ATE540568T1 - Verfahren und vorrichtung zum füllen von trägerbändern mit elektronischen bauteilen - Google Patents

Verfahren und vorrichtung zum füllen von trägerbändern mit elektronischen bauteilen

Info

Publication number
ATE540568T1
ATE540568T1 AT09151921T AT09151921T ATE540568T1 AT E540568 T1 ATE540568 T1 AT E540568T1 AT 09151921 T AT09151921 T AT 09151921T AT 09151921 T AT09151921 T AT 09151921T AT E540568 T1 ATE540568 T1 AT E540568T1
Authority
AT
Austria
Prior art keywords
carrier tape
electronic components
filling
electronic component
carrier tapes
Prior art date
Application number
AT09151921T
Other languages
English (en)
Inventor
Silvain Vienot
Franco Craveiro
Philippe Roy
Original Assignee
Ismeca Semiconductor Holding
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ismeca Semiconductor Holding filed Critical Ismeca Semiconductor Holding
Application granted granted Critical
Publication of ATE540568T1 publication Critical patent/ATE540568T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
    • B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container Filling Or Packaging Operations (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
AT09151921T 2009-02-03 2009-02-03 Verfahren und vorrichtung zum füllen von trägerbändern mit elektronischen bauteilen ATE540568T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP09151921A EP2214467B1 (de) 2009-02-03 2009-02-03 Verfahren und Vorrichtung zum Füllen von Trägerbändern mit elektronischen Bauteilen

Publications (1)

Publication Number Publication Date
ATE540568T1 true ATE540568T1 (de) 2012-01-15

Family

ID=40822922

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09151921T ATE540568T1 (de) 2009-02-03 2009-02-03 Verfahren und vorrichtung zum füllen von trägerbändern mit elektronischen bauteilen

Country Status (10)

Country Link
US (1) US9521793B2 (de)
EP (1) EP2214467B1 (de)
JP (1) JP5456792B2 (de)
KR (1) KR101587179B1 (de)
CN (1) CN102301845B (de)
AT (1) ATE540568T1 (de)
MY (1) MY152648A (de)
SG (1) SG172767A1 (de)
TW (1) TWI467631B (de)
WO (1) WO2010089275A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012116528A (ja) * 2010-11-30 2012-06-21 Ueno Seiki Kk テーピングユニット及び電子部品検査装置
WO2013192222A2 (en) * 2012-06-18 2013-12-27 Hzo, Inc. Systems and methods for applying protective coatings to internal surfaces of fully assembled electronic devices
JP5219056B1 (ja) * 2012-09-06 2013-06-26 上野精機株式会社 テーピングユニット及び電子部品検査装置
CN103869711B (zh) * 2012-12-11 2016-04-06 成都先进功率半导体股份有限公司 编带齿轮自动下降的控制方法
US9894776B2 (en) * 2013-01-08 2018-02-13 Hzo, Inc. System for refurbishing or remanufacturing an electronic device
EP2943289A4 (de) 2013-01-08 2016-02-17 Hzo Inc Abdeckung von substraten zum auftragen von schutzschichten
US10449568B2 (en) 2013-01-08 2019-10-22 Hzo, Inc. Masking substrates for application of protective coatings
CN104890923A (zh) * 2014-03-07 2015-09-09 深圳市三一联光智能设备股份有限公司 编带机自动取换料装置
JP6202033B2 (ja) * 2014-05-15 2017-09-27 株式会社村田製作所 テーピング電子部品連用リール及びその製造方法
JP6655355B2 (ja) * 2015-11-05 2020-02-26 Juki株式会社 実装装置及び部品返却方法
KR20180103824A (ko) 2016-01-15 2018-09-19 라스코 게엠베하 플립에 의해서 테스트 중인 장치들을 시험장치로 로드 및 언로드하는 장치 및 방법
WO2018188731A1 (de) * 2017-04-11 2018-10-18 Muehlbauer GmbH & Co. KG Bauteil-empfangseinrichtung mit optischem sensor
TWI627400B (zh) * 2017-04-11 2018-06-21 Defective rejection method for passive component batch detection and rejection system thereof
JP6366121B1 (ja) * 2017-07-06 2018-08-01 上野精機株式会社 テーピング装置
JP6966294B2 (ja) * 2017-11-15 2021-11-10 太陽誘電株式会社 テーピング装置およびテーピング方法
EP3506340B1 (de) * 2017-12-28 2020-10-21 Nexperia B.V. Verbindungs- und indexierungsvorrichtung
CN110481844A (zh) * 2018-05-14 2019-11-22 深圳市复德科技有限公司 盖带防折叠装置及具有该盖带防折叠装置的替换料设备
CN110515627A (zh) * 2019-07-24 2019-11-29 白锦添 一种快速安全自动烧录系统
TWI708536B (zh) 2019-11-25 2020-10-21 欣興電子股份有限公司 移除局部蓋體的裝置及移除局部蓋體的方法
CN113232947B (zh) * 2021-03-24 2023-06-16 湖北九邦现代农业有限公司 一种可实现自动更换和封装鸡蛋的检测设备及其检测方法
CN115043042B (zh) * 2022-06-07 2023-06-30 东莞广达智能科技有限公司 一种全自动多方位视觉检测和包装一体设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8513297D0 (en) * 1985-05-28 1985-07-03 Dynapert Precima Ltd Machines for handling electrical components
WO1999003733A1 (en) * 1997-07-16 1999-01-28 Systemation Engineered Products, Inc. Position sensing system for an inspection and handling system
US5974903A (en) 1998-01-08 1999-11-02 Intel Corporation Method and apparatus for in situ visual inspection of die products in tape and reel shipping medium
JP4050425B2 (ja) * 1999-07-08 2008-02-20 ローム株式会社 電子部品の連続式テーピング装置
EP1073325A3 (de) 1999-07-27 2002-04-03 Lucent Technologies Inc. Prüfung und Transportierung von halbleitenden Chips
US6634159B1 (en) * 1999-09-20 2003-10-21 Sanyo Electric Co., Ltd. Taping apparatus for electronic components
JP3690257B2 (ja) * 2000-08-28 2005-08-31 株式会社村田製作所 チップ部品の搬送装置
US20020133940A1 (en) * 2001-03-26 2002-09-26 Fuji Machine Mfg. Co., Ltd Electric-component supplying method and device, and electric-component mounting method and system
JP4154652B2 (ja) * 2002-08-30 2008-09-24 澁谷工業株式会社 テーピング装置
CN100475020C (zh) 2003-03-07 2009-04-01 伊斯梅卡半导体控股公司 从管中取出电子元件的方法和装置及电子元件输送装置
KR100527211B1 (ko) * 2005-02-28 2005-11-08 윈텍 주식회사 전자부품 검사 시스템
DE102005041024A1 (de) * 2005-08-23 2007-03-01 Bielomatik Leuze Gmbh + Co.Kg Vorrichtung und Verfahren zum kontinuierlichen Erzeugen einer fehlerfreien Trägerbahn

Also Published As

Publication number Publication date
TWI467631B (zh) 2015-01-01
MY152648A (en) 2014-10-31
US9521793B2 (en) 2016-12-13
TW201036032A (en) 2010-10-01
WO2010089275A1 (en) 2010-08-12
EP2214467A1 (de) 2010-08-04
WO2010089275A8 (en) 2011-06-16
JP5456792B2 (ja) 2014-04-02
KR101587179B1 (ko) 2016-02-02
JP2012516813A (ja) 2012-07-26
SG172767A1 (en) 2011-08-29
US20110231002A1 (en) 2011-09-22
EP2214467B1 (de) 2012-01-04
CN102301845B (zh) 2015-05-13
CN102301845A (zh) 2011-12-28
HK1147158A1 (en) 2011-07-29
KR20110127118A (ko) 2011-11-24

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