ATE518968T1 - Kupferlegierungsplatte für elektrische und elektronische bauteile - Google Patents

Kupferlegierungsplatte für elektrische und elektronische bauteile

Info

Publication number
ATE518968T1
ATE518968T1 AT07807885T AT07807885T ATE518968T1 AT E518968 T1 ATE518968 T1 AT E518968T1 AT 07807885 T AT07807885 T AT 07807885T AT 07807885 T AT07807885 T AT 07807885T AT E518968 T1 ATE518968 T1 AT E518968T1
Authority
AT
Austria
Prior art keywords
copper alloy
electrical
electronic components
alloy plate
mass
Prior art date
Application number
AT07807885T
Other languages
English (en)
Inventor
Yasuhiro Aruga
Ryoichi Ozaki
Yosuke Miwa
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006270918A external-priority patent/JP4157898B2/ja
Priority claimed from JP2006274309A external-priority patent/JP4197717B2/ja
Priority claimed from JP2006311899A external-priority patent/JP4157899B2/ja
Priority claimed from JP2006311900A external-priority patent/JP4197718B2/ja
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Application granted granted Critical
Publication of ATE518968T1 publication Critical patent/ATE518968T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Insulated Conductors (AREA)
AT07807885T 2006-10-02 2007-09-26 Kupferlegierungsplatte für elektrische und elektronische bauteile ATE518968T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2006270918A JP4157898B2 (ja) 2006-10-02 2006-10-02 プレス打ち抜き性に優れた電気電子部品用銅合金板
JP2006274309A JP4197717B2 (ja) 2006-10-05 2006-10-05 メッキ性に優れた電気電子部品用銅合金板
JP2006311899A JP4157899B2 (ja) 2006-11-17 2006-11-17 曲げ加工性に優れた高強度銅合金板
JP2006311900A JP4197718B2 (ja) 2006-11-17 2006-11-17 酸化膜密着性に優れた高強度銅合金板
PCT/JP2007/068670 WO2008041584A1 (en) 2006-10-02 2007-09-26 Copper alloy plate for electrical and electronic components

Publications (1)

Publication Number Publication Date
ATE518968T1 true ATE518968T1 (de) 2011-08-15

Family

ID=39268446

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07807885T ATE518968T1 (de) 2006-10-02 2007-09-26 Kupferlegierungsplatte für elektrische und elektronische bauteile

Country Status (5)

Country Link
US (4) US8063471B2 (de)
EP (4) EP2388348B1 (de)
KR (2) KR101158113B1 (de)
AT (1) ATE518968T1 (de)
WO (1) WO2008041584A1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1803829B1 (de) 2004-08-17 2013-05-22 Kabushiki Kaisha Kobe Seiko Sho Kupferlegierungsplatte für elektro- und elektronikteile mit biegsamkeit
KR101136265B1 (ko) 2006-07-21 2012-04-23 가부시키가이샤 고베 세이코쇼 전기 전자 부품용 구리 합금판
EP2388348B1 (de) * 2006-10-02 2013-07-31 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Kupferlegierungsblech für elektrische und elektronische Teile
US8211752B2 (en) * 2007-11-26 2012-07-03 Infineon Technologies Ag Device and method including a soldering process
JP2009179864A (ja) * 2008-01-31 2009-08-13 Kobe Steel Ltd 耐応力緩和特性に優れた銅合金板
EP2246448B1 (de) 2008-02-26 2016-10-12 Mitsubishi Shindoh Co., Ltd. Hochfester und in hohem masse leitfähiger kupferdraht
US7928541B2 (en) 2008-03-07 2011-04-19 Kobe Steel, Ltd. Copper alloy sheet and QFN package
US10311991B2 (en) 2009-01-09 2019-06-04 Mitsubishi Shindoh Co., Ltd. High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same
US9027249B2 (en) * 2010-06-10 2015-05-12 Federal Mogul Wiesbaden Gmbh Method for producing a lead-free sliding bearing
US9181606B2 (en) 2010-10-29 2015-11-10 Sloan Valve Company Low lead alloy
KR101783686B1 (ko) * 2010-11-17 2017-10-10 루바타 아플레톤 엘엘씨 알칼리 집전체 애노드
EP2657359B1 (de) * 2010-12-20 2021-03-24 UACJ Corporation Elektrodenstromkollektor und herstellungsverfahren dafür
JP2012243840A (ja) * 2011-05-17 2012-12-10 Renesas Electronics Corp 半導体装置およびその製造方法
US20130042949A1 (en) * 2011-08-17 2013-02-21 Hitachi Cable, Ltd. Method of manufacturing soft-dilute-copper-alloy-material
JP5700834B2 (ja) * 2011-12-09 2015-04-15 株式会社神戸製鋼所 酸化膜密着性に優れた高強度銅合金板
JP5558639B1 (ja) * 2012-10-11 2014-07-23 株式会社Ｕａｃｊ バスバー用板状導電体及びそれよりなるバスバー
CN104073677B (zh) 2013-03-27 2017-01-11 株式会社神户制钢所 Led的引线框用铜合金板条
JP6396067B2 (ja) 2014-04-10 2018-09-26 株式会社Uacj バスバー用アルミニウム合金板及びその製造方法
JP6354275B2 (ja) 2014-04-14 2018-07-11 株式会社オートネットワーク技術研究所 銅合金素線、銅合金撚線および自動車用電線
RU2587112C9 (ru) * 2014-09-22 2016-08-10 Дмитрий Андреевич Михайлов МЕДНЫЙ СПЛАВ, ЛЕГИРОВАННЫЙ ТЕЛЛУРОМ ТелТ, ДЛЯ КОЛЛЕКТОРОВ ЭЛЕКТРИЧЕСКИХ МАШИН
CN113025842B (zh) * 2015-03-18 2023-02-17 美题隆公司 磁性铜合金
WO2018055884A1 (ja) * 2016-09-20 2018-03-29 古河電気工業株式会社 フラットケーブル、フラットケーブルの製造方法、及びフラットケーブルを備える回転コネクタ装置
JP6172368B1 (ja) * 2016-11-07 2017-08-02 住友電気工業株式会社 被覆電線、端子付き電線、銅合金線、及び銅合金撚線
CN110168119B (zh) * 2017-02-17 2022-10-04 古河电气工业株式会社 电阻材料用铜合金材料及其制造方法以及电阻器
CN109055808A (zh) * 2018-10-26 2018-12-21 浙江星康铜业有限公司 一种铜锌合金
KR102764292B1 (ko) * 2018-12-10 2025-02-07 현대자동차주식회사 자동차용 알루미늄 외장 부품의 표면 처리 방법
CN109825739A (zh) * 2019-03-29 2019-05-31 安徽众源新材料股份有限公司 一种保险丝帽用铜合金以及生产工艺
DE102021106875B4 (de) 2021-03-19 2023-09-28 Mundorf Eb Gmbh Kupfer-Silber-Gold-Legierung

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3868279A (en) * 1971-10-08 1975-02-25 Int Copper Research Ass Inc High damping copper-manganese-aluminum alloy
US4047978A (en) * 1975-04-17 1977-09-13 Olin Corporation Processing copper base alloys
US4110132A (en) * 1976-09-29 1978-08-29 Olin Corporation Improved copper base alloys
KR900006104B1 (ko) * 1987-04-10 1990-08-22 풍산금속공업 주식회사 고강도 내마모성 동합금
JPH02122035A (ja) 1988-10-31 1990-05-09 Nippon Mining Co Ltd 酸化膜密着性に優れた高力高導電銅合金
JPH02145734A (ja) 1988-11-25 1990-06-05 Nippon Mining Co Ltd 酸化膜密着性に優れた高力高導電銅合金
JPH02170935A (ja) * 1988-12-24 1990-07-02 Nippon Mining Co Ltd ダイレクトボンディング性の良好な銅合金
DE68920995T2 (de) * 1989-05-23 1995-05-24 Yazaki Corp Elektrische Leiter auf der Basis von Cu-Fe-P Legierungen.
JPH06235035A (ja) 1992-12-23 1994-08-23 Nikko Kinzoku Kk 高力高導電性銅合金
JP2962139B2 (ja) 1994-03-03 1999-10-12 三菱マテリアル株式会社 メッキ性および導電性に優れた銅合金およびこの銅合金からなる薄板または条
JP3550233B2 (ja) * 1995-10-09 2004-08-04 同和鉱業株式会社 高強度高導電性銅基合金の製造法
US5980656A (en) * 1997-07-22 1999-11-09 Olin Corporation Copper alloy with magnesium addition
JP3957391B2 (ja) * 1998-03-06 2007-08-15 株式会社神戸製鋼所 剪断加工性に優れる高強度、高導電性銅合金
JP3729662B2 (ja) 1998-09-28 2005-12-21 株式会社神戸製鋼所 高強度・高導電性銅合金板
JP4056175B2 (ja) 1999-05-13 2008-03-05 株式会社神戸製鋼所 プレス打抜き性が優れたリードフレーム、端子、コネクタ、スイッチ又はリレー用銅合金板
JP2000328157A (ja) 1999-05-13 2000-11-28 Kobe Steel Ltd 曲げ加工性が優れた銅合金板
JP2000328159A (ja) 1999-05-19 2000-11-28 Kobe Steel Ltd 銅合金箔
JP3318309B2 (ja) 2000-02-29 2002-08-26 日鉱金属株式会社 リードフレームおよびリードフレーム用銅合金
US6569543B2 (en) * 2001-02-15 2003-05-27 Olin Corporation Copper foil with low profile bond enahncement
JP3980808B2 (ja) 2000-03-30 2007-09-26 株式会社神戸製鋼所 曲げ加工性および耐熱性に優れた高強度銅合金およびその製造方法
JP3465108B2 (ja) * 2000-05-25 2003-11-10 株式会社神戸製鋼所 電気・電子部品用銅合金
EP1461478B1 (de) * 2000-12-20 2011-02-09 Honda Giken Kogyo Kabushiki Kaisha Galvanisch abgeschiedener verbundfilm und verfahren zu seiner herstellung
US20020157741A1 (en) * 2001-02-20 2002-10-31 Nippon Mining & Metals Co., Ltd. High strength titanium copper alloy, manufacturing method therefor, and terminal connector using the same
JP3797882B2 (ja) 2001-03-09 2006-07-19 株式会社神戸製鋼所 曲げ加工性が優れた銅合金板
JP3798260B2 (ja) 2001-05-17 2006-07-19 株式会社神戸製鋼所 電気電子部品用銅合金及び電気電子部品
KR100491385B1 (ko) * 2001-07-04 2005-05-24 닛꼬 긴조꾸 가꼬 가부시키가이샤 적층판용 구리합금박
KR100513947B1 (ko) * 2002-03-29 2005-09-09 닛코 킨조쿠 가부시키가이샤 프레스성이 양호한 구리 합금 소재 및 그 제조방법
JP3999676B2 (ja) * 2003-01-22 2007-10-31 Ｄｏｗａホールディングス株式会社 銅基合金およびその製造方法
JP4112426B2 (ja) * 2003-05-14 2008-07-02 三菱伸銅株式会社 めっき処理材の製造方法
JP4041452B2 (ja) * 2003-11-05 2008-01-30 株式会社神戸製鋼所 耐熱性に優れた銅合金の製法
JP4041803B2 (ja) * 2004-01-23 2008-02-06 株式会社神戸製鋼所 高強度高導電率銅合金
TW200535259A (en) * 2004-02-06 2005-11-01 Furukawa Circuit Foil Treated copper foil and circuit board
US20050181228A1 (en) * 2004-02-13 2005-08-18 3M Innovative Properties Company Metal-cladded metal matrix composite wire
JP4660735B2 (ja) * 2004-07-01 2011-03-30 Ｄｏｗａメタルテック株式会社 銅基合金板材の製造方法
JP2006058347A (ja) * 2004-08-17 2006-03-02 Matsushita Electric Ind Co Ltd ナビゲーション装置
EP1803829B1 (de) * 2004-08-17 2013-05-22 Kabushiki Kaisha Kobe Seiko Sho Kupferlegierungsplatte für elektro- und elektronikteile mit biegsamkeit
JP3962751B2 (ja) 2004-08-17 2007-08-22 株式会社神戸製鋼所 曲げ加工性を備えた電気電子部品用銅合金板
JP4524471B2 (ja) 2004-08-30 2010-08-18 Ｄｏｗａメタルテック株式会社 銅合金箔およびその製造法
JP4441467B2 (ja) * 2004-12-24 2010-03-31 株式会社神戸製鋼所 曲げ加工性及び耐応力緩和特性を備えた銅合金
JP2006270918A (ja) 2005-02-25 2006-10-05 Ricoh Co Ltd 画像補正方法、撮影装置、画像補正装置およびプログラム並びに記録媒体
JP4603394B2 (ja) 2005-03-14 2010-12-22 株式会社神戸製鋼所 プレス加工用銅又は銅合金板条
JP4887851B2 (ja) * 2005-03-17 2012-02-29 Ｄｏｗａメタルテック株式会社 Ｎｉ−Ｓｎ−Ｐ系銅合金
JP3915816B2 (ja) 2005-03-28 2007-05-16 株式会社東京ワイヤー製作所 ニッケルめっき汚泥の処理方法
JP2006311899A (ja) 2005-05-06 2006-11-16 Aruze Corp 遊技機およびシミュレーションプログラム
JP2007084928A (ja) * 2005-08-26 2007-04-05 Hitachi Cable Ltd 銅合金製バッキングプレートおよび該銅合金の製造方法
JP2007126739A (ja) * 2005-11-07 2007-05-24 Nikko Kinzoku Kk 電子材料用銅合金
JP4680765B2 (ja) * 2005-12-22 2011-05-11 株式会社神戸製鋼所 耐応力緩和特性に優れた銅合金
KR101136265B1 (ko) * 2006-07-21 2012-04-23 가부시키가이샤 고베 세이코쇼 전기 전자 부품용 구리 합금판
JP4950584B2 (ja) * 2006-07-28 2012-06-13 株式会社神戸製鋼所 高強度および耐熱性を備えた銅合金
EP2388348B1 (de) * 2006-10-02 2013-07-31 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Kupferlegierungsblech für elektrische und elektronische Teile
US7928541B2 (en) * 2008-03-07 2011-04-19 Kobe Steel, Ltd. Copper alloy sheet and QFN package

Also Published As

Publication number Publication date
US20100072584A1 (en) 2010-03-25
KR101158113B1 (ko) 2012-06-19
EP2088214A1 (de) 2009-08-12
WO2008041584A1 (en) 2008-04-10
EP2388349A1 (de) 2011-11-23
US20120039741A1 (en) 2012-02-16
KR20120041808A (ko) 2012-05-02
EP2088214A4 (de) 2009-09-30
EP2088214B1 (de) 2011-08-03
US20120039743A1 (en) 2012-02-16
EP2388347A1 (de) 2011-11-23
US8063471B2 (en) 2011-11-22
EP2388347B1 (de) 2014-04-16
EP2388349B1 (de) 2013-07-31
KR20090050096A (ko) 2009-05-19
US20120039742A1 (en) 2012-02-16
EP2388348B1 (de) 2013-07-31
EP2388348A1 (de) 2011-11-23

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