ATE525499T1 - Verfahren zur herstellung eines films aus galliumnitrid mit niedriger fehlerdichte durch dampfphaseepitaxie - Google Patents
Verfahren zur herstellung eines films aus galliumnitrid mit niedriger fehlerdichte durch dampfphaseepitaxieInfo
- Publication number
- ATE525499T1 ATE525499T1 AT03750838T AT03750838T ATE525499T1 AT E525499 T1 ATE525499 T1 AT E525499T1 AT 03750838 T AT03750838 T AT 03750838T AT 03750838 T AT03750838 T AT 03750838T AT E525499 T1 ATE525499 T1 AT E525499T1
- Authority
- AT
- Austria
- Prior art keywords
- gallium nitride
- phase epitaxy
- producing
- low defect
- vapour
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/27—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials
- H10P14/271—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials characterised by the preparation of substrate for selective deposition
- H10P14/272—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials characterised by the preparation of substrate for selective deposition using mask materials other than SiO2 or SiN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2907—Materials being Group IIIA-VA materials
- H10P14/2908—Nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2921—Materials being crystalline insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3416—Nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0209375A FR2842832B1 (fr) | 2002-07-24 | 2002-07-24 | Procede de realisation par epitaxie en phase vapeur d'un film de nitrure de gallium a faible densite de defaut |
| PCT/FR2003/002340 WO2004012227A2 (fr) | 2002-07-24 | 2003-07-24 | Procede de realisation par epitaxie en phase vapeur d'un film de nitrure de gallium a faible densite de defaut |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE525499T1 true ATE525499T1 (de) | 2011-10-15 |
Family
ID=30011432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT03750838T ATE525499T1 (de) | 2002-07-24 | 2003-07-24 | Verfahren zur herstellung eines films aus galliumnitrid mit niedriger fehlerdichte durch dampfphaseepitaxie |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7455729B2 (de) |
| EP (1) | EP1525340B1 (de) |
| JP (1) | JP4444104B2 (de) |
| KR (1) | KR100950903B1 (de) |
| CN (1) | CN1329560C (de) |
| AT (1) | ATE525499T1 (de) |
| AU (1) | AU2003269052A1 (de) |
| FR (1) | FR2842832B1 (de) |
| WO (1) | WO2004012227A2 (de) |
Families Citing this family (73)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7118929B2 (en) | 2000-07-07 | 2006-10-10 | Lumilog | Process for producing an epitaxial layer of gallium nitride |
| US7560296B2 (en) | 2000-07-07 | 2009-07-14 | Lumilog | Process for producing an epitalixal layer of galium nitride |
| FR2869459B1 (fr) * | 2004-04-21 | 2006-08-04 | Commissariat Energie Atomique | Realignement entre niveaux apres une etape d'epitaxie. |
| US7238560B2 (en) * | 2004-07-23 | 2007-07-03 | Cree, Inc. | Methods of fabricating nitride-based transistors with a cap layer and a recessed gate |
| TWI442456B (zh) | 2004-08-31 | 2014-06-21 | 學校法人上智學院 | 發光元件 |
| US7626217B2 (en) * | 2005-04-11 | 2009-12-01 | Cree, Inc. | Composite substrates of conductive and insulating or semi-insulating group III-nitrides for group III-nitride devices |
| US20060267043A1 (en) * | 2005-05-27 | 2006-11-30 | Emerson David T | Deep ultraviolet light emitting devices and methods of fabricating deep ultraviolet light emitting devices |
| US9331192B2 (en) * | 2005-06-29 | 2016-05-03 | Cree, Inc. | Low dislocation density group III nitride layers on silicon carbide substrates and methods of making the same |
| TWI519686B (zh) * | 2005-12-15 | 2016-02-01 | 聖戈班晶體探測器公司 | 低差排密度氮化鎵(GaN)之生長方法 |
| KR100809209B1 (ko) * | 2006-04-25 | 2008-02-29 | 삼성전기주식회사 | 비극성 m면 질화물 반도체 제조방법 |
| WO2008115135A1 (en) * | 2007-03-16 | 2008-09-25 | Sebastian Lourdudoss | Semiconductor heterostructures and manufacturing thereof |
| CN101730926B (zh) * | 2007-07-26 | 2012-09-19 | 硅绝缘体技术有限公司 | 改进的外延材料的制造方法 |
| JP5903714B2 (ja) * | 2007-07-26 | 2016-04-13 | ソイテックSoitec | エピタキシャル方法およびこの方法によって成長させられたテンプレート |
| CN102184850B (zh) * | 2011-05-13 | 2012-11-21 | 润奥电子(扬州)制造有限公司 | 用于制备半导体器件的深结扩散方法 |
| JP5649514B2 (ja) | 2011-05-24 | 2015-01-07 | 株式会社東芝 | 半導体発光素子、窒化物半導体層、及び、窒化物半導体層の形成方法 |
| KR101237351B1 (ko) * | 2011-05-27 | 2013-03-04 | 포항공과대학교 산학협력단 | 전극 및 이를 포함한 전자 소자 |
| EP2701183A4 (de) | 2011-08-09 | 2014-07-30 | Panasonic Corp | Struktur zum züchten einer nitrid-halbleiterschicht, stapelstruktur, halbleiterelement auf nitridbasis, lichtquelle und herstellungsverfahren dafür |
| US9093395B2 (en) * | 2011-09-02 | 2015-07-28 | Avogy, Inc. | Method and system for local control of defect density in gallium nitride based electronics |
| DE102012101211A1 (de) * | 2012-02-15 | 2013-08-22 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterbauelements |
| JP6106932B2 (ja) * | 2012-03-19 | 2017-04-05 | 株式会社リコー | 13族窒化物結晶、及び13族窒化物結晶基板 |
| CN103367121B (zh) * | 2012-03-28 | 2016-04-13 | 清华大学 | 外延结构体的制备方法 |
| CN103378223B (zh) * | 2012-04-25 | 2016-07-06 | 清华大学 | 外延结构体的制备方法 |
| DE102012217073B4 (de) | 2012-09-21 | 2024-11-28 | Robert Bosch Gmbh | Vertikales mikroelektronisches Bauelement |
| KR101504731B1 (ko) * | 2012-11-30 | 2015-03-23 | 주식회사 소프트에피 | 3족 질화물 반도체 적층체 |
| JP6090998B2 (ja) * | 2013-01-31 | 2017-03-08 | 一般財団法人電力中央研究所 | 六方晶単結晶の製造方法、六方晶単結晶ウエハの製造方法 |
| US20170155016A9 (en) * | 2013-03-07 | 2017-06-01 | Meijo University | Nitride semiconductor crystal and method of fabricating the same |
| DE102013210814A1 (de) | 2013-06-10 | 2014-12-11 | Robert Bosch Gmbh | Verfahren zum Herstellen eines Transistors mit hoher Elektronenbeweglichkeit |
| DE102013211374A1 (de) | 2013-06-18 | 2014-12-18 | Robert Bosch Gmbh | Transistor und Verfahren zur Herstellung eines Transistors |
| US10032911B2 (en) | 2013-12-23 | 2018-07-24 | Intel Corporation | Wide band gap transistor on non-native semiconductor substrate |
| JP6315852B2 (ja) | 2013-12-23 | 2018-04-25 | インテル・コーポレーション | 半導体トランジスタ構造、システムオンチップおよび半導体トランジスタ構造形成方法 |
| JP6269368B2 (ja) * | 2014-07-24 | 2018-01-31 | 住友電気工業株式会社 | 窒化ガリウム基板 |
| WO2016136547A1 (ja) * | 2015-02-23 | 2016-09-01 | 三菱化学株式会社 | C面GaN基板 |
| CN104659089B (zh) * | 2015-03-12 | 2017-09-29 | 苏州能屋电子科技有限公司 | 基于侧向外延技术的垂直结构AlGaN/GaN HEMT器件及其制作方法 |
| DE102015109761B4 (de) | 2015-06-18 | 2022-01-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Nitrid-Halbleiterbauelements und Nitrid-Halbleiterbauelement |
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| US9954089B2 (en) | 2016-06-20 | 2018-04-24 | Infineon Technologies Americas Corp. | Low dislocation density III-nitride semiconductor component |
| KR102426231B1 (ko) * | 2016-08-08 | 2022-07-29 | 미쯔비시 케미컬 주식회사 | 도전성 C면 GaN 기판 |
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| KR102680861B1 (ko) * | 2016-12-15 | 2024-07-03 | 삼성전자주식회사 | 질화 갈륨 기판의 제조 방법 |
| US10755992B2 (en) | 2017-07-06 | 2020-08-25 | Qorvo Us, Inc. | Wafer-level packaging for enhanced performance |
| US10784233B2 (en) | 2017-09-05 | 2020-09-22 | Qorvo Us, Inc. | Microelectronics package with self-aligned stacked-die assembly |
| US11152363B2 (en) * | 2018-03-28 | 2021-10-19 | Qorvo Us, Inc. | Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process |
| US12062700B2 (en) | 2018-04-04 | 2024-08-13 | Qorvo Us, Inc. | Gallium-nitride-based module with enhanced electrical performance and process for making the same |
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| CN118213279A (zh) | 2018-07-02 | 2024-06-18 | Qorvo美国公司 | Rf半导体装置及其制造方法 |
| KR102620159B1 (ko) * | 2018-10-08 | 2024-01-02 | 삼성전자주식회사 | 반도체 발광 소자 |
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| KR20250027591A (ko) | 2019-01-23 | 2025-02-26 | 코르보 유에스, 인크. | Rf 반도체 디바이스 및 이를 형성하는 방법 |
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| US12129168B2 (en) | 2019-12-23 | 2024-10-29 | Qorvo Us, Inc. | Microelectronics package with vertically stacked MEMS device and controller device |
| JP7074168B2 (ja) * | 2020-09-03 | 2022-05-24 | 三菱ケミカル株式会社 | C面GaN基板 |
| WO2022126016A2 (en) | 2020-12-11 | 2022-06-16 | Qorvo Us, Inc. | Multi-level 3d stacked package and methods of forming the same |
| JP6971415B1 (ja) * | 2020-12-29 | 2021-11-24 | 京セラ株式会社 | 半導体基板、半導体基板の製造方法、半導体基板の製造装置、電子部品および電子機器 |
| JP7638488B2 (ja) * | 2021-02-01 | 2025-03-04 | 豊田合成株式会社 | 半導体素子および半導体素子の製造方法 |
| US12062571B2 (en) | 2021-03-05 | 2024-08-13 | Qorvo Us, Inc. | Selective etching process for SiGe and doped epitaxial silicon |
| CN115662876A (zh) * | 2022-08-31 | 2023-01-31 | 珠海庞纳微半导体科技有限公司 | 外延结构及其制备方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2866342A (en) | 1956-10-09 | 1958-12-30 | Moorhead John Gerald | Heat-actuated motor |
| FR2063759A5 (de) | 1969-10-30 | 1971-07-09 | Pascouet Adrien | |
| US4158322A (en) | 1977-08-22 | 1979-06-19 | The United States Of America As Represented By The Secretary Of The Navy | Pyrotechnic separation device |
| EP2234142A1 (de) * | 1997-04-11 | 2010-09-29 | Nichia Corporation | Nitridhalbleitersubstrat |
| FR2769924B1 (fr) * | 1997-10-20 | 2000-03-10 | Centre Nat Rech Scient | Procede de realisation d'une couche epitaxiale de nitrure de gallium, couche epitaxiale de nitrure de gallium et composant optoelectronique muni d'une telle couche |
| JP4032538B2 (ja) * | 1998-11-26 | 2008-01-16 | ソニー株式会社 | 半導体薄膜および半導体素子の製造方法 |
| JP4145437B2 (ja) * | 1999-09-28 | 2008-09-03 | 住友電気工業株式会社 | 単結晶GaNの結晶成長方法及び単結晶GaN基板の製造方法と単結晶GaN基板 |
| FR2806788B1 (fr) | 2000-03-24 | 2002-12-06 | Lacroix Soc E | Pyromecanisme, notamment pour application dans le domaine spatial |
| FR2811036B1 (fr) | 2000-06-30 | 2003-09-12 | Lacroix Soc E | Actionneur a base de micro-impulseurs pyrotechniques |
| JP3968968B2 (ja) * | 2000-07-10 | 2007-08-29 | 住友電気工業株式会社 | 単結晶GaN基板の製造方法 |
| JP3882539B2 (ja) * | 2000-07-18 | 2007-02-21 | ソニー株式会社 | 半導体発光素子およびその製造方法、並びに画像表示装置 |
-
2002
- 2002-07-24 FR FR0209375A patent/FR2842832B1/fr not_active Expired - Fee Related
-
2003
- 2003-07-24 US US10/522,397 patent/US7455729B2/en not_active Expired - Lifetime
- 2003-07-24 AU AU2003269052A patent/AU2003269052A1/en not_active Abandoned
- 2003-07-24 KR KR1020057001319A patent/KR100950903B1/ko not_active Expired - Fee Related
- 2003-07-24 WO PCT/FR2003/002340 patent/WO2004012227A2/fr not_active Ceased
- 2003-07-24 AT AT03750838T patent/ATE525499T1/de not_active IP Right Cessation
- 2003-07-24 CN CNB038207710A patent/CN1329560C/zh not_active Expired - Fee Related
- 2003-07-24 JP JP2004523874A patent/JP4444104B2/ja not_active Expired - Fee Related
- 2003-07-24 EP EP03750838A patent/EP1525340B1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1678771A (zh) | 2005-10-05 |
| KR20050026962A (ko) | 2005-03-16 |
| KR100950903B1 (ko) | 2010-04-06 |
| JP4444104B2 (ja) | 2010-03-31 |
| HK1097886A1 (en) | 2007-07-06 |
| AU2003269052A8 (en) | 2004-02-16 |
| FR2842832B1 (fr) | 2006-01-20 |
| CN1329560C (zh) | 2007-08-01 |
| US20060099781A1 (en) | 2006-05-11 |
| EP1525340B1 (de) | 2011-09-21 |
| AU2003269052A1 (en) | 2004-02-16 |
| FR2842832A1 (fr) | 2004-01-30 |
| JP2005534182A (ja) | 2005-11-10 |
| WO2004012227A3 (fr) | 2004-04-29 |
| US7455729B2 (en) | 2008-11-25 |
| EP1525340A2 (de) | 2005-04-27 |
| WO2004012227A2 (fr) | 2004-02-05 |
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