| US8922185B2 (en) | 2011-07-11 | 2014-12-30 | Solarbridge Technologies, Inc. | Device and method for global maximum power point tracking |
| US8482066B2 (en) | 2011-09-02 | 2013-07-09 | Macronix International Co., Ltd. | Semiconductor device |
| US8896021B2 (en) | 2011-09-14 | 2014-11-25 | United Microelectronics Corporation | Integrated circuit device |
| US8284574B2 (en) | 2011-10-17 | 2012-10-09 | Solarbridge Technologies, Inc. | Method and apparatus for controlling an inverter using pulse mode control |
| US9276635B2 (en) | 2012-06-29 | 2016-03-01 | Sunpower Corporation | Device, system, and method for communicating with a power inverter using power line communications |
| US9564835B2 (en) | 2013-03-15 | 2017-02-07 | Sunpower Corporation | Inverter communications using output signal |
| US9584044B2 (en) | 2013-03-15 | 2017-02-28 | Sunpower Corporation | Technologies for converter topologies |
| US9515136B2 (en) * | 2014-06-18 | 2016-12-06 | Stmicroelectronics S.R.L. | Edge termination structure for a power integrated device and corresponding manufacturing process |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1439712A1 (de) | 1964-08-08 | 1968-11-28 | Telefunken Patent | Verfahren zur Herstellung isolierter einkristalliner Bereiche mit geringer Nebenschlusskapazitaet im Halbleiterkoerper einer mikrominiaturisierten Schaltungsanordnung auf Festkoerperbasis |
| US3549963A (en) * | 1968-06-17 | 1970-12-22 | Simco Co Inc The | Back lighted electrostatic copyboard |
| US4694480A (en) * | 1985-07-30 | 1987-09-15 | Kevex Corporation | Hand held precision X-ray source |
| US5241210A (en) | 1987-02-26 | 1993-08-31 | Kabushiki Kaisha Toshiba | High breakdown voltage semiconductor device |
| US5343067A (en) | 1987-02-26 | 1994-08-30 | Kabushiki Kaisha Toshiba | High breakdown voltage semiconductor device |
| JPH05129423A (ja) | 1991-10-30 | 1993-05-25 | Rohm Co Ltd | 半導体装置及びその製造方法 |
| IT1254799B (it) | 1992-02-18 | 1995-10-11 | St Microelectronics Srl | Transistore vdmos con migliorate caratteristiche di tenuta di tensione. |
| US6008126A (en) | 1992-04-08 | 1999-12-28 | Elm Technology Corporation | Membrane dielectric isolation IC fabrication |
| US5608267A (en) * | 1992-09-17 | 1997-03-04 | Olin Corporation | Molded plastic semiconductor package including heat spreader |
| JPH06151573A (ja) | 1992-11-06 | 1994-05-31 | Hitachi Ltd | 半導体集積回路装置 |
| US6040617A (en) | 1992-12-22 | 2000-03-21 | Stmicroelectronics, Inc. | Structure to provide junction breakdown stability for deep trench devices |
| GB9305448D0 (en) | 1993-03-17 | 1993-05-05 | British Tech Group | Semiconductor structure and method of manufacturing same |
| US5373183A (en) | 1993-04-28 | 1994-12-13 | Harris Corporation | Integrated circuit with improved reverse bias breakdown |
| US5468982A (en) | 1994-06-03 | 1995-11-21 | Siliconix Incorporated | Trenched DMOS transistor with channel block at cell trench corners |
| US5631491A (en) | 1994-09-27 | 1997-05-20 | Fuji Electric Co., Ltd. | Lateral semiconductor device and method of fixing potential of the same |
| US5895972A (en) | 1996-12-31 | 1999-04-20 | Intel Corporation | Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug |
| GB2321336B (en) | 1997-01-15 | 2001-07-25 | Univ Warwick | Gas-sensing semiconductor devices |
| DE19811604B4 (de) | 1997-03-18 | 2007-07-12 | Kabushiki Kaisha Toshiba, Kawasaki | Halbleitervorrichtung |
| US6365932B1 (en) * | 1999-08-20 | 2002-04-02 | Denso Corporation | Power MOS transistor |
| US6396148B1 (en) * | 2000-02-10 | 2002-05-28 | Epic Technologies, Inc. | Electroless metal connection structures and methods |
| JP5392959B2 (ja) * | 2000-09-21 | 2014-01-22 | ケンブリッジ セミコンダクター リミテッド | 半導体デバイスおよび半導体デバイスを形成する方法 |
| EP1516369A1 (de) | 2002-06-26 | 2005-03-23 | Cambridge Semiconductor Limited | Laterale halbleiteranordnung |
-
2005
- 2005-09-01 AT AT05777611T patent/ATE511213T1/de not_active IP Right Cessation
- 2005-09-01 WO PCT/GB2005/003382 patent/WO2006024857A1/en not_active Ceased
- 2005-09-01 EP EP05777611A patent/EP1794799B1/de not_active Expired - Lifetime
- 2005-09-01 US US11/216,197 patent/US7679160B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US7679160B2 (en) | 2010-03-16 |
| WO2006024857A1 (en) | 2006-03-09 |
| EP1794799A1 (de) | 2007-06-13 |
| EP1794799B1 (de) | 2011-05-25 |
| US20060067137A1 (en) | 2006-03-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |