ATE511744T1 - Elektronisches bauelement und verfahren zu dessen herstellung - Google Patents

Elektronisches bauelement und verfahren zu dessen herstellung

Info

Publication number
ATE511744T1
ATE511744T1 AT04770224T AT04770224T ATE511744T1 AT E511744 T1 ATE511744 T1 AT E511744T1 AT 04770224 T AT04770224 T AT 04770224T AT 04770224 T AT04770224 T AT 04770224T AT E511744 T1 ATE511744 T1 AT E511744T1
Authority
AT
Austria
Prior art keywords
production
electronic component
component
cavity
hole
Prior art date
Application number
AT04770224T
Other languages
English (en)
Inventor
Montfort Vincent Van
Fransiscus Verweg
Roel Kusters
Original Assignee
Chimei Innolux Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34443022&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE511744(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Chimei Innolux Corp filed Critical Chimei Innolux Corp
Application granted granted Critical
Publication of ATE511744T1 publication Critical patent/ATE511744T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4255—Moulded or casted packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H05K1/186—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H05K1/187—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Multi-Conductor Connections (AREA)
AT04770224T 2003-10-15 2004-10-11 Elektronisches bauelement und verfahren zu dessen herstellung ATE511744T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP03103824 2003-10-15
PCT/IB2004/052051 WO2005039260A1 (en) 2003-10-15 2004-10-11 Electronic device and method of manufacturing thereof

Publications (1)

Publication Number Publication Date
ATE511744T1 true ATE511744T1 (de) 2011-06-15

Family

ID=34443022

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04770224T ATE511744T1 (de) 2003-10-15 2004-10-11 Elektronisches bauelement und verfahren zu dessen herstellung

Country Status (6)

Country Link
US (1) US7433202B2 (de)
EP (1) EP1676471B1 (de)
JP (1) JP5068075B2 (de)
CN (1) CN100566507C (de)
AT (1) ATE511744T1 (de)
WO (1) WO2005039260A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006059127A1 (de) 2006-09-25 2008-03-27 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Anordnung optoelektronischer Bauelemente und Anordnung optoelektronischer Bauelemente
DE102009008738A1 (de) 2009-02-12 2010-08-19 Osram Opto Semiconductors Gmbh Halbleiteranordnung und Verfahren zum Herstellen einer Halbleiteranordnung
WO2015064642A1 (ja) * 2013-10-30 2015-05-07 京セラ株式会社 配線基板およびこれを用いた実装構造体

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
DE4141775A1 (de) * 1991-12-18 1993-06-24 Manfred Band Verfahren zur herstellung einer elektronischen schaltung
JPH05169885A (ja) * 1991-12-26 1993-07-09 Mitsubishi Electric Corp 薄型ｉｃカード
US5723363A (en) * 1995-09-29 1998-03-03 Siemens Components, Inc. Method of manufacturing a semiconductor device
DE19708615C1 (de) * 1997-03-03 1998-07-23 Siemens Ag Chipkartenmodul und diesen umfassende Chipkarte
JP3699609B2 (ja) * 1999-04-28 2005-09-28 京セラ株式会社 電子部品搭載用基板
JP2001077277A (ja) * 1999-09-03 2001-03-23 Sony Corp 半導体パッケージおよび半導体パッケージ製造方法
JP2002270901A (ja) * 2001-03-12 2002-09-20 Citizen Electronics Co Ltd 発光ダイオードとその製造方法
EP1436773A1 (de) * 2001-10-09 2004-07-14 NagraID S.A. Elektronisches modul mit einem schutzhöcker
FR2833801B1 (fr) * 2001-12-19 2005-07-01 Oberthur Card Syst Sa Procede de realisation d'une carte a microcircuit
US6674652B2 (en) * 2002-01-29 2004-01-06 3Com Corporation Integrated shield wrap
US6873529B2 (en) * 2002-02-26 2005-03-29 Kyocera Corporation High frequency module
US7084935B2 (en) * 2002-08-28 2006-08-01 Adaptive Micro Systems, Llc Display device with molded light guide
DE10320990A1 (de) * 2003-05-09 2004-11-25 Dr. Johannes Heidenhain Gmbh Induktiver Drehwinkelsensor und damit ausgestatteter Drehgeber
JP4433909B2 (ja) * 2004-07-07 2010-03-17 Ｔｄｋ株式会社 表面実装型電子部品

Also Published As

Publication number Publication date
EP1676471A1 (de) 2006-07-05
EP1676471B1 (de) 2011-06-01
US7433202B2 (en) 2008-10-07
JP5068075B2 (ja) 2012-11-07
CN1868243A (zh) 2006-11-22
WO2005039260A1 (en) 2005-04-28
US20070075034A1 (en) 2007-04-05
CN100566507C (zh) 2009-12-02
JP2007508707A (ja) 2007-04-05

Similar Documents

Publication Publication Date Title
FI20030493A0 (fi) Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
ATE250806T1 (de) Verfahren zur vertikalen integration von elektrischen bauelementen mittels rückseitenkontaktierung
DE69408558D1 (de) Verwendung einer anisotropischen leitfähigen Schicht für die Verbindung von Anschlussleitern einer Leiterplatte mit den elektrischen Anschlusskontakten einer photoelektrischen Umwandlungsvorrichtung und Verfahren zur Montage dieser Vorrichtung
ATE521113T1 (de) Durchführung für elektrische verbinder
WO2005076353A3 (en) Apparatus incorporating small-feature-size and large-feature-size components and method for making same
WO2000013190A8 (en) Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part
DE60007130T2 (de) Verbinder und Verfahren zum Herstellen lötfreier Verbindungen zwischen einer starren Hauptleiterplatte und zugeordneten Leitern
ATE369030T1 (de) Verfahren zur durchführung von elektronischen bauteilen in durchgangslöchern eines mehrschichtigen multichip-moduls
KR101543628B1 (ko) 플렉서블 전자기판 및 이의 제조방법
TW200638145A (en) Display apparatus and method of manufacturing the same
SE9802157L (sv) Elektrisk komponent
DE502004004419D1 (de) Elektrische Anschluss- und Verbindungsdose
ATE511744T1 (de) Elektronisches bauelement und verfahren zu dessen herstellung
DE60123870D1 (de) Verbinder für Kabel und Bausatz für dessen Zusammenbau
TWI267173B (en) Circuit device and method for manufacturing thereof
DE60212299D1 (de) Pin-grid-array elektrischer Steckverbinder
TW200501181A (en) Apparatus and method for testing electronic component
DE60104573D1 (de) Gedruckte Schaltungsplatte, elektrisches Verbindungsgehäuse mit dieser Schaltungsplatte und Verfahren zur Herstellung
TW200520157A (en) Device and method for manufacturing the same
TW200505303A (en) Flexible substrate and a connection method thereof that can achieve reliable connection
DE59707245D1 (de) Verfahren und vorrichtung zur herstellung von drahtgeschriebenen leiterplatten
DE602004027949D1 (de) Elektrisches kontaktelement für elektrische mittel- oder hochspanungsgeräte und entsprechendes verfahren und geräte
TW200420205A (en) Core substrate with emebdded resistors and method for fabricting the same
DE112004001225D2 (de) Steckverbinder zur elektrischen Verbindung elektronischer Komponenten
EP0852451A3 (de) Hörhilfegerät

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties