ATE511213T1 - Halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelements - Google Patents

Halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelements

Info

Publication number
ATE511213T1
ATE511213T1 AT05777611T AT05777611T ATE511213T1 AT E511213 T1 ATE511213 T1 AT E511213T1 AT 05777611 T AT05777611 T AT 05777611T AT 05777611 T AT05777611 T AT 05777611T AT E511213 T1 ATE511213 T1 AT E511213T1
Authority
AT
Austria
Prior art keywords
high voltage
semiconductor component
voltage terminal
junctions
membranes
Prior art date
Application number
AT05777611T
Other languages
English (en)
Inventor
Florin Udrea
Gehan Amaratunga
Original Assignee
Cambridge Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cambridge Semiconductor Ltd filed Critical Cambridge Semiconductor Ltd
Application granted granted Critical
Publication of ATE511213T1 publication Critical patent/ATE511213T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/40Resistors
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • H10D10/311Thin-film BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • H10D12/421Insulated-gate bipolar transistors [IGBT] on insulating layers or insulating substrates, e.g. thin-film IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/65Lateral DMOS [LDMOS] FETs
    • H10D30/657Lateral DMOS [LDMOS] FETs having substrates comprising insulating layers, e.g. SOI-LDMOS transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/109Reduced surface field [RESURF] PN junction structures
    • H10D62/111Multiple RESURF structures, e.g. double RESURF or 3D-RESURF structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/50PIN diodes 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/201Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6758Thin-film transistors [TFT] characterised by the insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Thin Film Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
AT05777611T 2004-09-03 2005-09-01 Halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelements ATE511213T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US60689904P 2004-09-03 2004-09-03
PCT/GB2005/003382 WO2006024857A1 (en) 2004-09-03 2005-09-01 Semiconductor device and method of forming a semiconductor device

Publications (1)

Publication Number Publication Date
ATE511213T1 true ATE511213T1 (de) 2011-06-15

Family

ID=35455735

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05777611T ATE511213T1 (de) 2004-09-03 2005-09-01 Halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelements

Country Status (4)

Country Link
US (1) US7679160B2 (de)
EP (1) EP1794799B1 (de)
AT (1) ATE511213T1 (de)
WO (1) WO2006024857A1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7994657B2 (en) 2006-12-22 2011-08-09 Solarbridge Technologies, Inc. Modular system for unattended energy generation and storage
US7897998B2 (en) * 2007-09-06 2011-03-01 International Rectifier Corporation III-nitride power semiconductor device
US7755916B2 (en) 2007-10-11 2010-07-13 Solarbridge Technologies, Inc. Methods for minimizing double-frequency ripple power in single-phase power conditioners
US8304316B2 (en) * 2007-12-20 2012-11-06 Cambridge Semiconductor Limited Semiconductor device and method of forming a semiconductor device
US8174069B2 (en) * 2008-08-05 2012-05-08 Cambridge Semiconductor Limited Power semiconductor device and a method of forming a power semiconductor device
US8279642B2 (en) 2009-07-31 2012-10-02 Solarbridge Technologies, Inc. Apparatus for converting direct current to alternating current using an active filter to reduce double-frequency ripple power of bus waveform
US8462518B2 (en) 2009-10-12 2013-06-11 Solarbridge Technologies, Inc. Power inverter docking system for photovoltaic modules
US8859337B2 (en) * 2009-12-15 2014-10-14 Soitec Thermal matching in semiconductor devices using heat distribution structures
US8415712B2 (en) * 2009-12-29 2013-04-09 Cambridge Semiconductor Limited Lateral insulated gate bipolar transistor (LIGBT)
US8824178B1 (en) 2009-12-31 2014-09-02 Solarbridge Technologies, Inc. Parallel power converter topology
US9160408B2 (en) 2010-10-11 2015-10-13 Sunpower Corporation System and method for establishing communication with an array of inverters
US8279649B2 (en) 2010-10-11 2012-10-02 Solarbridge Technologies, Inc. Apparatus and method for controlling a power inverter
US8503200B2 (en) 2010-10-11 2013-08-06 Solarbridge Technologies, Inc. Quadrature-corrected feedforward control apparatus and method for DC-AC power conversion
US8842454B2 (en) 2010-11-29 2014-09-23 Solarbridge Technologies, Inc. Inverter array with localized inverter control
US9467063B2 (en) 2010-11-29 2016-10-11 Sunpower Corporation Technologies for interleaved control of an inverter array
US8318550B2 (en) 2011-04-08 2012-11-27 Micron Technology, Inc. Multilayer select devices and methods related thereto
US8599587B2 (en) 2011-04-27 2013-12-03 Solarbridge Technologies, Inc. Modular photovoltaic power supply assembly
US8611107B2 (en) 2011-04-27 2013-12-17 Solarbridge Technologies, Inc. Method and system for controlling a multi-stage power inverter
US9065354B2 (en) 2011-04-27 2015-06-23 Sunpower Corporation Multi-stage power inverter for power bus communication
US8922185B2 (en) 2011-07-11 2014-12-30 Solarbridge Technologies, Inc. Device and method for global maximum power point tracking
US8482066B2 (en) 2011-09-02 2013-07-09 Macronix International Co., Ltd. Semiconductor device
US8896021B2 (en) 2011-09-14 2014-11-25 United Microelectronics Corporation Integrated circuit device
US8284574B2 (en) 2011-10-17 2012-10-09 Solarbridge Technologies, Inc. Method and apparatus for controlling an inverter using pulse mode control
US9276635B2 (en) 2012-06-29 2016-03-01 Sunpower Corporation Device, system, and method for communicating with a power inverter using power line communications
US9564835B2 (en) 2013-03-15 2017-02-07 Sunpower Corporation Inverter communications using output signal
US9584044B2 (en) 2013-03-15 2017-02-28 Sunpower Corporation Technologies for converter topologies
US9515136B2 (en) * 2014-06-18 2016-12-06 Stmicroelectronics S.R.L. Edge termination structure for a power integrated device and corresponding manufacturing process

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1439712A1 (de) 1964-08-08 1968-11-28 Telefunken Patent Verfahren zur Herstellung isolierter einkristalliner Bereiche mit geringer Nebenschlusskapazitaet im Halbleiterkoerper einer mikrominiaturisierten Schaltungsanordnung auf Festkoerperbasis
US3549963A (en) * 1968-06-17 1970-12-22 Simco Co Inc The Back lighted electrostatic copyboard
US4694480A (en) * 1985-07-30 1987-09-15 Kevex Corporation Hand held precision X-ray source
US5241210A (en) 1987-02-26 1993-08-31 Kabushiki Kaisha Toshiba High breakdown voltage semiconductor device
US5343067A (en) 1987-02-26 1994-08-30 Kabushiki Kaisha Toshiba High breakdown voltage semiconductor device
JPH05129423A (ja) 1991-10-30 1993-05-25 Rohm Co Ltd 半導体装置及びその製造方法
IT1254799B (it) 1992-02-18 1995-10-11 St Microelectronics Srl Transistore vdmos con migliorate caratteristiche di tenuta di tensione.
US6008126A (en) 1992-04-08 1999-12-28 Elm Technology Corporation Membrane dielectric isolation IC fabrication
US5608267A (en) * 1992-09-17 1997-03-04 Olin Corporation Molded plastic semiconductor package including heat spreader
JPH06151573A (ja) 1992-11-06 1994-05-31 Hitachi Ltd 半導体集積回路装置
US6040617A (en) 1992-12-22 2000-03-21 Stmicroelectronics, Inc. Structure to provide junction breakdown stability for deep trench devices
GB9305448D0 (en) 1993-03-17 1993-05-05 British Tech Group Semiconductor structure and method of manufacturing same
US5373183A (en) 1993-04-28 1994-12-13 Harris Corporation Integrated circuit with improved reverse bias breakdown
US5468982A (en) 1994-06-03 1995-11-21 Siliconix Incorporated Trenched DMOS transistor with channel block at cell trench corners
US5631491A (en) 1994-09-27 1997-05-20 Fuji Electric Co., Ltd. Lateral semiconductor device and method of fixing potential of the same
US5895972A (en) 1996-12-31 1999-04-20 Intel Corporation Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug
GB2321336B (en) 1997-01-15 2001-07-25 Univ Warwick Gas-sensing semiconductor devices
DE19811604B4 (de) 1997-03-18 2007-07-12 Kabushiki Kaisha Toshiba, Kawasaki Halbleitervorrichtung
US6365932B1 (en) * 1999-08-20 2002-04-02 Denso Corporation Power MOS transistor
US6396148B1 (en) * 2000-02-10 2002-05-28 Epic Technologies, Inc. Electroless metal connection structures and methods
JP5392959B2 (ja) * 2000-09-21 2014-01-22 ケンブリッジ セミコンダクター リミテッド 半導体デバイスおよび半導体デバイスを形成する方法
EP1516369A1 (de) 2002-06-26 2005-03-23 Cambridge Semiconductor Limited Laterale halbleiteranordnung

Also Published As

Publication number Publication date
US7679160B2 (en) 2010-03-16
WO2006024857A1 (en) 2006-03-09
EP1794799A1 (de) 2007-06-13
EP1794799B1 (de) 2011-05-25
US20060067137A1 (en) 2006-03-30

Similar Documents

Publication Publication Date Title
ATE511213T1 (de) Halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelements
ATE545958T1 (de) Halbleiterbauelement und dessen herstellungsverfahren
EP4318595A3 (de) Halbleiteranordnung
ATE319177T1 (de) Hybrid-leistungsschalter
TW200729557A (en) Optoelectronic component, device with several optoelectronic components and method to produce an optoelectronic component
ATE470983T1 (de) Schaltzelle sowie umrichterschaltung zur schaltung einer vielzahl von spannungsniveaus mit einer solchen schaltzelle
EP1684357A3 (de) Hochspannungshalbleiteranordnungen
ATE545192T1 (de) Statischer umformer und verfahren zum anfahren des umformers
WO2008057438A3 (en) Power switching semiconductor devices including rectifying junction-shunts
ATE512463T1 (de) Leistungshalbleitermodul in druckkontaktausführung sowie verfahren zur herstellung desselben
DE602005027316D1 (de) Verfahren zur herstellung von vertikal-kohlenstoff-nanoröhren-feldeffekttransistoren zur anordnung in arrays und dadurch gebildete feldeffekttransistoren und arrays
EP1705714A3 (de) Feldeffekttransistor und Verfahren zur Herstellung
WO2011093953A3 (en) High voltage scrmos in bicmos process technologies
EP1959491A3 (de) Halbleiterbauelement und Verfahren zu seiner Herstellung
ES2152919T3 (es) Procedimiento de utilizacion de un dispositivo semiconductor que comprende un sustrato que tiene un islote semiconductor dielectricamente aislado.
EP1622238A3 (de) Oberflächenemittierende Lichtquelle und deren Herstellungsverfahren
DE502007004984D1 (de) Elektrisches Anhängeranschlussgerät
DE602005013426D1 (de) Protonenleiter
EP4604311A4 (de) Batteriemodul, batterie und elektrische vorrichtung
EP2058854A3 (de) Halbleiterbauelement
WO2007010472A3 (en) Path sharing high-voltage esd protection using distributed low-voltage clamps
ATE509371T1 (de) Technik zur dimensionierung und plazierung von leistungsschaltern in einer integrierten schaltung
EP1341233A3 (de) Halbleiterbauelement und dessen Verwendung in einer Flüssigkeitsstrahl-Vorrichtung
EP4170682A4 (de) Protonenleitende zellstruktur, protonenleiter, elektrochemische vorrichtung und verfahren zur herstellung des protonenleiters
WO2007028016A3 (en) Bipolar method and structure with depletable collector colums

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties