ATE525742T1 - Artikellade-/-entladeverfahren und artikellade-/- entladeeinrichtung, belichtungsverfahren und belichtungsvorrichtung und verfahren zur bauelementeherstellung - Google Patents

Artikellade-/-entladeverfahren und artikellade-/- entladeeinrichtung, belichtungsverfahren und belichtungsvorrichtung und verfahren zur bauelementeherstellung

Info

Publication number
ATE525742T1
ATE525742T1 AT06811959T AT06811959T ATE525742T1 AT E525742 T1 ATE525742 T1 AT E525742T1 AT 06811959 T AT06811959 T AT 06811959T AT 06811959 T AT06811959 T AT 06811959T AT E525742 T1 ATE525742 T1 AT E525742T1
Authority
AT
Austria
Prior art keywords
placing table
unloading
article loading
exposure
loading
Prior art date
Application number
AT06811959T
Other languages
English (en)
Inventor
Taro Sugihara
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Application granted granted Critical
Publication of ATE525742T1 publication Critical patent/ATE525742T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0474—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Library & Information Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AT06811959T 2005-10-19 2006-10-18 Artikellade-/-entladeverfahren und artikellade-/- entladeeinrichtung, belichtungsverfahren und belichtungsvorrichtung und verfahren zur bauelementeherstellung ATE525742T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005304602 2005-10-19
JP2006020763 2006-10-18

Publications (1)

Publication Number Publication Date
ATE525742T1 true ATE525742T1 (de) 2011-10-15

Family

ID=37962523

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06811959T ATE525742T1 (de) 2005-10-19 2006-10-18 Artikellade-/-entladeverfahren und artikellade-/- entladeeinrichtung, belichtungsverfahren und belichtungsvorrichtung und verfahren zur bauelementeherstellung

Country Status (6)

Country Link
US (1) US8279406B2 (de)
EP (1) EP1939930B1 (de)
JP (1) JP4978471B2 (de)
KR (1) KR101384440B1 (de)
AT (1) ATE525742T1 (de)
WO (1) WO2007046430A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5241368B2 (ja) * 2008-07-31 2013-07-17 キヤノン株式会社 処理装置及びデバイス製造方法
JP5743437B2 (ja) * 2009-07-09 2015-07-01 キヤノン株式会社 露光装置、露光方法、搬送方法及びデバイスの製造方法
WO2014035347A1 (en) * 2012-08-31 2014-03-06 Semiconductor Technologies & Instruments Pte Ltd System and method for automatically correcting for rotational misalignment of wafers on film frames
US9287151B2 (en) * 2014-01-10 2016-03-15 Taiwan Semiconductor Manufacturing Co., Ltd Systems and method for transferring a semiconductor substrate
CN106292194B (zh) * 2015-05-24 2018-03-30 上海微电子装备（集团）股份有限公司 硅片传输系统
US10403539B2 (en) * 2017-08-04 2019-09-03 Kawasaki Jukogyo Kabushiki Kaisha Robot diagnosing method
US10651065B2 (en) * 2017-12-06 2020-05-12 Lam Research Corporation Auto-calibration to a station of a process module that spins a wafer
JP7083645B2 (ja) * 2018-01-11 2022-06-13 Ｊｓｗアクティナシステム株式会社 レーザ処理装置、レーザ処理方法及び半導体装置の製造方法
JP7412137B2 (ja) * 2019-11-06 2024-01-12 東京エレクトロン株式会社 基板処理装置及び基板収納容器保管方法
WO2021156985A1 (ja) * 2020-02-05 2021-08-12 株式会社安川電機 搬送システム、搬送方法および搬送装置
JP7536582B2 (ja) * 2020-10-01 2024-08-20 ニデックインスツルメンツ株式会社 搬送システム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5897986A (en) * 1997-05-28 1999-04-27 Anvik Corporation Projection patterning of large substrates using limited-travel x-y stage
JPH11284052A (ja) * 1998-01-30 1999-10-15 Nikon Corp 基板搬送方法、基板搬送装置、及び露光装置、並びにデバイス製造方法
US6690450B2 (en) * 2000-01-31 2004-02-10 Nikon Corporation Exposure method, exposure apparatus, method for producing exposure apparatus, and method for producing device
DE10011130A1 (de) 2000-03-10 2001-09-13 Mannesmann Vdo Ag Entlüftungseinrichtung für einen Kraftstoffbehälter
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
JPWO2003017344A1 (ja) * 2001-08-20 2004-12-09 株式会社ニコン マスク交換方法及び露光装置
JP4228137B2 (ja) 2003-02-14 2009-02-25 株式会社ニコン 露光装置及びデバイス製造方法
JP2005114882A (ja) * 2003-10-06 2005-04-28 Hitachi High-Tech Electronics Engineering Co Ltd 処理ステージの基板載置方法、基板露光ステージおよび基板露光装置
JP4524576B2 (ja) 2004-04-19 2010-08-18 アイシン精機株式会社 ベッド

Also Published As

Publication number Publication date
EP1939930B1 (de) 2011-09-21
JPWO2007046430A1 (ja) 2009-04-23
KR101384440B1 (ko) 2014-04-10
KR20080059554A (ko) 2008-06-30
EP1939930A1 (de) 2008-07-02
WO2007046430A1 (ja) 2007-04-26
JP4978471B2 (ja) 2012-07-18
EP1939930A4 (de) 2010-05-26
US20090213347A1 (en) 2009-08-27
US8279406B2 (en) 2012-10-02

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