ATE517960T1 - Ceroxidschleifmittel und diese enthaltende aufschlämmung - Google Patents

Ceroxidschleifmittel und diese enthaltende aufschlämmung

Info

Publication number: ATE517960T1
Authority: AT; Austria
Prior art keywords: sub; polishing; same; slurry containing; cerium oxide
Prior art date: 2005-01-26

Application number

AT06715744T

Other languages

English (en)

Inventor

Jun-Seok Nho

Myoung-Hwan Oh

Jang-Yul Kim

Seung-Beom Cho

Jong-Pil Kim

Original Assignee

Lg Chemical Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2005-01-26

Filing date

2006-01-24

Publication date

2011-08-15

2006-01-24 Application filed by Lg Chemical Ltd filed Critical Lg Chemical Ltd

2011-08-15 Application granted granted Critical

2011-08-15 Publication of ATE517960T1 publication Critical patent/ATE517960T1/de

Links

239000002002 slurry Substances 0.000 title abstract 3
239000003082 abrasive agent Substances 0.000 title 1
238000005498 polishing Methods 0.000 abstract 4
229910000420 cerium oxide Inorganic materials 0.000 abstract 3
BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 abstract 3
229910052684 Cerium Inorganic materials 0.000 abstract 1
GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 abstract 1
GHLITDDQOMIBFS-UHFFFAOYSA-H cerium(3+);tricarbonate Chemical compound [Ce+3].[Ce+3].[O-]C([O-])=O.[O-]C([O-])=O.[O-]C([O-])=O GHLITDDQOMIBFS-UHFFFAOYSA-H 0.000 abstract 1
239000013078 crystal Substances 0.000 abstract 1
239000002245 particle Substances 0.000 abstract 1
239000002994 raw material Substances 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F17/00—Compounds of rare earth metals
- C01F17/20—Compounds containing only rare earth metals as the metal element
- C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
- C01F17/224—Oxides or hydroxides of lanthanides
- C01F17/235—Cerium oxides or hydroxides
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/03—Particle morphology depicted by an image obtained by SEM
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/04—Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Organic Chemistry (AREA)
Materials Engineering (AREA)
Nanotechnology (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Crystallography & Structural Chemistry (AREA)
Physics & Mathematics (AREA)
Composite Materials (AREA)
Life Sciences & Earth Sciences (AREA)
Geology (AREA)
Inorganic Chemistry (AREA)
Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
Mechanical Treatment Of Semiconductor (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Polishing Bodies And Polishing Tools (AREA)

AT06715744T 2005-01-26 2006-01-24 Ceroxidschleifmittel und diese enthaltende aufschlämmung ATE517960T1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
KR20050007153		2005-01-26
PCT/KR2006/000271 WO2006080796A1 (en)	2005-01-26	2006-01-24	Cerium oxide abrasive and slurry containing the same

Publications (1)

Publication Number	Publication Date
ATE517960T1 true ATE517960T1 (de)	2011-08-15

Family

ID=36695187

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT06715744T ATE517960T1 (de)	2005-01-26	2006-01-24	Ceroxidschleifmittel und diese enthaltende aufschlämmung

Country Status (8)

Country	Link
US (1)	US20060162260A1 (de)
EP (1)	EP1756244B1 (de)
JP (1)	JP4472747B2 (de)
KR (1)	KR100682231B1 (de)
CN (1)	CN100588698C (de)
AT (1)	ATE517960T1 (de)
TW (1)	TWI319761B (de)
WO (1)	WO2006080796A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US8388710B2 (en) *	2005-01-26	2013-03-05	Lg Chem, Ltd.	Cerium oxide powder, method for preparing the same, and CMP slurry comprising the same
KR20080011044A (ko) *	2006-07-28	2008-01-31	주식회사 엘지화학	산화세륨 분말, 그 제조방법, 및 이를 포함하는ｃｍｐ슬러리
WO2008013407A1 (en)	2006-07-28	2008-01-31	Lg Chem, Ltd.	Cerium oxide powder, method for preparing the same, and cmp slurry comprising the same
DE102005017372A1 (de)	2005-04-14	2006-10-19	Degussa Ag	Wässrige Ceroxiddispersion
WO2007035034A1 (en) *	2005-09-20	2007-03-29	Lg Chem, Ltd.	Cerium carbonate powder, method for preparing the same, cerium oxide powder made therefrom, method for preparing the same, and cmp slurry comprising the same
US8361419B2 (en)	2005-09-20	2013-01-29	Lg Chem, Ltd.	Cerium carbonate powder, method for preparing the same, cerium oxide powder made therefrom, method for preparing the same, and CMP slurry comprising the same
US7776228B2 (en) *	2006-04-11	2010-08-17	Ebara Corporation	Catalyst-aided chemical processing method
KR100988658B1 (ko) *	2006-12-13	2010-10-18	주식회사 엘지화학	탄산세륨과 산화세륨의 신규한 제조방법
WO2008114972A1 (en) *	2007-03-16	2008-09-25	Lg Chem, Ltd.	Method for preparing cerium carbonate powder
US8303918B2 (en) *	2007-03-16	2012-11-06	Lg Chem, Ltd.	Method for preparing cerium carbonate powder using urea
WO2008136593A1 (en)	2007-05-03	2008-11-13	Lg Chem, Ltd.	Cerium oxide powder for abrasive and cmp slurry comprising the same
US8252087B2 (en)	2007-10-31	2012-08-28	Molycorp Minerals, Llc	Process and apparatus for treating a gas containing a contaminant
WO2009116806A1 (en) *	2008-03-20	2009-09-24	Lg Chem, Ltd.	Method for preparing cerium carbonate
KR101184732B1 (ko) *	2008-03-20	2012-09-20	주식회사 엘지화학	탄산세륨 제조 방법
KR101101833B1 (ko) *	2009-09-25	2012-01-02	솔브레인 주식회사	침상형 탄산세륨으로부터 100 ｎｍ 급 크기의 산화세륨 제조방법
TWI431080B (zh) *	2009-10-13	2014-03-21	Ｌｇ化學公司	化學機械拋光之漿料組成物及拋光方法
KR101238786B1 (ko)	2010-02-05	2013-02-28	주식회사 엘지화학	탄산세륨의 제조 방법 및 산화세륨의 제조 방법
CN101891233A (zh) *	2010-07-12	2010-11-24	南昌大学	一种超细氧化铈的制备方法
EP2858096B1 (de) *	2012-05-25	2017-01-11	Nissan Chemical Industries, Ltd.	Polierlösungszusammensetzung für wafer
US9157010B2 (en) *	2012-07-18	2015-10-13	Cabot Microelectronics Corporation	Magnetorheological fluid for ultrasmooth polishing
US10071459B2 (en) *	2013-09-25	2018-09-11	3M Innovative Properties Company	Multi-layered polishing pads
KR102758095B1 (ko) *	2016-12-14	2025-01-22	솔브레인 주식회사	화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조방법
KR102679084B1 (ko)	2021-08-30	2024-06-27	주식회사 케이씨텍	산화세륨 연마입자 및 연마 슬러리 조성물
KR20260054817A (ko) *	2024-10-16	2026-04-23	한남대학교 산학협력단	고상법을 이용한 반도체 cmp 공정용 세리아 나노입자의 제조방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2980504B2 (ja) *	1993-12-21	1999-11-22	信越化学工業株式会社	新規な形態を有する炭酸セリウムおよび炭酸セリウム並びに酸化セリウムの製造方法
WO1997029510A1 (fr) *	1996-02-07	1997-08-14	Hitachi Chemical Company, Ltd.	Abrasif d'oxyde de cerium, microplaquette semi-conductrice, dispositif semi-conducteur, procede pour les produire et procede pour polir les substrats
KR19980019046A (ko) *	1996-08-29	1998-06-05	고사이 아키오	연마용 조성물 및 이의 용도(Abrasive composition and use of the same)
JPH10106989A (ja) *	1996-09-30	1998-04-24	Hitachi Chem Co Ltd	酸化セリウム研磨剤及び基板の研磨法
JPH10106991A (ja) *	1996-09-30	1998-04-24	Hitachi Chem Co Ltd	酸化セリウム研磨剤及び基板の研磨法
JPH10106992A (ja) *	1996-09-30	1998-04-24	Hitachi Chem Co Ltd	酸化セリウム研磨剤及び基板の研磨法
EP2164095A1 (de) *	1996-09-30	2010-03-17	Hitachi Chemical Co., Ltd.	Schleifmittel auf Basis von Ceroxid und Verfahren zum Polieren von Oberflächen
JPH10106990A (ja) *	1996-09-30	1998-04-24	Hitachi Chem Co Ltd	酸化セリウム研磨剤及び基板の研磨法
JPH11181404A (ja) *	1997-12-18	1999-07-06	Hitachi Chem Co Ltd	酸化セリウム研磨剤および基板の研磨法
JPH11181403A (ja) *	1997-12-18	1999-07-06	Hitachi Chem Co Ltd	酸化セリウム研磨剤及び基板の研磨法
KR100754103B1 (ko) *	1998-12-25	2007-08-31	히다치 가세고교 가부시끼가이샤	Ｃｍｐ 연마제, ｃｍｐ 연마제용 첨가액 및 기판의 연마방법
TWI272249B (en) *	2001-02-27	2007-02-01	Nissan Chemical Ind Ltd	Crystalline ceric oxide sol and process for producing the same
WO2004037722A1 (ja) *	2002-10-28	2004-05-06	Nissan Chemical Industries, Ltd.	酸化セリウム粒子及びその製造方法
JP4273920B2 (ja) *	2002-10-28	2009-06-03	日産化学工業株式会社	酸化セリウム粒子及び多段階焼成による製造方法

2006
- 2006-01-24 JP JP2007502741A patent/JP4472747B2/ja not_active Expired - Fee Related
- 2006-01-24 CN CN200680000046A patent/CN100588698C/zh not_active Expired - Fee Related
- 2006-01-24 AT AT06715744T patent/ATE517960T1/de not_active IP Right Cessation
- 2006-01-24 EP EP06715744A patent/EP1756244B1/de not_active Expired - Lifetime
- 2006-01-24 WO PCT/KR2006/000271 patent/WO2006080796A1/en not_active Ceased
- 2006-01-25 TW TW095102930A patent/TWI319761B/zh not_active IP Right Cessation
- 2006-01-26 US US11/339,841 patent/US20060162260A1/en not_active Abandoned
- 2006-01-26 KR KR1020060008487A patent/KR100682231B1/ko not_active Expired - Fee Related

Also Published As

Publication number	Publication date
KR100682231B1 (ko)	2007-02-12
WO2006080796A1 (en)	2006-08-03
CN101006153A (zh)	2007-07-25
TWI319761B (en)	2010-01-21
JP2007527945A (ja)	2007-10-04
EP1756244A1 (de)	2007-02-28
EP1756244A4 (de)	2008-03-26
TW200628406A (en)	2006-08-16
CN100588698C (zh)	2010-02-10
WO2006080796A8 (en)	2006-12-14
JP4472747B2 (ja)	2010-06-02
KR20060086327A (ko)	2006-07-31
EP1756244B1 (de)	2011-07-27
US20060162260A1 (en)	2006-07-27

Legal Events

Date	Code	Title	Description
2012-01-15	RER	Ceased as to paragraph 5 lit. 3 law introducing patent treaties

Publication	Publication Date	Title
TWI319761B (en)	2010-01-21	Cerium oxide abrasive and slurry containing the same
JP2000336344A (ja)	2000-12-05	研磨剤
CN102105266B (zh)	2016-01-13	氧化铝颗粒以及包含该氧化铝颗粒的抛光组合物
TWI605112B (zh)	2017-11-11	研磨用組成物
DE60030444D1 (de)	2006-10-12	Cmp-zusammensetzung enthaltend silanmodifizierte-schleifteilchen
KR100695858B1 (ko)	2007-03-20	연마제
ATE550144T1 (de)	2012-04-15	Synthetischer schleifstein
JP2010503232A5 (de)	2010-10-21
TW201143919A (en)	2011-12-16	Polishing composition and polishing method using the same
RU2006104117A (ru)	2006-07-27	Абразивные частицы для механической полировки
SG148912A1 (en)	2009-01-29	Chemical mechanical polishing slurry composition for polishing phase- change memory device and method for polishing phase-change memory device using the same
TW200738856A (en)	2007-10-16	Polishing composition and polishing method
TW200512822A (en)	2005-04-01	Polishing agent for planarizing semiconductors
TW201213522A (en)	2012-04-01	Polishing agent and polishing method
WO2010140671A1 (ja)	2010-12-09	シリコンウェーハの研磨方法及びシリコンウェーハ
JP2007027663A (ja)	2007-02-01	研磨用組成物
WO2007041199A3 (en)	2007-06-28	Polishing slurries and methods for utilizing same
TW200717635A (en)	2007-05-01	Polishing method for semiconductor wafer
TW200609336A (en)	2006-03-16	Polishing composition and substrate polishing method
TWI727165B (zh)	2021-05-11	矽晶圓的研磨方法
JP4752072B2 (ja)	2011-08-17	研磨方法及び研磨装置
JP2000188270A (ja)	2000-07-04	酸化セリウム研磨剤及び基板の研磨法
JP2000053946A5 (de)	2005-10-27
JP5726612B2 (ja)	2015-06-03	研磨材料、研磨用組成物及び研磨方法
Chen et al.	2004	Study on ultra-precision polishing of silicon wafer by nanosized abrasives.