ATE517324T1 - Vorrichtung zur erkennung und/oder ausstrahlung von elektromagnetischen strahlen, und herstellungsverfahren einer solchen vorrichtung - Google Patents
Vorrichtung zur erkennung und/oder ausstrahlung von elektromagnetischen strahlen, und herstellungsverfahren einer solchen vorrichtungInfo
- Publication number
- ATE517324T1 ATE517324T1 AT10354028T AT10354028T ATE517324T1 AT E517324 T1 ATE517324 T1 AT E517324T1 AT 10354028 T AT10354028 T AT 10354028T AT 10354028 T AT10354028 T AT 10354028T AT E517324 T1 ATE517324 T1 AT E517324T1
- Authority
- AT
- Austria
- Prior art keywords
- getter
- reflector
- detecting
- housing
- producing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000005855 radiation Effects 0.000 title 1
- 230000005670 electromagnetic radiation Effects 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/041—Mountings in enclosures or in a particular environment
- G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Micromachines (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0902875A FR2946777B1 (fr) | 2009-06-12 | 2009-06-12 | Dispositif de detection et/ou d'emission de rayonnement electromagnetique et procede de fabrication d'un tel dispositif |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE517324T1 true ATE517324T1 (de) | 2011-08-15 |
Family
ID=41506477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT10354028T ATE517324T1 (de) | 2009-06-12 | 2010-06-04 | Vorrichtung zur erkennung und/oder ausstrahlung von elektromagnetischen strahlen, und herstellungsverfahren einer solchen vorrichtung |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8247771B2 (de) |
| EP (1) | EP2261620B8 (de) |
| JP (1) | JP5507349B2 (de) |
| CN (1) | CN102012269B (de) |
| AT (1) | ATE517324T1 (de) |
| FR (1) | FR2946777B1 (de) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007048564A1 (de) * | 2007-10-09 | 2009-04-23 | Heraeus Noblelight Gmbh | Vorrichtung für eine Bestrahlungseinheit |
| JP2011153871A (ja) * | 2010-01-26 | 2011-08-11 | Seiko Epson Corp | 熱型光検出器、熱型光検出装置及び電子機器 |
| FR2982073B1 (fr) * | 2011-10-28 | 2014-10-10 | Commissariat Energie Atomique | Structure d'encapsulation hermetique d'un dispositif et d'un composant electronique |
| US8879275B2 (en) * | 2012-02-21 | 2014-11-04 | International Business Machines Corporation | Anti-corrosion conformal coating comprising modified porous silica fillers for metal conductors electrically connecting an electronic component |
| JP5939385B2 (ja) * | 2012-04-13 | 2016-06-22 | 日本電気株式会社 | 赤外線センサパッケージ、赤外線センサモジュール、および電子機器 |
| JP6055270B2 (ja) * | 2012-10-26 | 2016-12-27 | キヤノン株式会社 | 固体撮像装置、その製造方法、およびカメラ |
| US9029773B2 (en) * | 2013-02-24 | 2015-05-12 | Vlad Novotny | Sealed infrared imagers |
| US20140267756A1 (en) * | 2013-03-14 | 2014-09-18 | Qualcomm Mems Technologies, Inc. | Microbolometer supported by glass substrate |
| NO2944700T3 (de) | 2013-07-11 | 2018-03-17 | ||
| CN103500788B (zh) * | 2013-10-23 | 2015-11-25 | 中北大学 | 一种可集成的纳米结构红外光源 |
| TW201525442A (zh) * | 2013-12-27 | 2015-07-01 | 菱生精密工業股份有限公司 | 微型封裝結構之氣體感知器及其製造方法 |
| DE102014213369B4 (de) * | 2014-07-09 | 2018-11-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Strahlungsdetektor und verfahren zur herstellung eines strahlungsdetektors und array von solchen strahlungsdetektoren |
| FR3030475B1 (fr) * | 2014-12-17 | 2017-01-20 | Commissariat Energie Atomique | Structure getter multi-niveaux et structure d'encapsulation comportant une telle structure getter multi-niveaux |
| JP6544730B2 (ja) | 2015-01-30 | 2019-07-17 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 半導体部品を製造するための方法および半導体部品 |
| FR3033044B1 (fr) * | 2015-02-20 | 2020-02-28 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif de detection de rayonnement comportant une structure d'encapsulation a tenue mecanique amelioree |
| FR3033045B1 (fr) * | 2015-02-20 | 2020-02-28 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif de detection de rayonnement electromagnetique a structure d'encapsulation hermetique a event de liberation |
| FR3033043B1 (fr) * | 2015-02-20 | 2020-02-28 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif de detection de rayonnement comportant une structure d'encapsulation a tenue mecanique amelioree |
| FR3050870B1 (fr) * | 2016-04-28 | 2018-05-25 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de realisation d’un dispositif de detection de rayonnement electromagnetique comportant une couche en un materiau getter |
| CN105977221B (zh) * | 2016-04-28 | 2018-11-06 | 清华大学 | 气密性封装结构及封装方法 |
| CN107742654B (zh) * | 2016-08-10 | 2019-06-04 | 菱光科技股份有限公司 | 红外线传感器高真空封装结构及其方法 |
| FR3066044B1 (fr) * | 2017-05-02 | 2020-02-21 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Detecteur de rayonnement electromagnetique, encapsule par report de couche mince. |
| FR3070096B1 (fr) * | 2017-08-08 | 2021-09-17 | Commissariat Energie Atomique | Procede de fabrication d'un dispositif de detection a deux substrats et un tel dispositif de detection |
| CN111356907B (zh) | 2017-08-31 | 2023-06-23 | 芬兰国家技术研究中心股份公司 | 热探测器及热探测器阵列 |
| GB201817697D0 (en) | 2018-10-23 | 2018-12-19 | Mbda Uk Ltd | Electric field sensor |
| CN109782201B (zh) * | 2019-02-12 | 2020-12-01 | 宴晶科技(北京)有限公司 | 一种微波材料电磁参数测量仪器及测量方法 |
| CN109950328A (zh) * | 2019-04-11 | 2019-06-28 | 江苏鼎茂半导体有限公司 | 一种红外感测器真空封装结构及真空封装方法 |
| FR3101414B1 (fr) * | 2019-09-30 | 2021-09-03 | Commissariat Energie Atomique | procede de fabrication d’un dispositif de detection de rayonnement electromagnétique comportant un materiau getter |
| FR3103552B1 (fr) * | 2019-11-22 | 2021-12-10 | Commissariat Energie Atomique | procede de fabrication d’un dispositif de detection presentant une protection amelioree du getter |
| FR3109936B1 (fr) * | 2020-05-07 | 2022-08-05 | Lynred | Procede de fabrication d’un microsysteme electromecanique et microsysteme electromecanique |
| US11670616B2 (en) * | 2020-06-22 | 2023-06-06 | Epir, Inc. | Modified direct bond interconnect for FPAs |
| CN114295644B (zh) * | 2022-01-11 | 2023-01-03 | 温州市大荣纺织仪器有限公司 | 一种织物防电磁辐射性能测试仪及其测试方法 |
| CN118511286A (zh) * | 2022-01-25 | 2024-08-16 | 烟台睿创微纳技术股份有限公司 | 微测辐射热计及其制备方法 |
| DE102022210970A1 (de) * | 2022-10-18 | 2024-04-18 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mikromechanische Vorrichtung mit einer Wasserstoff-Drainage-Schicht |
| CN116222791A (zh) * | 2023-01-10 | 2023-06-06 | 杭州大立微电子有限公司 | 微测辐射热计及其制造方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0734589B1 (de) | 1993-12-13 | 1998-03-25 | Honeywell Inc. | Integrierte silizium-vakuum-mikropackung für infrarot-geräte |
| US5921461A (en) | 1997-06-11 | 1999-07-13 | Raytheon Company | Vacuum package having vacuum-deposited local getter and its preparation |
| JPH11326037A (ja) | 1998-05-12 | 1999-11-26 | Mitsubishi Electric Corp | 赤外線検出器用真空パッケージ及びその製造方法 |
| JP2000337959A (ja) | 1999-05-28 | 2000-12-08 | Mitsubishi Electric Corp | 赤外線検出器及びその製造方法 |
| FR2816447B1 (fr) * | 2000-11-07 | 2003-01-31 | Commissariat Energie Atomique | Dispositif de detection de rayonnements electromagnetiques tridimensionnel et procede de realisation de ce dispositif |
| FR2822541B1 (fr) * | 2001-03-21 | 2003-10-03 | Commissariat Energie Atomique | Procedes et dispositifs de fabrication de detecteurs de rayonnement |
| FR2842022B1 (fr) | 2002-07-03 | 2005-05-06 | Commissariat Energie Atomique | Dispositif de maintien d'un objet sous vide et procedes de fabrication de ce dispositif, application aux detecteurs intrarouges non refroidis |
| JP3767591B2 (ja) * | 2003-09-25 | 2006-04-19 | 日産自動車株式会社 | 赤外線検出器 |
| JP2005241457A (ja) * | 2004-02-26 | 2005-09-08 | Hamamatsu Photonics Kk | 赤外線センサ及びその製造方法 |
| JP4784399B2 (ja) * | 2006-05-29 | 2011-10-05 | 日産自動車株式会社 | 赤外線センサおよびその製造方法 |
| JP5098224B2 (ja) * | 2006-06-02 | 2012-12-12 | 日産自動車株式会社 | 半導体パッケージ |
| JP5114898B2 (ja) * | 2006-09-07 | 2013-01-09 | 日産自動車株式会社 | パッケージ型電子部品及びパッケージ型電子部品の製造方法 |
-
2009
- 2009-06-12 FR FR0902875A patent/FR2946777B1/fr not_active Expired - Fee Related
-
2010
- 2010-05-10 US US12/776,935 patent/US8247771B2/en not_active Expired - Fee Related
- 2010-06-03 EP EP10354028A patent/EP2261620B8/de not_active Not-in-force
- 2010-06-04 AT AT10354028T patent/ATE517324T1/de not_active IP Right Cessation
- 2010-06-11 JP JP2010134071A patent/JP5507349B2/ja not_active Expired - Fee Related
- 2010-06-12 CN CN201010212853.3A patent/CN102012269B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP5507349B2 (ja) | 2014-05-28 |
| FR2946777B1 (fr) | 2011-07-22 |
| CN102012269A (zh) | 2011-04-13 |
| JP2011039036A (ja) | 2011-02-24 |
| US20100314544A1 (en) | 2010-12-16 |
| EP2261620A1 (de) | 2010-12-15 |
| EP2261620B1 (de) | 2011-07-20 |
| EP2261620B8 (de) | 2012-02-15 |
| CN102012269B (zh) | 2014-10-15 |
| FR2946777A1 (fr) | 2010-12-17 |
| US8247771B2 (en) | 2012-08-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |