ATE514196T1 - Positionierungseinrichtung zum positionieren einer oder mehrerer elektronischer leiterplatten insbesondere für photovoltaikzellen in einer metallabscheidungseinheit - Google Patents

Positionierungseinrichtung zum positionieren einer oder mehrerer elektronischer leiterplatten insbesondere für photovoltaikzellen in einer metallabscheidungseinheit

Info

Publication number
ATE514196T1
ATE514196T1 AT07847831T AT07847831T ATE514196T1 AT E514196 T1 ATE514196 T1 AT E514196T1 AT 07847831 T AT07847831 T AT 07847831T AT 07847831 T AT07847831 T AT 07847831T AT E514196 T1 ATE514196 T1 AT E514196T1
Authority
AT
Austria
Prior art keywords
positioning
electronic circuit
circuit boards
photovoltaic cells
metal deposition
Prior art date
Application number
AT07847831T
Other languages
English (en)
Inventor
Andrea Baccini
Original Assignee
Applied Materials Italia Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39535389&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE514196(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Applied Materials Italia Srl filed Critical Applied Materials Italia Srl
Application granted granted Critical
Publication of ATE514196T1 publication Critical patent/ATE514196T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0863—Machines with a plurality of flat screens mounted on a turntable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/137—Batch treatment of the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/137—Batch treatment of the devices
    • H10F71/1375—Apparatus for automatic interconnection of photovoltaic cells in a module
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Photovoltaic Devices (AREA)
  • Control Of Position Or Direction (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
AT07847831T 2007-09-04 2007-12-05 Positionierungseinrichtung zum positionieren einer oder mehrerer elektronischer leiterplatten insbesondere für photovoltaikzellen in einer metallabscheidungseinheit ATE514196T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT000156A ITUD20070156A1 (it) 2007-09-04 2007-09-04 Disositivo di posizionamento per posizionare uno o piu' wafer a base di silicio, in particolare per celle fotovoltaiche, in un'unita' di deposizione del metallo
PCT/EP2007/063336 WO2009030284A1 (en) 2007-09-04 2007-12-05 Positioning device to position one or more electronic circuit boards, in particular for photovoltaic cells, in a metal-deposition unit

Publications (1)

Publication Number Publication Date
ATE514196T1 true ATE514196T1 (de) 2011-07-15

Family

ID=39535389

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07847831T ATE514196T1 (de) 2007-09-04 2007-12-05 Positionierungseinrichtung zum positionieren einer oder mehrerer elektronischer leiterplatten insbesondere für photovoltaikzellen in einer metallabscheidungseinheit

Country Status (11)

Country Link
US (1) US20100254787A1 (de)
EP (1) EP2208237B2 (de)
JP (1) JP5090533B2 (de)
KR (1) KR20100075879A (de)
CN (2) CN101971362B (de)
AT (1) ATE514196T1 (de)
ES (1) ES2368279T5 (de)
IT (1) ITUD20070156A1 (de)
MY (1) MY146210A (de)
TW (3) TW201513386A (de)
WO (1) WO2009030284A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITUD20070156A1 (it) * 2007-09-04 2009-03-05 Baccini S P A Disositivo di posizionamento per posizionare uno o piu' wafer a base di silicio, in particolare per celle fotovoltaiche, in un'unita' di deposizione del metallo
ITUD20070198A1 (it) * 2007-10-24 2009-04-25 Baccini S P A Dispositivo di posizionamento per posizionare una o piu' piastre di circuiti elettronici, in un'unita' di deposizione del metallo, e relativo procedimento
CN101961947B (zh) * 2010-10-12 2012-12-05 东莞市科隆威自动化设备有限公司 光伏太阳能硅片印刷机
JP5553803B2 (ja) * 2011-08-01 2014-07-16 株式会社日立製作所 パネルの印刷装置
CN102431281B (zh) * 2011-09-23 2014-01-15 湖南红太阳光电科技有限公司 一种丝网印刷机定位夹持机构
JP5912764B2 (ja) 2012-03-29 2016-04-27 平田機工株式会社 搬送ユニット及び搬送装置
ITUD20120082A1 (it) * 2012-05-09 2013-11-10 Applied Materials Italia Srl Metodo per controllare la posizione di stampa su almeno un substrato
ITUD20120149A1 (it) * 2012-08-31 2014-03-01 Applied Materials Italia Srl Metodo ed apparato di stampa di uno schema su un substrato
DE102017204630A1 (de) 2017-03-20 2018-09-20 Ekra Automatisierungssysteme Gmbh Druckvorrichtung
JP6727568B2 (ja) * 2018-10-16 2020-07-22 上野精機株式会社 電子部品搬送設備
CN110962442B (zh) * 2019-12-29 2024-01-23 连城凯克斯科技有限公司 卷纸式硅片传输装置、硅片传输方法、转盘及丝网印刷机
CN116118336B (zh) * 2023-04-05 2023-07-18 江苏龙恒新能源有限公司 一种用于太阳能电池硅片的印刷定位设备
CN116454173B (zh) * 2023-06-16 2023-09-05 临沂鼎鑫新能源有限公司 一种光伏电池制备装置及其制备方法
CN117080295B (zh) * 2023-07-17 2024-01-16 润达光伏盐城有限公司 一种光伏组件装配装置及光伏组件装配线

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US4261680A (en) * 1979-06-06 1981-04-14 Carnley F Paul Apparatus for orienting articles having an enlarged end
JPS60137723U (ja) * 1984-02-20 1985-09-12 株式会社ダイフク 荷搬送車の荷載置装置
IT1190091B (it) * 1985-04-26 1988-02-10 Hauni Werke Koerber & Co Kg Dispositivo per sorvegliare un trasportatore tessile per un filone dell'industria di lavorazione del tabacco
SE460109B (sv) * 1986-10-15 1989-09-11 Svecia Silkscreen Maskiner Ab Stenciltryckmaskin
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ITUD20070156A1 (it) * 2007-09-04 2009-03-05 Baccini S P A Disositivo di posizionamento per posizionare uno o piu' wafer a base di silicio, in particolare per celle fotovoltaiche, in un'unita' di deposizione del metallo
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Also Published As

Publication number Publication date
ES2368279T5 (es) 2014-06-04
TW201712886A (zh) 2017-04-01
ES2368279T3 (es) 2011-11-16
TW201513386A (zh) 2015-04-01
JP5090533B2 (ja) 2012-12-05
CN101971362A (zh) 2011-02-09
TWI622185B (zh) 2018-04-21
US20100254787A1 (en) 2010-10-07
CN101971362B (zh) 2013-05-15
TW200921927A (en) 2009-05-16
EP2208237B1 (de) 2011-06-22
WO2009030284A8 (en) 2010-10-07
MY146210A (en) 2012-07-31
CN103107122B (zh) 2015-11-25
WO2009030284A1 (en) 2009-03-12
KR20100075879A (ko) 2010-07-05
JP2010538481A (ja) 2010-12-09
TWI473288B (zh) 2015-02-11
EP2208237B2 (de) 2014-04-16
EP2208237A1 (de) 2010-07-21
ITUD20070156A1 (it) 2009-03-05
CN103107122A (zh) 2013-05-15

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