ATE525493T1 - Element - Google Patents

Element

Info

Publication number
ATE525493T1
ATE525493T1 AT07712590T AT07712590T ATE525493T1 AT E525493 T1 ATE525493 T1 AT E525493T1 AT 07712590 T AT07712590 T AT 07712590T AT 07712590 T AT07712590 T AT 07712590T AT E525493 T1 ATE525493 T1 AT E525493T1
Authority
AT
Austria
Prior art keywords
filmy structure
help
producing
manufacturing
electric current
Prior art date
Application number
AT07712590T
Other languages
English (en)
Inventor
Reijo Lappalainen
Jari Ruuttu
Vesa Myllymaeki
Sampo Ylaetalo
Juha Maekitalo
Lasse Pulli
Original Assignee
Picodeon Ltd Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FI20060182A external-priority patent/FI20060182L/fi
Priority claimed from FI20060177A external-priority patent/FI20060177L/fi
Application filed by Picodeon Ltd Oy filed Critical Picodeon Ltd Oy
Application granted granted Critical
Publication of ATE525493T1 publication Critical patent/ATE525493T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure in vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Toxicology (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Details Of Aerials (AREA)
  • Thin Film Transistor (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Bipolar Transistors (AREA)
  • Laser Beam Processing (AREA)
  • Surface Heating Bodies (AREA)
AT07712590T 2006-02-23 2007-02-23 Element ATE525493T1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
FI20060182A FI20060182L (fi) 2005-07-13 2006-02-23 Ablaatiotekniikkaan liittyvä pinnankäsittelytekniikka ja pinnankäsittelylaitteisto
FI20060177A FI20060177L (fi) 2006-02-23 2006-02-23 Menetelmä tuottaa hyvälaatuisia pintoja ja hyvälaatuisen pinnan omaava tuote
FI20060357A FI124239B (fi) 2006-02-23 2006-04-12 Elementti, jossa on sähköä johtava kalvomainen rakenne lämmittävän ja/tai jäähdyttävän vaikutuksen synnyttämiseksi sähkövirran avulla
PCT/FI2007/000048 WO2007096463A2 (en) 2006-02-23 2007-02-23 Element

Publications (1)

Publication Number Publication Date
ATE525493T1 true ATE525493T1 (de) 2011-10-15

Family

ID=36293753

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07712590T ATE525493T1 (de) 2006-02-23 2007-02-23 Element

Country Status (7)

Country Link
EP (1) EP1991716B1 (de)
JP (1) JP5383204B2 (de)
KR (1) KR20090015021A (de)
AT (1) ATE525493T1 (de)
DK (1) DK1991716T3 (de)
FI (1) FI124239B (de)
WO (1) WO2007096463A2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012097092A2 (en) * 2011-01-13 2012-07-19 Tamarack Scientific Co. Inc. Laser removal of conductive seed layers
JP4782897B1 (ja) * 2011-04-11 2011-09-28 隆彌 渡邊 冷暖房装置
JP4791611B1 (ja) * 2011-05-20 2011-10-12 隆彌 渡邊 冷暖房装置
WO2012140800A1 (ja) * 2011-04-11 2012-10-18 Watanabe Takaya 冷暖房装置
JP4856282B1 (ja) * 2011-07-30 2012-01-18 隆彌 渡邊 冷暖房装置
CN102509830B (zh) * 2011-10-25 2013-11-20 长春理工大学 一种含有飞秒激光等离子体丝的双线传输线装置
CN106487323A (zh) * 2015-08-26 2017-03-08 阿特斯(中国)投资有限公司 光伏组件安装系统
CN109583110A (zh) * 2018-12-06 2019-04-05 东北大学 一种冶金过程的放大方法
CN110308070A (zh) * 2019-06-18 2019-10-08 东南大学 一种采用3d打印的气体扩散室
CN112098711B (zh) * 2020-09-24 2024-01-23 中国人民解放军63920部队 基于稀疏遥测的月球车帆板功率衰减确定方法及装置
CN112556018B (zh) * 2020-12-14 2022-04-29 珠海格力电器股份有限公司 一种自清洁过滤网及空调
CN113049911B (zh) * 2021-03-10 2022-12-06 杭州惠嘉信息科技有限公司 一种太阳能输电电路监测系统及其监控方法
DE102024117849A1 (de) 2024-06-25 2026-01-08 Marelli Germany Gmbh Kraftfahrzeugbeleuchtungseinrichtung mit einer beheizbaren Abdeckscheibe

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JPH0791660B2 (ja) * 1989-08-30 1995-10-04 株式会社日立製作所 環境遮断用耐熱壁を備えた地上機器
JPH03114467U (de) * 1990-03-09 1991-11-25
DE4019965A1 (de) * 1990-06-21 1992-01-09 Deutsche Forsch Luft Raumfahrt Verfahren und vorrichtung zum beschichten von substratmaterial
JP3255469B2 (ja) * 1992-11-30 2002-02-12 三菱電機株式会社 レーザ薄膜形成装置
JPH06248440A (ja) * 1993-02-26 1994-09-06 Kokusai Chodendo Sangyo Gijutsu Kenkyu Center 酸化物薄膜作製装置
US5368681A (en) * 1993-06-09 1994-11-29 Hong Kong University Of Science Method for the deposition of diamond on a substrate
US5652062A (en) * 1993-10-27 1997-07-29 Lucent Technologies Inc. Devices using transparent conductive GaInO3 films
US5624722A (en) * 1995-03-07 1997-04-29 Sumitomo Electric Industries, Ltd. Apparatus and method for depositing films on substrate via on-axis laser ablation
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JPH1032166A (ja) * 1996-07-16 1998-02-03 Toyota Motor Corp レーザーアブレーション法による結晶薄膜の形成方法
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WO2000022184A1 (en) 1998-10-12 2000-04-20 The Regents Of The University Of California Laser deposition of thin films
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Also Published As

Publication number Publication date
DK1991716T3 (da) 2012-01-16
JP5383204B2 (ja) 2014-01-08
WO2007096463A3 (en) 2007-10-11
JP2009527643A (ja) 2009-07-30
KR20090015021A (ko) 2009-02-11
EP1991716A2 (de) 2008-11-19
EP1991716B1 (de) 2011-09-21
FI20060357A0 (fi) 2006-04-12
WO2007096463A2 (en) 2007-08-30
FI20060357L (fi) 2007-08-24
FI124239B (fi) 2014-05-15

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