ATE525499T1 - Verfahren zur herstellung eines films aus galliumnitrid mit niedriger fehlerdichte durch dampfphaseepitaxie - Google Patents

Verfahren zur herstellung eines films aus galliumnitrid mit niedriger fehlerdichte durch dampfphaseepitaxie

Info

Publication number
ATE525499T1
ATE525499T1 AT03750838T AT03750838T ATE525499T1 AT E525499 T1 ATE525499 T1 AT E525499T1 AT 03750838 T AT03750838 T AT 03750838T AT 03750838 T AT03750838 T AT 03750838T AT E525499 T1 ATE525499 T1 AT E525499T1
Authority
AT
Austria
Prior art keywords
gallium nitride
phase epitaxy
producing
low defect
vapour
Prior art date
Application number
AT03750838T
Other languages
English (en)
Inventor
Bernard Beaumont
Pierre Gibart
Jean-Pierre Faurie
Original Assignee
Saint Gobain Cristaux & Detecteurs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Cristaux & Detecteurs filed Critical Saint Gobain Cristaux & Detecteurs
Application granted granted Critical
Publication of ATE525499T1 publication Critical patent/ATE525499T1/de

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • C30B29/406Gallium nitride
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/27Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials
    • H10P14/271Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials characterised by the preparation of substrate for selective deposition
    • H10P14/272Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials characterised by the preparation of substrate for selective deposition using mask materials other than SiO2 or SiN
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2907Materials being Group IIIA-VA materials
    • H10P14/2908Nitrides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2921Materials being crystalline insulating materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3414Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
    • H10P14/3416Nitrides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0133Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
    • H10H20/01335Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Semiconductor Lasers (AREA)
AT03750838T 2002-07-24 2003-07-24 Verfahren zur herstellung eines films aus galliumnitrid mit niedriger fehlerdichte durch dampfphaseepitaxie ATE525499T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0209375A FR2842832B1 (fr) 2002-07-24 2002-07-24 Procede de realisation par epitaxie en phase vapeur d'un film de nitrure de gallium a faible densite de defaut
PCT/FR2003/002340 WO2004012227A2 (fr) 2002-07-24 2003-07-24 Procede de realisation par epitaxie en phase vapeur d'un film de nitrure de gallium a faible densite de defaut

Publications (1)

Publication Number Publication Date
ATE525499T1 true ATE525499T1 (de) 2011-10-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
AT03750838T ATE525499T1 (de) 2002-07-24 2003-07-24 Verfahren zur herstellung eines films aus galliumnitrid mit niedriger fehlerdichte durch dampfphaseepitaxie

Country Status (9)

Country Link
US (1) US7455729B2 (de)
EP (1) EP1525340B1 (de)
JP (1) JP4444104B2 (de)
KR (1) KR100950903B1 (de)
CN (1) CN1329560C (de)
AT (1) ATE525499T1 (de)
AU (1) AU2003269052A1 (de)
FR (1) FR2842832B1 (de)
WO (1) WO2004012227A2 (de)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7118929B2 (en) 2000-07-07 2006-10-10 Lumilog Process for producing an epitaxial layer of gallium nitride
US7560296B2 (en) 2000-07-07 2009-07-14 Lumilog Process for producing an epitalixal layer of galium nitride
FR2869459B1 (fr) * 2004-04-21 2006-08-04 Commissariat Energie Atomique Realignement entre niveaux apres une etape d'epitaxie.
US7238560B2 (en) * 2004-07-23 2007-07-03 Cree, Inc. Methods of fabricating nitride-based transistors with a cap layer and a recessed gate
TWI442456B (zh) 2004-08-31 2014-06-21 學校法人上智學院 發光元件
US7626217B2 (en) * 2005-04-11 2009-12-01 Cree, Inc. Composite substrates of conductive and insulating or semi-insulating group III-nitrides for group III-nitride devices
US20060267043A1 (en) * 2005-05-27 2006-11-30 Emerson David T Deep ultraviolet light emitting devices and methods of fabricating deep ultraviolet light emitting devices
US9331192B2 (en) * 2005-06-29 2016-05-03 Cree, Inc. Low dislocation density group III nitride layers on silicon carbide substrates and methods of making the same
TWI519686B (zh) * 2005-12-15 2016-02-01 聖戈班晶體探測器公司 低差排密度氮化鎵(GaN)之生長方法
KR100809209B1 (ko) * 2006-04-25 2008-02-29 삼성전기주식회사 비극성 m면 질화물 반도체 제조방법
WO2008115135A1 (en) * 2007-03-16 2008-09-25 Sebastian Lourdudoss Semiconductor heterostructures and manufacturing thereof
CN101730926B (zh) * 2007-07-26 2012-09-19 硅绝缘体技术有限公司 改进的外延材料的制造方法
JP5903714B2 (ja) * 2007-07-26 2016-04-13 ソイテックSoitec エピタキシャル方法およびこの方法によって成長させられたテンプレート
CN102184850B (zh) * 2011-05-13 2012-11-21 润奥电子(扬州)制造有限公司 用于制备半导体器件的深结扩散方法
JP5649514B2 (ja) 2011-05-24 2015-01-07 株式会社東芝 半導体発光素子、窒化物半導体層、及び、窒化物半導体層の形成方法
KR101237351B1 (ko) * 2011-05-27 2013-03-04 포항공과대학교 산학협력단 전극 및 이를 포함한 전자 소자
EP2701183A4 (de) 2011-08-09 2014-07-30 Panasonic Corp Struktur zum züchten einer nitrid-halbleiterschicht, stapelstruktur, halbleiterelement auf nitridbasis, lichtquelle und herstellungsverfahren dafür
US9093395B2 (en) * 2011-09-02 2015-07-28 Avogy, Inc. Method and system for local control of defect density in gallium nitride based electronics
DE102012101211A1 (de) * 2012-02-15 2013-08-22 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterbauelements
JP6106932B2 (ja) * 2012-03-19 2017-04-05 株式会社リコー 13族窒化物結晶、及び13族窒化物結晶基板
CN103367121B (zh) * 2012-03-28 2016-04-13 清华大学 外延结构体的制备方法
CN103378223B (zh) * 2012-04-25 2016-07-06 清华大学 外延结构体的制备方法
DE102012217073B4 (de) 2012-09-21 2024-11-28 Robert Bosch Gmbh Vertikales mikroelektronisches Bauelement
KR101504731B1 (ko) * 2012-11-30 2015-03-23 주식회사 소프트에피 3족 질화물 반도체 적층체
JP6090998B2 (ja) * 2013-01-31 2017-03-08 一般財団法人電力中央研究所 六方晶単結晶の製造方法、六方晶単結晶ウエハの製造方法
US20170155016A9 (en) * 2013-03-07 2017-06-01 Meijo University Nitride semiconductor crystal and method of fabricating the same
DE102013210814A1 (de) 2013-06-10 2014-12-11 Robert Bosch Gmbh Verfahren zum Herstellen eines Transistors mit hoher Elektronenbeweglichkeit
DE102013211374A1 (de) 2013-06-18 2014-12-18 Robert Bosch Gmbh Transistor und Verfahren zur Herstellung eines Transistors
US10032911B2 (en) 2013-12-23 2018-07-24 Intel Corporation Wide band gap transistor on non-native semiconductor substrate
JP6315852B2 (ja) 2013-12-23 2018-04-25 インテル・コーポレーション 半導体トランジスタ構造、システムオンチップおよび半導体トランジスタ構造形成方法
JP6269368B2 (ja) * 2014-07-24 2018-01-31 住友電気工業株式会社 窒化ガリウム基板
WO2016136547A1 (ja) * 2015-02-23 2016-09-01 三菱化学株式会社 C面GaN基板
CN104659089B (zh) * 2015-03-12 2017-09-29 苏州能屋电子科技有限公司 基于侧向外延技术的垂直结构AlGaN/GaN HEMT器件及其制作方法
DE102015109761B4 (de) 2015-06-18 2022-01-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Nitrid-Halbleiterbauelements und Nitrid-Halbleiterbauelement
US10773952B2 (en) 2016-05-20 2020-09-15 Qorvo Us, Inc. Wafer-level package with enhanced performance
US10784149B2 (en) 2016-05-20 2020-09-22 Qorvo Us, Inc. Air-cavity module with enhanced device isolation
US9954089B2 (en) 2016-06-20 2018-04-24 Infineon Technologies Americas Corp. Low dislocation density III-nitride semiconductor component
KR102426231B1 (ko) * 2016-08-08 2022-07-29 미쯔비시 케미컬 주식회사 도전성 C면 GaN 기판
CN113604885B (zh) 2016-08-08 2024-02-02 三菱化学株式会社 C面GaN基板和氮化物半导体器件的制造方法
WO2018031995A1 (en) 2016-08-12 2018-02-15 Qorvo Us, Inc. Wafer-level package with enhanced performance
US10109502B2 (en) 2016-09-12 2018-10-23 Qorvo Us, Inc. Semiconductor package with reduced parasitic coupling effects and process for making the same
CN106783533B (zh) * 2016-11-11 2020-01-07 上海芯元基半导体科技有限公司 含Al氮化物半导体结构及其外延生长方法
US10749518B2 (en) 2016-11-18 2020-08-18 Qorvo Us, Inc. Stacked field-effect transistor switch
US10068831B2 (en) 2016-12-09 2018-09-04 Qorvo Us, Inc. Thermally enhanced semiconductor package and process for making the same
KR102680861B1 (ko) * 2016-12-15 2024-07-03 삼성전자주식회사 질화 갈륨 기판의 제조 방법
US10755992B2 (en) 2017-07-06 2020-08-25 Qorvo Us, Inc. Wafer-level packaging for enhanced performance
US10784233B2 (en) 2017-09-05 2020-09-22 Qorvo Us, Inc. Microelectronics package with self-aligned stacked-die assembly
US11152363B2 (en) * 2018-03-28 2021-10-19 Qorvo Us, Inc. Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process
US12062700B2 (en) 2018-04-04 2024-08-13 Qorvo Us, Inc. Gallium-nitride-based module with enhanced electrical performance and process for making the same
US12046505B2 (en) 2018-04-20 2024-07-23 Qorvo Us, Inc. RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation
US10804246B2 (en) 2018-06-11 2020-10-13 Qorvo Us, Inc. Microelectronics package with vertically stacked dies
CN118213279A (zh) 2018-07-02 2024-06-18 Qorvo美国公司 Rf半导体装置及其制造方法
KR102620159B1 (ko) * 2018-10-08 2024-01-02 삼성전자주식회사 반도체 발광 소자
US11069590B2 (en) 2018-10-10 2021-07-20 Qorvo Us, Inc. Wafer-level fan-out package with enhanced performance
US10964554B2 (en) 2018-10-10 2021-03-30 Qorvo Us, Inc. Wafer-level fan-out package with enhanced performance
CN109638126B (zh) * 2018-10-31 2021-04-06 华灿光电(浙江)有限公司 一种氮化铝模板、深紫外发光二极管外延片及其制备方法
US11646242B2 (en) 2018-11-29 2023-05-09 Qorvo Us, Inc. Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
US12057374B2 (en) 2019-01-23 2024-08-06 Qorvo Us, Inc. RF devices with enhanced performance and methods of forming the same
KR20250027591A (ko) 2019-01-23 2025-02-26 코르보 유에스, 인크. Rf 반도체 디바이스 및 이를 형성하는 방법
US12125825B2 (en) 2019-01-23 2024-10-22 Qorvo Us, Inc. RF devices with enhanced performance and methods of forming the same
US12046570B2 (en) 2019-01-23 2024-07-23 Qorvo Us, Inc. RF devices with enhanced performance and methods of forming the same
US11387157B2 (en) 2019-01-23 2022-07-12 Qorvo Us, Inc. RF devices with enhanced performance and methods of forming the same
US12046483B2 (en) 2019-01-23 2024-07-23 Qorvo Us, Inc. RF devices with enhanced performance and methods of forming the same
US12074086B2 (en) 2019-11-01 2024-08-27 Qorvo Us, Inc. RF devices with nanotube particles for enhanced performance and methods of forming the same
US11646289B2 (en) 2019-12-02 2023-05-09 Qorvo Us, Inc. RF devices with enhanced performance and methods of forming the same
US11923238B2 (en) 2019-12-12 2024-03-05 Qorvo Us, Inc. Method of forming RF devices with enhanced performance including attaching a wafer to a support carrier by a bonding technique without any polymer adhesive
US12129168B2 (en) 2019-12-23 2024-10-29 Qorvo Us, Inc. Microelectronics package with vertically stacked MEMS device and controller device
JP7074168B2 (ja) * 2020-09-03 2022-05-24 三菱ケミカル株式会社 C面GaN基板
WO2022126016A2 (en) 2020-12-11 2022-06-16 Qorvo Us, Inc. Multi-level 3d stacked package and methods of forming the same
JP6971415B1 (ja) * 2020-12-29 2021-11-24 京セラ株式会社 半導体基板、半導体基板の製造方法、半導体基板の製造装置、電子部品および電子機器
JP7638488B2 (ja) * 2021-02-01 2025-03-04 豊田合成株式会社 半導体素子および半導体素子の製造方法
US12062571B2 (en) 2021-03-05 2024-08-13 Qorvo Us, Inc. Selective etching process for SiGe and doped epitaxial silicon
CN115662876A (zh) * 2022-08-31 2023-01-31 珠海庞纳微半导体科技有限公司 外延结构及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2866342A (en) 1956-10-09 1958-12-30 Moorhead John Gerald Heat-actuated motor
FR2063759A5 (de) 1969-10-30 1971-07-09 Pascouet Adrien
US4158322A (en) 1977-08-22 1979-06-19 The United States Of America As Represented By The Secretary Of The Navy Pyrotechnic separation device
EP2234142A1 (de) * 1997-04-11 2010-09-29 Nichia Corporation Nitridhalbleitersubstrat
FR2769924B1 (fr) * 1997-10-20 2000-03-10 Centre Nat Rech Scient Procede de realisation d'une couche epitaxiale de nitrure de gallium, couche epitaxiale de nitrure de gallium et composant optoelectronique muni d'une telle couche
JP4032538B2 (ja) * 1998-11-26 2008-01-16 ソニー株式会社 半導体薄膜および半導体素子の製造方法
JP4145437B2 (ja) * 1999-09-28 2008-09-03 住友電気工業株式会社 単結晶GaNの結晶成長方法及び単結晶GaN基板の製造方法と単結晶GaN基板
FR2806788B1 (fr) 2000-03-24 2002-12-06 Lacroix Soc E Pyromecanisme, notamment pour application dans le domaine spatial
FR2811036B1 (fr) 2000-06-30 2003-09-12 Lacroix Soc E Actionneur a base de micro-impulseurs pyrotechniques
JP3968968B2 (ja) * 2000-07-10 2007-08-29 住友電気工業株式会社 単結晶GaN基板の製造方法
JP3882539B2 (ja) * 2000-07-18 2007-02-21 ソニー株式会社 半導体発光素子およびその製造方法、並びに画像表示装置

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Publication number Publication date
CN1678771A (zh) 2005-10-05
KR20050026962A (ko) 2005-03-16
KR100950903B1 (ko) 2010-04-06
JP4444104B2 (ja) 2010-03-31
HK1097886A1 (en) 2007-07-06
AU2003269052A8 (en) 2004-02-16
FR2842832B1 (fr) 2006-01-20
CN1329560C (zh) 2007-08-01
US20060099781A1 (en) 2006-05-11
EP1525340B1 (de) 2011-09-21
AU2003269052A1 (en) 2004-02-16
FR2842832A1 (fr) 2004-01-30
JP2005534182A (ja) 2005-11-10
WO2004012227A3 (fr) 2004-04-29
US7455729B2 (en) 2008-11-25
EP1525340A2 (de) 2005-04-27
WO2004012227A2 (fr) 2004-02-05

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