ATE521668T1 - Silikonharzzusammensetzung für optische halbleitervorrichtungen - Google Patents

Silikonharzzusammensetzung für optische halbleitervorrichtungen

Info

Publication number
ATE521668T1
ATE521668T1 AT09171894T AT09171894T ATE521668T1 AT E521668 T1 ATE521668 T1 AT E521668T1 AT 09171894 T AT09171894 T AT 09171894T AT 09171894 T AT09171894 T AT 09171894T AT E521668 T1 ATE521668 T1 AT E521668T1
Authority
AT
Austria
Prior art keywords
group
weight
parts
resin composition
silicone resin
Prior art date
Application number
AT09171894T
Other languages
English (en)
Inventor
Yusuke Taguchi
Junichi Sawada
Kenji Hagiwara
Shoichi Osada
Kazutoshi Tomiyoshi
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Application granted granted Critical
Publication of ATE521668T1 publication Critical patent/ATE521668T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
AT09171894T 2008-09-30 2009-09-30 Silikonharzzusammensetzung für optische halbleitervorrichtungen ATE521668T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008253764 2008-09-30
JP2009200919A JP2010106243A (ja) 2008-09-30 2009-08-31 光半導体装置用シリコーン樹脂組成物

Publications (1)

Publication Number Publication Date
ATE521668T1 true ATE521668T1 (de) 2011-09-15

Family

ID=41395906

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09171894T ATE521668T1 (de) 2008-09-30 2009-09-30 Silikonharzzusammensetzung für optische halbleitervorrichtungen

Country Status (7)

Country Link
US (1) US8022137B2 (de)
EP (1) EP2174984B1 (de)
JP (1) JP2010106243A (de)
KR (1) KR101497158B1 (de)
CN (1) CN101712799B (de)
AT (1) ATE521668T1 (de)
TW (1) TWI465519B (de)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5108825B2 (ja) * 2009-04-24 2012-12-26 信越化学工業株式会社 光半導体装置用シリコーン樹脂組成物及び光半導体装置
JP4964928B2 (ja) * 2009-09-15 2012-07-04 信越化学工業株式会社 アンダーフィル材組成物及び光半導体装置
US9178120B2 (en) * 2010-04-02 2015-11-03 Kaneka Corporation Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode
JP5682257B2 (ja) * 2010-07-30 2015-03-11 三菱化学株式会社 半導体発光装置用樹脂組成物
JP2012064928A (ja) * 2010-08-18 2012-03-29 Mitsubishi Chemicals Corp 半導体発光装置用樹脂成形体用材料及び樹脂成形体
JP2012041428A (ja) * 2010-08-18 2012-03-01 Shin-Etsu Chemical Co Ltd シリコーン樹脂組成物及び光半導体ケース
JP5971176B2 (ja) * 2010-09-02 2016-08-17 住友ベークライト株式会社 ロータに用いる固定用樹脂組成物
JP2012057000A (ja) * 2010-09-07 2012-03-22 Shin-Etsu Chemical Co Ltd シリコーン樹脂組成物、半導体装置の封止材、及び半導体装置
US9045668B2 (en) * 2010-09-22 2015-06-02 Dow Corning Corporation Organosiloxane block copolymer
JP5775525B2 (ja) 2010-10-25 2015-09-09 出光興産株式会社 （メタ）アクリレート系組成物
JP5728961B2 (ja) * 2011-01-17 2015-06-03 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP5728960B2 (ja) * 2011-01-17 2015-06-03 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP5919903B2 (ja) * 2011-03-31 2016-05-18 三菱化学株式会社 半導体発光装置用パッケージ及び該パッケージを有してなる半導体発光装置並びにそれらの製造方法
JP5833333B2 (ja) * 2011-04-19 2015-12-16 アイカ工業株式会社 光半導体装置リフレクター用シリコーン樹脂組成物
TW201247782A (en) * 2011-05-25 2012-12-01 Daxin Materials Corp White thermocurable siloxane resin composition
JP5987580B2 (ja) * 2011-10-03 2016-09-07 三菱化学株式会社 硬化性ポリシロキサン組成物の製造方法
JP2013133429A (ja) * 2011-12-27 2013-07-08 Kaneka Corp 表面実装型発光装置用樹脂成形体およびそれを用いた発光装置
JP2015513362A (ja) * 2012-03-12 2015-05-11 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 樹脂−直鎖状オルガノシロキサンブロックコポリマーの組成物
JP5981635B2 (ja) * 2012-03-20 2016-08-31 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 導光板及び関連付けられたライトアセンブリ
EP2828319B1 (de) * 2012-03-21 2018-09-12 Dow Silicones Corporation Zusammensetzungen enthaltend organosiloxanblockcopolymere mit harzartigen und linearen blöcken und organopolysiloxane
JP2015516999A (ja) * 2012-03-21 2015-06-18 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 樹脂−直鎖状オルガノシロキサンブロックコポリマーの組成物
US9279946B2 (en) 2012-05-23 2016-03-08 Avago Technologies General Ip (Singapore) Pte. Ltd. Premolded cavity for optoelectronic device
JP2014013879A (ja) * 2012-06-06 2014-01-23 Nitto Denko Corp 光半導体用光反射部材およびそれを用いた光半導体実装用基板ならびに光半導体装置
CN104884534B (zh) 2012-12-27 2018-03-30 道康宁公司 用于形成具有优异反射率和阻燃性质的制品的组合物及由其形成的制品
EP2945197A4 (de) * 2013-01-10 2016-08-03 Konica Minolta Inc Led-vorrichtung und beschichtungsflüssigkeit zur herstellung davon
JP2014177570A (ja) * 2013-03-15 2014-09-25 Shin Etsu Chem Co Ltd 熱硬化性シリコーン樹脂組成物
JP2015040238A (ja) * 2013-08-21 2015-03-02 信越化学工業株式会社 光半導体ケース形成用熱硬化性シリコーン樹脂組成物
JP2015054965A (ja) * 2013-09-13 2015-03-23 株式会社東芝 封止用樹脂、半導体装置、および光結合装置
JP5797717B2 (ja) * 2013-10-16 2015-10-21 台湾太陽油▲墨▼股▲分▼有限公司 白色熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材
JP6417878B2 (ja) * 2013-11-20 2018-11-07 三菱ケミカル株式会社 半導体発光装置封止材用硬化性オルガノポリシロキサン組成物、該組成物を硬化させてなるオルガノポリシロキサン硬化物及びこれを用いて封止されてなる半導体発光装置
US9671085B2 (en) 2014-04-22 2017-06-06 Dow Corning Corporation Reflector for an LED light source
JP6194853B2 (ja) * 2014-06-06 2017-09-13 信越化学工業株式会社 光半導体装置用白色熱硬化性シリコーン樹脂組成物、及び光半導体素子搭載用ケース
CN105778506B (zh) * 2014-12-25 2019-04-30 广东生益科技股份有限公司 一种有机硅树脂组合物及使用它的预浸料、层压板、覆铜板以及铝基板
CN105778505B (zh) * 2014-12-25 2019-04-30 广东生益科技股份有限公司 一种有机硅树脂组合物以及使用它的白色预浸料和白色层压板
CN105778504B (zh) * 2014-12-25 2019-11-12 广东生益科技股份有限公司 一种陶瓷化硅树脂组合物及使用它的预浸料与层压板
JP2016207739A (ja) * 2015-04-17 2016-12-08 株式会社東芝 半導体発光装置及びその製造方法
JP2017043656A (ja) * 2015-08-24 2017-03-02 信越化学工業株式会社 熱硬化性シリコーン樹脂組成物及びその成型体を使用した光半導体素子搭載用ケース
EP3147329B1 (de) * 2015-09-28 2022-02-23 Shin-Etsu Chemical Co., Ltd. Wärmehärtbare silikonharzzusammensetzung, optische vorrichtung und halbleiterverpackung mit geformtem produkt daraus
JP6925147B2 (ja) * 2016-03-31 2021-08-25 Koa株式会社 熱硬化型シリコーンレジンペースト組成物およびその使用
DE112017002058B4 (de) * 2016-04-18 2023-10-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement
CN107501942B (zh) * 2017-08-29 2020-10-02 北京康美特科技股份有限公司 可模塑成型的有机硅树脂、组合物及其半导体发光元件
JP2019159140A (ja) * 2018-03-14 2019-09-19 信越化学工業株式会社 白色リフレクター用熱硬化性シリコーン樹脂組成物及び該組成物の硬化物からなる白色リフレクター
JP7560441B2 (ja) * 2019-03-29 2024-10-02 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
JP7793276B2 (ja) * 2022-12-22 2026-01-05 信越化学工業株式会社 フォトカプラ封止剤及びフォトカプラ
CN117594735B (zh) * 2023-11-20 2024-04-30 南通惟怡新材料科技有限公司 一种层压板及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4102970A (en) * 1974-10-03 1978-07-25 Wacker-Chemie Gmbh Thermosetting compositions which can be cured to form molded objects or coatings
JP2656336B2 (ja) 1989-01-18 1997-09-24 日東電工株式会社 光半導体装置およびそれに用いる光半導体封止用エポキシ樹脂組成物
US6509423B1 (en) * 2001-08-21 2003-01-21 Dow Corning Corporation Silicone composition and cured silicone product
JP2005306952A (ja) 2004-04-20 2005-11-04 Japan Epoxy Resin Kk 発光素子封止材用エポキシ樹脂組成物
US20060035092A1 (en) 2004-08-10 2006-02-16 Shin-Etsu Chemical Co., Ltd. Resin composition for sealing LED elements and cured product generated by curing the composition
JP2006077234A (ja) 2004-08-10 2006-03-23 Shin Etsu Chem Co Ltd Ｌｅｄ素子封止用樹脂組成物および該組成物を硬化してなる硬化物
JP2006291018A (ja) 2005-04-08 2006-10-26 Shin Etsu Chem Co Ltd Ｌｅｄ素子封止用硬化性樹脂組成物
US8816959B2 (en) 2007-04-03 2014-08-26 General Electric Company Method and apparatus for obtaining and/or analyzing anatomical images
JP2009200919A (ja) 2008-02-22 2009-09-03 Pioneer Electronic Corp スピーカ装置
JP5108825B2 (ja) * 2009-04-24 2012-12-26 信越化学工業株式会社 光半導体装置用シリコーン樹脂組成物及び光半導体装置

Also Published As

Publication number Publication date
EP2174984B1 (de) 2011-08-24
TWI465519B (zh) 2014-12-21
KR20100036977A (ko) 2010-04-08
KR101497158B1 (ko) 2015-02-27
CN101712799A (zh) 2010-05-26
TW201022365A (en) 2010-06-16
US8022137B2 (en) 2011-09-20
JP2010106243A (ja) 2010-05-13
EP2174984A1 (de) 2010-04-14
US20100081748A1 (en) 2010-04-01
CN101712799B (zh) 2012-08-29

Similar Documents

Publication Publication Date Title
ATE521668T1 (de) Silikonharzzusammensetzung für optische halbleitervorrichtungen
ATE541896T1 (de) Silikonharzzusammensetzung für optische halbleiterbauelemente und optisches halbleiterbauelement
ATE552310T1 (de) Unterfüllungszusammensetzung und optisches halbleiterbauelement
BRPI0815149A2 (pt) Processo para execução de uma hidrólise controlada e condensação de um silano epóxi-funcional, mistura de condensados a base de silano e uso da mesma
US9169275B2 (en) Organopolysiloxane and making method
WO2004072181A3 (en) Thermoconductive silicone composition
RU2009140077A (ru) Композиция покрытия, содержащая силиконовую смолу, и подложка с нанесенным покрытием
TW200700502A (en) Curable resin composition for sealing led element
JP2005272697A (ja) 硬化性シリコーン樹脂組成物、光半導体用封止材および光半導体装置
KR101272403B1 (ko) 가열 경화성 실리콘 조성물
WO2008036662A3 (en) Process for preparing siloxane-based compositions and derivative compositions thereof
EP1632534A3 (de) Vernetzbare Harzzusammensetzung, vernetzbarer Film und vernetzter Film
EP1780242A3 (de) Polymerzusammensetzung zum Versiegeln optischer Einheiten und Methode zum Versiegeln von Halbleiterelementen
RU2010151565A (ru) Отверждаемая органополисилоксановая композиция и полупроводниковое устройство
JP2013177637A5 (de)
CA2477970A1 (en) High fracture toughness hydrosilyation cured silicone resin
EP2072582A4 (de) Polymerzusammensetzung mit metallalkoxidkondensationsprodukt, organischer silanverbindung und borverbindung
TW200704713A (en) Curable silicone composition and cured product therefrom
RU2017134288A (ru) Отверждаемые силиконовые композиции
DE60221383D1 (de) Silikonzusammensetzung für einen wasserabweisenden überzug
MY147862A (en) Curable organopolysiloxane composition and semiconductor device
WO2009061371A3 (en) Copolymers of epoxy compounds and amino silanes
WO2008133227A1 (ja) ケイ素含有化合物、硬化性組成物及び硬化物
WO2008133228A1 (ja) ケイ素含有化合物、硬化性組成物及び硬化物
TW200734422A (en) Composition for forming silica-based coating with a low refractive index

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties