ATE526688T1 - Strahlungsemittierender halbleiterkörper mit vorgefertigtem wellenlängenumwandlungselement - Google Patents

Strahlungsemittierender halbleiterkörper mit vorgefertigtem wellenlängenumwandlungselement

Info

Publication number
ATE526688T1
ATE526688T1 AT05104674T AT05104674T ATE526688T1 AT E526688 T1 ATE526688 T1 AT E526688T1 AT 05104674 T AT05104674 T AT 05104674T AT 05104674 T AT05104674 T AT 05104674T AT E526688 T1 ATE526688 T1 AT E526688T1
Authority
AT
Austria
Prior art keywords
wavelength converting
conversion element
wavelength conversion
semiconductor body
emitting semiconductor
Prior art date
Application number
AT05104674T
Other languages
English (en)
Inventor
Paul Martin
Gerd Mueller
Regina Mueller-Mach
Helena Ticha
Ladislav Tichy
Original Assignee
Philips Lumileds Lighting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Lumileds Lighting Co filed Critical Philips Lumileds Lighting Co
Application granted granted Critical
Publication of ATE526688T1 publication Critical patent/ATE526688T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2214/00—Nature of the non-vitreous component
    • C03C2214/04—Particles; Flakes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2214/00—Nature of the non-vitreous component
    • C03C2214/16—Microcrystallites, e.g. of optically or electrically active material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
AT05104674T 2004-06-09 2005-05-31 Strahlungsemittierender halbleiterkörper mit vorgefertigtem wellenlängenumwandlungselement ATE526688T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/863,980 US7553683B2 (en) 2004-06-09 2004-06-09 Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices

Publications (1)

Publication Number Publication Date
ATE526688T1 true ATE526688T1 (de) 2011-10-15

Family

ID=34940029

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05104674T ATE526688T1 (de) 2004-06-09 2005-05-31 Strahlungsemittierender halbleiterkörper mit vorgefertigtem wellenlängenumwandlungselement

Country Status (5)

Country Link
US (2) US7553683B2 (de)
EP (1) EP1605526B1 (de)
JP (2) JP5155518B2 (de)
AT (1) ATE526688T1 (de)
TW (1) TWI443853B (de)

Families Citing this family (159)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7518158B2 (en) 2003-12-09 2009-04-14 Cree, Inc. Semiconductor light emitting devices and submounts
CN100411207C (zh) * 2004-06-28 2008-08-13 京瓷株式会社 发光装置及照明装置
TWI241038B (en) * 2004-09-14 2005-10-01 Ind Tech Res Inst Light emitting diode structure and fabrication method thereof
US7452483B2 (en) * 2004-09-30 2008-11-18 Global Tungsten & Powders Corp. Yellow-emitting phosphor blend for electroluminescent lamps
US7462502B2 (en) * 2004-11-12 2008-12-09 Philips Lumileds Lighting Company, Llc Color control by alteration of wavelength converting element
US7419839B2 (en) 2004-11-12 2008-09-02 Philips Lumileds Lighting Company, Llc Bonding an optical element to a light emitting device
US7858408B2 (en) * 2004-11-15 2010-12-28 Koninklijke Philips Electronics N.V. LED with phosphor tile and overmolded phosphor in lens
TWI420686B (zh) * 2004-12-10 2013-12-21 松下電器產業股份有限公司 半導體發光裝置、發光模組及照明裝置
US20060138443A1 (en) * 2004-12-23 2006-06-29 Iii-N Technology, Inc. Encapsulation and packaging of ultraviolet and deep-ultraviolet light emitting diodes
WO2006093011A1 (ja) * 2005-03-01 2006-09-08 Kabushiki Kaisha Toshiba 発光装置
DE102005023134A1 (de) 2005-05-19 2006-11-23 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Lumineszenzkonversions-LED
US8718437B2 (en) 2006-03-07 2014-05-06 Qd Vision, Inc. Compositions, optical component, system including an optical component, devices, and other products
WO2007103310A2 (en) 2006-03-07 2007-09-13 Qd Vision, Inc. An article including semiconductor nanocrystals
EP1922765B1 (de) 2005-08-24 2012-12-26 Philips Intellectual Property & Standards GmbH Elektrolumineszente vorrichtung mit einem lichtumwandlungselement
US20070102718A1 (en) * 2005-11-07 2007-05-10 Akira Takekuma Lens in light emitting device
US8849087B2 (en) 2006-03-07 2014-09-30 Qd Vision, Inc. Compositions, optical component, system including an optical component, devices, and other products
US9874674B2 (en) 2006-03-07 2018-01-23 Samsung Electronics Co., Ltd. Compositions, optical component, system including an optical component, devices, and other products
JP2007273975A (ja) * 2006-03-10 2007-10-18 Matsushita Electric Works Ltd 発光素子
US7682850B2 (en) 2006-03-17 2010-03-23 Philips Lumileds Lighting Company, Llc White LED for backlight with phosphor plates
US8089083B2 (en) * 2006-04-13 2012-01-03 Avago Technologies General Ip (Singapore) Pte. Ltd. System and method for enhancing light emissions from light packages by adjusting the index of refraction at the surface of the encapsulation material
US7905635B2 (en) * 2006-04-25 2011-03-15 Koninklijke Phillips Electronics N.V. Immersed LEDs
JP2007324417A (ja) * 2006-06-01 2007-12-13 Sharp Corp 半導体発光装置とその製造方法
JP4978886B2 (ja) * 2006-06-14 2012-07-18 日本電気硝子株式会社 蛍光体複合材料及び蛍光体複合部材
US20080113877A1 (en) * 2006-08-16 2008-05-15 Intematix Corporation Liquid solution deposition of composition gradient materials
KR100828900B1 (ko) 2006-09-04 2008-05-09 엘지이노텍 주식회사 발광 다이오드 패키지 및 그 제조방법
JP2010509752A (ja) * 2006-11-06 2010-03-25 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 反射エッジを備える波長変換要素
US20080121911A1 (en) * 2006-11-28 2008-05-29 Cree, Inc. Optical preforms for solid state light emitting dice, and methods and systems for fabricating and assembling same
JP2008147563A (ja) * 2006-12-13 2008-06-26 Sharp Corp ばらつきのあるｌｅｄによる均一バックライトの製造方法
US8836212B2 (en) 2007-01-11 2014-09-16 Qd Vision, Inc. Light emissive printed article printed with quantum dot ink
US20100110728A1 (en) 2007-03-19 2010-05-06 Nanosys, Inc. Light-emitting diode (led) devices comprising nanocrystals
WO2008115498A1 (en) * 2007-03-19 2008-09-25 Nanosys, Inc. Methods for encapsulating nanocrystals
JP5341884B2 (ja) 2007-06-12 2013-11-13 コーニンクレッカ フィリップス エヌ ヴェ 画像ガイドされる治療
US7999283B2 (en) * 2007-06-14 2011-08-16 Cree, Inc. Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes
KR101672553B1 (ko) 2007-06-25 2016-11-03 큐디 비젼, 인크. 조성물 및 나노물질의 침착을 포함하는 방법
KR20090002835A (ko) * 2007-07-04 2009-01-09 엘지전자 주식회사 질화물계 발광 소자 및 그 제조방법
TWI404228B (zh) * 2007-07-12 2013-08-01 Epistar Corp 半導體發光裝置與其製造方法
EP2171433A2 (de) 2007-07-16 2010-04-07 Philips Intellectual Property & Standards GmbH Vorrichtung zur bestimmung einer umwandlungsleistung
WO2009014707A2 (en) 2007-07-23 2009-01-29 Qd Vision, Inc. Quantum dot light enhancement substrate and lighting device including same
US8297061B2 (en) * 2007-08-02 2012-10-30 Cree, Inc. Optoelectronic device with upconverting luminophoric medium
US11114594B2 (en) * 2007-08-24 2021-09-07 Creeled, Inc. Light emitting device packages using light scattering particles of different size
US8128249B2 (en) 2007-08-28 2012-03-06 Qd Vision, Inc. Apparatus for selectively backlighting a material
US7737457B2 (en) * 2007-09-27 2010-06-15 Lumination Llc Phosphor down converting element for an LED package and fabrication method
JP2009130301A (ja) * 2007-11-27 2009-06-11 Sharp Corp 発光素子および発光素子の製造方法
DE102007057812A1 (de) 2007-11-30 2009-06-25 Schott Ag Lichtemittierende Vorrichtung und Verfahren zu deren Herstellung sowie Lichtkonverter und dessen Verwendung
DE102007057671A1 (de) * 2007-11-30 2009-06-04 Osram Opto Semiconductors Gmbh Beleuchtungsvorrichtung
WO2009072029A2 (en) * 2007-12-03 2009-06-11 Philips Intellectual Property & Standards Gmbh Ceramic material for leds with reduced scattering and method of making the same
WO2009145813A1 (en) 2008-03-04 2009-12-03 Qd Vision, Inc. Particles including nanoparticles, uses thereof, and methods
EP2272102B1 (de) * 2008-03-26 2016-06-22 Panasonic Intellectual Property Management Co., Ltd. Lichtemittierende halbleitervorrichtung
DE102008021438A1 (de) 2008-04-29 2009-12-31 Schott Ag Konversionsmaterial insbesondere für eine, eine Halbleiterlichtquelle umfassende weiße oder farbige Lichtquelle, Verfahren zu dessen Herstellung sowie dieses Konversionsmaterial umfassende Lichtquelle
DE102008021436A1 (de) * 2008-04-29 2010-05-20 Schott Ag Optik-Konverter-System für (W)LEDs
US9287469B2 (en) * 2008-05-02 2016-03-15 Cree, Inc. Encapsulation for phosphor-converted white light emitting diode
US8038497B2 (en) * 2008-05-05 2011-10-18 Cree, Inc. Methods of fabricating light emitting devices by selective deposition of light conversion materials based on measured emission characteristics
US9207385B2 (en) 2008-05-06 2015-12-08 Qd Vision, Inc. Lighting systems and devices including same
WO2009151515A1 (en) 2008-05-06 2009-12-17 Qd Vision, Inc. Solid state lighting devices including quantum confined semiconductor nanoparticles
WO2009137053A1 (en) 2008-05-06 2009-11-12 Qd Vision, Inc. Optical components, systems including an optical component, and devices
EP2301071B1 (de) * 2008-05-29 2019-05-08 Cree, Inc. Lichtquelle mit nahfeldmischung
US7800125B2 (en) * 2008-07-09 2010-09-21 Himax Display, Inc. Light-emitting diode package
US10147843B2 (en) * 2008-07-24 2018-12-04 Lumileds Llc Semiconductor light emitting device including a window layer and a light-directing structure
DE102008052751A1 (de) * 2008-10-22 2010-04-29 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines Lumineszenzkonversionselements, Lumineszenzkonversionselement und optoelektronisches Bauteil
US20100119839A1 (en) 2008-11-13 2010-05-13 Maven Optronics Corp. System and Method for Forming a Thin-Film Phosphor Layer for Phosphor-Converted Light Emitting Devices
KR101154758B1 (ko) * 2008-11-18 2012-06-08 엘지이노텍 주식회사 반도체 발광소자 및 이를 구비한 발광소자 패키지
JP2010219163A (ja) * 2009-03-13 2010-09-30 Koito Mfg Co Ltd 発光モジュール、および灯具ユニット
US20100264371A1 (en) * 2009-03-19 2010-10-21 Nick Robert J Composition including quantum dots, uses of the foregoing, and methods
CN102460741A (zh) 2009-05-05 2012-05-16 3M创新有限公司 具有增大的提取效率的再发光半导体构造
KR20120015337A (ko) 2009-05-05 2012-02-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Ｌｅｄ에서 사용하기 위한 재방출 반도체 캐리어 디바이스 및 제조 방법
WO2011008476A1 (en) 2009-06-30 2011-01-20 3M Innovative Properties Company Cadmium-free re-emitting semiconductor construction
JP2012526391A (ja) 2009-05-05 2012-10-25 スリーエム イノベイティブ プロパティズ カンパニー インジウム空乏機構を利用してインジウム含有基板上で成長した半導体素子
US8597963B2 (en) 2009-05-19 2013-12-03 Intematix Corporation Manufacture of light emitting devices with phosphor wavelength conversion
US8227276B2 (en) * 2009-05-19 2012-07-24 Intematix Corporation Manufacture of light emitting devices with phosphor wavelength conversion
US8227269B2 (en) * 2009-05-19 2012-07-24 Intematix Corporation Manufacture of light emitting devices with phosphor wavelength conversion
WO2010134331A1 (en) * 2009-05-22 2010-11-25 Panasonic Corporation Semiconductor light-emitting device and light source device using the same
JP2010287687A (ja) * 2009-06-10 2010-12-24 Koito Mfg Co Ltd 発光モジュールおよび発光モジュールの製造方法
EP2449608A1 (de) 2009-06-30 2012-05-09 3M Innovative Properties Company Elektrolumineszente bauelemente mit farbanpassung je stromdichteüberhöhung
EP2449856A1 (de) 2009-06-30 2012-05-09 3M Innovative Properties Company Elektrolumineszente weisslichtelemente mit einstellbarer farbtemperatur
JP5744033B2 (ja) 2009-09-09 2015-07-01 キユーデイー・ビジヨン・インコーポレーテツド ナノ粒子を含む粒子、それの使用および方法
WO2011031876A1 (en) 2009-09-09 2011-03-17 Qd Vision, Inc. Formulations including nanoparticles
US20110062469A1 (en) * 2009-09-17 2011-03-17 Koninklijke Philips Electronics N.V. Molded lens incorporating a window element
WO2011035478A1 (zh) * 2009-09-25 2011-03-31 海洋王照明科技股份有限公司 发光玻璃、其制造方法及发光装置
CN102548756A (zh) * 2009-09-25 2012-07-04 海洋王照明科技股份有限公司 发光玻璃、其制造方法及发光装置
US20120308760A1 (en) * 2009-09-25 2012-12-06 Ocean's King Lighting Science & Technology Co., Ltd. Luminescent glass, producing method thereof and luminescent device
EP2481571B1 (de) * 2009-09-25 2017-05-31 Ocean's King Lighting Science & Technology Co., Ltd. Lumineszenzglas, herstellungsverfahren und lumineszenzvorrichtung
US20120225240A1 (en) * 2009-09-25 2012-09-06 Ocean's King Lighting Science & Technology Co., Ltd. Luminescent glass, producing method thereof and luminescent device
EP2482351A4 (de) * 2009-09-25 2013-06-05 Oceans King Lighting Science Lichtemittierendes halbleiterbauelement und verkapselungsverfahren dafür
US20120225238A1 (en) * 2009-09-25 2012-09-06 OCEAN'S KING LILGHTING SCIENCE & tECHNOLOGY CO., LTD Luminescent glass, producing method thereof and luminescent device
US20120219750A1 (en) * 2009-09-25 2012-08-30 Oceans King Lighting Science & Technology Co., Ltd Luminescent glass, producing method thereof and luminescent device
DE102009048401A1 (de) 2009-10-06 2011-04-07 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil
WO2011047385A1 (en) 2009-10-17 2011-04-21 Qd Vision, Inc. An optical, component, products including same, and methods for making same
JP2011171557A (ja) * 2010-02-19 2011-09-01 Toshiba Corp 発光装置、その製造方法および発光装置製造装置
CN102714263B (zh) * 2010-02-25 2015-11-25 韩国莱太柘晶电株式会社 发光二极管及其制造方法
DE102010009456A1 (de) 2010-02-26 2011-09-01 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement mit einem Halbleiterchip und einem Konversionselement und Verfahren zu dessen Herstellung
US8154052B2 (en) 2010-05-06 2012-04-10 Koninklijke Philips Electronics N.V. Light emitting device grown on wavelength converting substrate
DE102010022561A1 (de) * 2010-06-02 2011-12-08 Osram Opto Semiconductors Gmbh Wellenlängenkonversionselement, optoelektronisches Bauelement mit einem Wellenlängenkonversionselement und Verfahren zur Herstellung eines Wellenlängenkonversionselements
JP2012033823A (ja) 2010-08-02 2012-02-16 Stanley Electric Co Ltd 発光装置およびその製造方法
DE102010034923A1 (de) * 2010-08-20 2012-02-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Schichtverbunds aus einer Lumineszenzkonversionsschicht und einer Streuschicht
DE102010047476B4 (de) 2010-10-06 2017-01-26 Schott Ag Verfahren zur konturgetreuen Herstellung von Wellenlängenkonvertern für eine auf Halbleiterlichtquellen basierende weiße oder farbige Lichtquelle
DE102010042217A1 (de) * 2010-10-08 2012-04-12 Osram Ag Optoelektronisches Halbleiterbauelement und Verfahren zu seiner Herstellung
KR101909299B1 (ko) * 2010-10-27 2018-10-17 루미리즈 홀딩 비.브이. 발광 디바이스의 제조를 위한 적층 지지막 및 그 제조 방법
KR20140009987A (ko) 2010-10-28 2014-01-23 코닝 인코포레이티드 Led 광 제품용 유리 프릿 물질을 포함하는 형광체
US10158057B2 (en) 2010-10-28 2018-12-18 Corning Incorporated LED lighting devices
US20120138981A1 (en) * 2010-12-02 2012-06-07 Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense Light-Emitting Diode Apparatus and Method for Making the Same
TWI517452B (zh) * 2011-03-02 2016-01-11 建準電機工業股份有限公司 發光晶體之多晶封裝結構
KR101769356B1 (ko) * 2011-03-25 2017-08-18 삼성전자주식회사 발광소자에 형광체층을 형성하는 방법 및 장치
TWI489656B (zh) * 2011-03-25 2015-06-21 三星電子股份有限公司 發光二極體、發光二極體之製造方法、發光二極體模組及發光二極體模組之製造方法
KR101212654B1 (ko) * 2011-05-20 2012-12-14 (주)라이타이저코리아 발광 다이오드 패키지 및 그의 제조 방법
DE102011078689A1 (de) * 2011-07-05 2013-01-10 Osram Ag Verfahren zur Herstellung eines Konversionselements und Konversionselement
US8742655B2 (en) * 2011-07-22 2014-06-03 Guardian Industries Corp. LED lighting systems with phosphor subassemblies, and/or methods of making the same
KR102082499B1 (ko) 2011-08-26 2020-02-27 루미리즈 홀딩 비.브이. 반도체 구조를 프로세싱하는 방법
DE102011084316A1 (de) * 2011-10-12 2013-04-18 Osram Gmbh Verfahren zur Herstellung eines optischen Elements
US9365766B2 (en) * 2011-10-13 2016-06-14 Intematix Corporation Wavelength conversion component having photo-luminescence material embedded into a hermetic material for remote wavelength conversion
JP2012060192A (ja) * 2011-12-26 2012-03-22 Toshiba Corp 発光装置、その製造方法および発光装置製造装置
JP6044073B2 (ja) 2011-12-27 2016-12-14 日亜化学工業株式会社 波長変換装置及びそれを用いた発光装置
US9257617B2 (en) * 2012-02-10 2016-02-09 Koninklijke Philips N.V. Wavelength converted light emitting device
CN111554781B (zh) 2012-03-19 2024-04-12 亮锐控股有限公司 磷光体施加前后发光器件的单个化
CN103367611B (zh) 2012-03-28 2017-08-08 日亚化学工业株式会社 波长变换用无机成型体及其制造方法以及发光装置
JP6149309B2 (ja) 2012-03-30 2017-06-21 コーニング インコーポレイテッド Ｌｅｄ蛍光体用のビスマスホウ酸塩ガラス封着剤
JP2013219123A (ja) * 2012-04-06 2013-10-24 Nippon Electric Glass Co Ltd 波長変換部材およびその製造方法
CN103367604B (zh) * 2012-04-06 2017-05-03 晶元光电股份有限公司 发光元件
TWI535070B (zh) * 2012-04-06 2016-05-21 晶元光電股份有限公司 發光元件
RU2565324C2 (ru) * 2012-06-11 2015-10-20 Александр Петрович Потемкин Оптическое согласующее устройство
KR101964418B1 (ko) * 2012-07-02 2019-04-01 엘지이노텍 주식회사 형광체 조성물 및 이를 포함하는 조명 장치
US10017849B2 (en) 2012-11-29 2018-07-10 Corning Incorporated High rate deposition systems and processes for forming hermetic barrier layers
US9202996B2 (en) 2012-11-30 2015-12-01 Corning Incorporated LED lighting devices with quantum dot glass containment plates
JP6097084B2 (ja) 2013-01-24 2017-03-15 スタンレー電気株式会社 半導体発光装置
CN104956503A (zh) * 2013-01-31 2015-09-30 松下知识产权经营株式会社 发光装置的制造方法、以及制造装置
US8876312B2 (en) 2013-03-05 2014-11-04 Avago Technologies General Ip (Singapore) Pte. Ltd. Lighting device and apparatus with spectral converter within a casing
US8928219B2 (en) 2013-03-05 2015-01-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Lighting device with spectral converter
JP6414391B2 (ja) * 2013-04-30 2018-10-31 日亜化学工業株式会社 発光装置の製造方法
EP3020076B1 (de) * 2013-07-08 2017-09-06 Koninklijke Philips N.V. Wellenlängenumgewandeltes lichtemittierendes halbleiterbauelement
WO2015008243A1 (en) * 2013-07-19 2015-01-22 Koninklijke Philips N.V. Pc led with optical element and without substrate carrier
CN105637061A (zh) 2013-08-05 2016-06-01 康宁股份有限公司 发光的涂层和装置
US9685628B2 (en) 2013-08-16 2017-06-20 Samsung Electronics Co., Ltd. Methods for making optical components, optical components, and products including same
JP6438648B2 (ja) * 2013-11-15 2018-12-19 日亜化学工業株式会社 半導体発光装置およびその製造方法
KR102323289B1 (ko) * 2014-01-07 2021-11-08 루미리즈 홀딩 비.브이. 인광체 변환기를 갖는 비접착식 발광 디바이스
EP2953176A1 (de) * 2014-06-02 2015-12-09 Swarovski Energy GmbH Beleuchtungsvorrichtung
KR102203690B1 (ko) * 2014-08-21 2021-01-15 엘지이노텍 주식회사 형광체 플레이트 및 이를 제조하는 방법
US9373761B2 (en) * 2014-09-23 2016-06-21 Osram Sylvania Inc. Patterned thin-film wavelength converter and method of making same
JP6634447B2 (ja) * 2014-10-27 2020-01-22 ルミレッズ ホールディング ベーフェー 指向性発光装置及びその製造方法
US10249599B2 (en) * 2016-06-29 2019-04-02 eLux, Inc. Laminated printed color conversion phosphor sheets
JP6755090B2 (ja) * 2014-12-11 2020-09-16 シチズン電子株式会社 発光装置及び発光装置の製造方法
KR102346157B1 (ko) * 2015-03-23 2021-12-31 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
US10347798B2 (en) 2015-06-01 2019-07-09 Intematix Corporation Photoluminescence material coating of LED chips
JP6680868B2 (ja) 2015-08-17 2020-04-15 インフィニット アースロスコピー インコーポレーテッド， リミテッド 光源
US9816687B2 (en) 2015-09-24 2017-11-14 Intel Corporation MEMS LED zoom
US9746689B2 (en) 2015-09-24 2017-08-29 Intel Corporation Magnetic fluid optical image stabilization
WO2017087448A1 (en) 2015-11-16 2017-05-26 Infinite Arthroscopy Inc, Limited Wireless medical imaging system
US11307434B2 (en) 2016-09-01 2022-04-19 3D Live, Inc. Stereoscopic display apparatus employing light emitting diodes with polarizing film/lens materials
DE102017101729A1 (de) * 2017-01-30 2018-08-02 Osram Opto Semiconductors Gmbh Strahlungsemittierende Vorrichtung
ES2955917T3 (es) 2017-02-15 2023-12-11 Lazurite Holdings Llc Sistema médico inalámbrico de formación de imágenes que comprende unidad de cabezal y cable de luz que comprende fuente luminosa integrada
CN107342353B (zh) * 2017-06-06 2019-07-05 佛山市香港科技大学Led-Fpd工程技术研究开发中心 一种聚焦紫外led封装结构及其制备方法
CN112005390B (zh) * 2018-04-23 2025-02-28 科锐Led公司 包括具有图案化表面的覆板的半导体发光装置
JP7022284B2 (ja) 2019-06-17 2022-02-18 日亜化学工業株式会社 発光装置の製造方法
JP7335506B2 (ja) 2019-11-29 2023-08-30 日亜化学工業株式会社 セラミックス複合体の製造方法
USD938584S1 (en) 2020-03-30 2021-12-14 Lazurite Holdings Llc Hand piece
DE102021117776A1 (de) 2020-07-13 2022-01-13 Nichia Corporation Verfahren zur herstellung eines wellenlängenumwandlungsbauteils und wellenlängenumwandlungsbauteil
USD972176S1 (en) 2020-08-06 2022-12-06 Lazurite Holdings Llc Light source
KR102918537B1 (ko) 2020-10-06 2026-01-26 삼성전자 주식회사 LED(Light Emitting Diode) 패키지 및 이를 포함하는 전자 장치
US11973069B2 (en) * 2021-06-25 2024-04-30 Lumileds Llc Fabrication of LED arrays and LED array light engines
KR102625710B1 (ko) * 2021-09-24 2024-01-16 주식회사 루츠 형광체의 제조방법
CN118588840A (zh) * 2024-06-11 2024-09-03 惠州视维新技术有限公司 封装结构及其制备方法、显示装置

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2857541A (en) 1954-03-29 1958-10-21 Westinghouse Electric Corp Thin sheet of phosphor embedded glass and method of preparing
US3104339A (en) * 1960-08-08 1963-09-17 Sylvania Electric Prod Electroluminescent device
US4825084A (en) * 1986-08-19 1989-04-25 Peter F. Braunlich Laser readable thermoluminescent radiation dosimeters and methods for producing thereof
US5376580A (en) * 1993-03-19 1994-12-27 Hewlett-Packard Company Wafer bonding of light emitting diode layers
DE29724847U1 (de) * 1996-06-26 2004-09-30 Osram Opto Semiconductors Gmbh Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
JP3424061B2 (ja) 1997-01-31 2003-07-07 スタンレー電気株式会社 発光ダイオードの製造方法
DE59814117D1 (de) * 1997-03-03 2007-12-20 Philips Intellectual Property Weisse lumineszenzdiode
US5813753A (en) * 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
JP2947344B2 (ja) * 1997-08-19 1999-09-13 サンケン電気株式会社 発光ダイオード装置
DE69839300T2 (de) * 1997-12-15 2009-04-16 Philips Lumileds Lighting Company, LLC, San Jose Licht-emittierende Vorrichtung
US6294800B1 (en) * 1998-02-06 2001-09-25 General Electric Company Phosphors for white light generation from UV emitting diodes
US6255670B1 (en) * 1998-02-06 2001-07-03 General Electric Company Phosphors for light generation from light emitting semiconductors
JP3215665B2 (ja) 1998-06-17 2001-10-09 株式会社コトブキ 締め止め装置
JP4109756B2 (ja) * 1998-07-07 2008-07-02 スタンレー電気株式会社 発光ダイオード
US5959316A (en) * 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US6994607B2 (en) * 2001-12-28 2006-02-07 Applied Materials, Inc. Polishing pad with window
US6155699A (en) * 1999-03-15 2000-12-05 Agilent Technologies, Inc. Efficient phosphor-conversion led structure
US6504301B1 (en) 1999-09-03 2003-01-07 Lumileds Lighting, U.S., Llc Non-incandescent lightbulb package using light emitting diodes
US6630691B1 (en) * 1999-09-27 2003-10-07 Lumileds Lighting U.S., Llc Light emitting diode device comprising a luminescent substrate that performs phosphor conversion
US6696703B2 (en) * 1999-09-27 2004-02-24 Lumileds Lighting U.S., Llc Thin film phosphor-converted light emitting diode device
JP2001177145A (ja) * 1999-12-21 2001-06-29 Toshiba Electronic Engineering Corp 半導体発光素子およびその製造方法
FR2803945A1 (fr) * 2000-01-17 2001-07-20 Thomson Plasma Pate pour realiser des electrodes et procede de fabrication d'une dalle de panneau a plasma
JP2002041144A (ja) 2000-07-28 2002-02-08 Matsushita Electric Ind Co Ltd 移動作業ロボット
US6800857B2 (en) * 2000-08-10 2004-10-05 Canon Kabushiki Kaisha Large-area fiber plate, radiation image pickup apparatus utilizing the same and producing method therefor
JP2002076434A (ja) * 2000-08-28 2002-03-15 Toyoda Gosei Co Ltd 発光装置
US7064355B2 (en) * 2000-09-12 2006-06-20 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
JP2002118292A (ja) * 2000-10-11 2002-04-19 Sanken Electric Co Ltd 半導体発光装置
JP2002141559A (ja) * 2000-10-31 2002-05-17 Sanken Electric Co Ltd 発光半導体チップ組立体及び発光半導体リードフレーム
JP5110744B2 (ja) * 2000-12-21 2012-12-26 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー 発光装置及びその製造方法
US20020084745A1 (en) * 2000-12-29 2002-07-04 Airma Optoelectronics Corporation Light emitting diode with light conversion by dielectric phosphor powder
JP2002241144A (ja) * 2001-02-14 2002-08-28 Konica Corp 低融点高屈折率テルライトガラス及び光学素子
JP2002246651A (ja) 2001-02-20 2002-08-30 Hitachi Cable Ltd 発光ダイオード及びその製造方法
US6417019B1 (en) * 2001-04-04 2002-07-09 Lumileds Lighting, U.S., Llc Phosphor converted light emitting diode
JP3852000B2 (ja) * 2001-09-28 2006-11-29 豊田合成株式会社 発光素子
US6576488B2 (en) * 2001-06-11 2003-06-10 Lumileds Lighting U.S., Llc Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor
TW541710B (en) * 2001-06-27 2003-07-11 Epistar Corp LED having transparent substrate and the manufacturing method thereof
DE10137641A1 (de) * 2001-08-03 2003-02-20 Osram Opto Semiconductors Gmbh Hybrid-LED
JP4447806B2 (ja) * 2001-09-26 2010-04-07 スタンレー電気株式会社 発光装置
JP4076749B2 (ja) * 2001-10-15 2008-04-16 富士フイルム株式会社 導電性有機化合物及び電子素子
JP4158012B2 (ja) * 2002-03-06 2008-10-01 日本電気硝子株式会社 発光色変換部材
JP2003332622A (ja) 2002-05-13 2003-11-21 Nikko Materials Co Ltd 発光ダイオードおよびその製造方法
US6870311B2 (en) * 2002-06-07 2005-03-22 Lumileds Lighting U.S., Llc Light-emitting devices utilizing nanoparticles
JP4201167B2 (ja) 2002-09-26 2008-12-24 シチズン電子株式会社 白色発光装置の製造方法
JP2004127988A (ja) * 2002-09-30 2004-04-22 Toyoda Gosei Co Ltd 白色発光装置
US7312560B2 (en) * 2003-01-27 2007-12-25 3M Innovative Properties Phosphor based light sources having a non-planar long pass reflector and method of making
US7465961B2 (en) * 2003-03-25 2008-12-16 Sharp Kabushiki Kaisha Electronic equipment, backlight structure and keypad for electronic equipment
US7009213B2 (en) * 2003-07-31 2006-03-07 Lumileds Lighting U.S., Llc Light emitting devices with improved light extraction efficiency
EP1668960A2 (de) 2003-09-08 2006-06-14 Nanocrystal Lighting Corporation Lichteffiziente kapselungskonfigurationen für led-lampen durch verwendung von verkapselungsmitteln mit hohem brechungsindex
US7915085B2 (en) * 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
US8040039B2 (en) * 2004-03-18 2011-10-18 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Device and method for emitting composite output light using multiple wavelength-conversion mechanisms

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