ATE527571T1 - Optische bauelemente mit texturierten halbleiterschichten - Google Patents
Optische bauelemente mit texturierten halbleiterschichtenInfo
- Publication number
- ATE527571T1 ATE527571T1 AT05744389T AT05744389T ATE527571T1 AT E527571 T1 ATE527571 T1 AT E527571T1 AT 05744389 T AT05744389 T AT 05744389T AT 05744389 T AT05744389 T AT 05744389T AT E527571 T1 ATE527571 T1 AT E527571T1
- Authority
- AT
- Austria
- Prior art keywords
- textured
- substrate
- layers
- semiconductor
- polar
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/146—Superlattices; Multiple quantum well structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/81—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation
- H10D62/815—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW]
- H10D62/8161—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW] potential variation due to variations in composition or crystallinity, e.g. heterojunction superlattices
- H10D62/8162—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW] potential variation due to variations in composition or crystallinity, e.g. heterojunction superlattices having quantum effects only in the vertical direction, i.e. layered structures having quantum effects solely resulting from vertical potential variation
- H10D62/8164—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW] potential variation due to variations in composition or crystallinity, e.g. heterojunction superlattices having quantum effects only in the vertical direction, i.e. layered structures having quantum effects solely resulting from vertical potential variation comprising only semiconductor materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
- H10F71/1276—The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising growth substrates not made of Group III-V materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/147—Shapes of bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/148—Shapes of potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/70—Surface textures, e.g. pyramid structures
- H10F77/703—Surface textures, e.g. pyramid structures of the semiconductor bodies, e.g. textured active layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/70—Surface textures, e.g. pyramid structures
- H10F77/707—Surface textures, e.g. pyramid structures of the substrates or of layers on substrates, e.g. textured ITO layer on a glass substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/821—Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/544—Solar cells from Group III-V materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Led Devices (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US56248904P | 2004-04-15 | 2004-04-15 | |
| US61504704P | 2004-10-01 | 2004-10-01 | |
| US64570405P | 2005-01-21 | 2005-01-21 | |
| PCT/US2005/012849 WO2005104236A2 (en) | 2004-04-15 | 2005-04-15 | Optical devices featuring textured semiconductor layers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE527571T1 true ATE527571T1 (de) | 2011-10-15 |
Family
ID=35197630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT05744389T ATE527571T1 (de) | 2004-04-15 | 2005-04-15 | Optische bauelemente mit texturierten halbleiterschichten |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7777241B2 (de) |
| EP (1) | EP1735838B1 (de) |
| JP (1) | JP2007533164A (de) |
| AT (1) | ATE527571T1 (de) |
| CA (1) | CA2563418A1 (de) |
| WO (1) | WO2005104236A2 (de) |
Families Citing this family (70)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2262006A3 (de) | 2003-02-26 | 2012-03-21 | Cree, Inc. | Weisslichtquelle mit Leuchtdiode und Leuchtstoffe |
| EP1620903B1 (de) | 2003-04-30 | 2017-08-16 | Cree, Inc. | Festkörper-hochleistungslichtquelle |
| US7482635B2 (en) * | 2004-02-24 | 2009-01-27 | Showa Denko K.K. | Gallium nitride-based compound semiconductor multilayer structure and production method thereof |
| US20050236636A1 (en) * | 2004-04-23 | 2005-10-27 | Supernova Optoelectronics Corp. | GaN-based light-emitting diode structure |
| US7977694B2 (en) * | 2006-11-15 | 2011-07-12 | The Regents Of The University Of California | High light extraction efficiency light emitting diode (LED) with emitters within structured materials |
| US20060267043A1 (en) * | 2005-05-27 | 2006-11-30 | Emerson David T | Deep ultraviolet light emitting devices and methods of fabricating deep ultraviolet light emitting devices |
| KR101351396B1 (ko) | 2005-06-01 | 2014-02-07 | 재팬 사이언스 앤드 테크놀로지 에이젼시 | 반극성 (Ga,Al,In,B)N 박막들, 헤테로구조들, 및소자들의 성장 및 제조에 대한 기술 |
| US20060284163A1 (en) * | 2005-06-15 | 2006-12-21 | Bour David P | Single ELOG growth transverse p-n junction nitride semiconductor laser |
| CN101506937A (zh) * | 2005-10-31 | 2009-08-12 | 波士顿大学理事会 | 特征为织构的半导体层的光学器件 |
| KR101008588B1 (ko) * | 2005-11-16 | 2011-01-17 | 주식회사 에피밸리 | 3족 질화물 반도체 발광소자 |
| US8013320B2 (en) * | 2006-03-03 | 2011-09-06 | Panasonic Corporation | Nitride semiconductor device and method for fabricating the same |
| US7534714B2 (en) * | 2006-05-05 | 2009-05-19 | Applied Materials, Inc. | Radial temperature control for lattice-mismatched epitaxy |
| US8227885B2 (en) * | 2006-07-05 | 2012-07-24 | Borealis Technical Limited | Selective light absorbing semiconductor surface |
| JP2008034754A (ja) * | 2006-07-31 | 2008-02-14 | Dowa Holdings Co Ltd | 発光素子 |
| DE102006043400A1 (de) * | 2006-09-15 | 2008-03-27 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| JP2010512660A (ja) * | 2006-12-11 | 2010-04-22 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 無極性および半極性の発光デバイス |
| TWI533351B (zh) | 2006-12-11 | 2016-05-11 | 美國加利福尼亞大學董事會 | 高效能非極性第三族氮化物光學裝置之金屬有機化學氣相沈積生長 |
| JP2010512664A (ja) * | 2006-12-11 | 2010-04-22 | ルーメンツ リミテッド ライアビリティ カンパニー | 酸化亜鉛多接合光電池及び光電子装置 |
| JP4433317B2 (ja) * | 2006-12-15 | 2010-03-17 | 豊田合成株式会社 | Iii族窒化物系化合物半導体結晶の製造方法 |
| US7663148B2 (en) * | 2006-12-22 | 2010-02-16 | Philips Lumileds Lighting Company, Llc | III-nitride light emitting device with reduced strain light emitting layer |
| US20080149946A1 (en) * | 2006-12-22 | 2008-06-26 | Philips Lumileds Lighting Company, Llc | Semiconductor Light Emitting Device Configured To Emit Multiple Wavelengths Of Light |
| US20080197369A1 (en) * | 2007-02-20 | 2008-08-21 | Cree, Inc. | Double flip semiconductor device and method for fabrication |
| US9484499B2 (en) * | 2007-04-20 | 2016-11-01 | Cree, Inc. | Transparent ohmic contacts on light emitting diodes with carrier substrates |
| US20090034977A1 (en) * | 2007-07-30 | 2009-02-05 | Michael Renne Ty Tan | MULTIPLEXING HIGH SPEED LIGHT EMITTING DIODES (LEDs) |
| US8044381B2 (en) * | 2007-07-30 | 2011-10-25 | Hewlett-Packard Development Company, L.P. | Light emitting diode (LED) |
| US20090114274A1 (en) * | 2007-11-02 | 2009-05-07 | Fritzemeier Leslie G | Crystalline thin-film photovoltaic structures |
| US8368100B2 (en) | 2007-11-14 | 2013-02-05 | Cree, Inc. | Semiconductor light emitting diodes having reflective structures and methods of fabricating same |
| US8652948B2 (en) * | 2007-11-21 | 2014-02-18 | Mitsubishi Chemical Corporation | Nitride semiconductor, nitride semiconductor crystal growth method, and nitride semiconductor light emitting element |
| US9431589B2 (en) | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |
| DE102008024517A1 (de) * | 2007-12-27 | 2009-07-02 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Körper und Verfahren zur Herstellung eines strahlungsemittierenden Körpers |
| WO2010033792A1 (en) * | 2008-09-18 | 2010-03-25 | Lumenz Llc | Textured semiconductor light-emitting devices |
| US8916769B2 (en) | 2008-10-01 | 2014-12-23 | International Business Machines Corporation | Tandem nanofilm interconnected semiconductor wafer solar cells |
| TWI402993B (zh) * | 2009-03-04 | 2013-07-21 | Ind Tech Res Inst | 光電轉換元件與製造方法 |
| JP2012525718A (ja) * | 2009-04-29 | 2012-10-22 | アプライド マテリアルズ インコーポレイテッド | HVPEにおいてその場プレ−GaN堆積層を形成する方法 |
| EP2256820A3 (de) * | 2009-05-25 | 2011-04-20 | Nxp B.V. | Photoelektronisches Bauelement mit einem vertikalen p-n oder p-i-n Übergang und dessen Herstellungsmethode |
| CN102473799A (zh) * | 2009-07-09 | 2012-05-23 | 加利福尼亚大学董事会 | 用于改良在非极性或半极性(Ga,Al,In,B)N衬底上生长的(Ga,Al,In,B)N激光二极管的镜面刻面劈裂产率的结构 |
| US8106421B2 (en) * | 2009-08-21 | 2012-01-31 | University Of Seoul Industry Cooperation Foundation | Photovoltaic devices |
| KR101113692B1 (ko) * | 2009-09-17 | 2012-02-27 | 한국과학기술원 | 태양전지 제조방법 및 이에 의하여 제조된 태양전지 |
| FR2954947B1 (fr) * | 2010-01-04 | 2012-01-20 | Acta Alga | Photobioreacteur en milieu ferme pour la culture de micro-organismes photosynthetiques |
| JP5680111B2 (ja) * | 2010-02-04 | 2015-03-04 | エルジー シルトロン インコーポレイテッド | 窒化ガリウム基板の製造方法 |
| US20110233521A1 (en) * | 2010-03-24 | 2011-09-29 | Cree, Inc. | Semiconductor with contoured structure |
| JP5520178B2 (ja) * | 2010-09-24 | 2014-06-11 | 日本電信電話株式会社 | 発光ダイオード |
| EP2622330B1 (de) | 2010-10-01 | 2014-12-17 | Attolight SA | Dekonvolution von zeitgesteuerten kathodenlumineszenzbildern |
| DE102011012925A1 (de) * | 2011-03-03 | 2012-09-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
| RU2504867C2 (ru) * | 2012-01-10 | 2014-01-20 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования Томский государственный университет систем управления и радиоэлектроники | Способ изготовления светодиода |
| CN110246941A (zh) * | 2012-03-19 | 2019-09-17 | 亮锐控股有限公司 | 在硅衬底上生长的发光器件 |
| US8940580B2 (en) | 2012-06-28 | 2015-01-27 | International Business Machines Corporation | Textured multi-junction solar cell and fabrication method |
| US9105775B2 (en) | 2012-06-28 | 2015-08-11 | International Business Machines Corporation | Textured multi-junction solar cell and fabrication method |
| US9112103B1 (en) | 2013-03-11 | 2015-08-18 | Rayvio Corporation | Backside transparent substrate roughening for UV light emitting diode |
| US9112101B2 (en) | 2013-04-25 | 2015-08-18 | Epistar Corporation | Light-emitting device manufacturing method |
| CN104241262B (zh) | 2013-06-14 | 2020-11-06 | 惠州科锐半导体照明有限公司 | 发光装置以及显示装置 |
| KR102177214B1 (ko) * | 2014-03-17 | 2020-11-11 | 삼성디스플레이 주식회사 | 플렉서블 디스플레이 장치 및 그 제조방법 |
| USD826871S1 (en) | 2014-12-11 | 2018-08-28 | Cree, Inc. | Light emitting diode device |
| JP6605213B2 (ja) * | 2015-03-23 | 2019-11-13 | スタンレー電気株式会社 | 半導体発光素子 |
| KR102357585B1 (ko) | 2015-08-18 | 2022-02-04 | 삼성전자주식회사 | 반도체 자외선 발광소자 |
| EP3147954A1 (de) * | 2015-09-22 | 2017-03-29 | Nokia Technologies Oy | Fotodetektor mit leitfähigem kanal aus einem zweidimensionalen material und dessen herstellungsverfahren |
| KR102591364B1 (ko) * | 2015-09-23 | 2023-10-19 | 삼성디스플레이 주식회사 | 광 센서 및 이를 포함하는 표시 장치 |
| ITUB20155862A1 (it) | 2015-11-24 | 2017-05-24 | St Microelectronics Srl | Transistore di tipo normalmente spento con ridotta resistenza in stato acceso e relativo metodo di fabbricazione |
| DE102016101442B4 (de) * | 2016-01-27 | 2025-03-13 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Konversionselement und strahlungsemittierendes Halbleiterbauelement mit einem solchen Konversionselement |
| US10833222B2 (en) | 2016-08-26 | 2020-11-10 | The Penn State Research Foundation | High light extraction efficiency (LEE) light emitting diode (LED) |
| CN107204565A (zh) * | 2017-05-03 | 2017-09-26 | 浙江大学 | GeSe二维层状半导体及构成的饱和吸收体器件和用途 |
| US10163974B2 (en) * | 2017-05-17 | 2018-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of forming absorption enhancement structure for image sensor |
| US10892159B2 (en) | 2017-11-20 | 2021-01-12 | Saphlux, Inc. | Semipolar or nonpolar group III-nitride substrates |
| US11177402B2 (en) * | 2018-09-18 | 2021-11-16 | Alliance For Sustainable Energy, Llc | Light scattering structures for thin-film solar cells and methods of making the same |
| CN111446338B (zh) | 2019-01-17 | 2022-04-29 | 隆达电子股份有限公司 | 发光二极管 |
| CN110295395B (zh) * | 2019-07-16 | 2021-04-16 | 中国科学院上海硅酸盐研究所 | 一种添加氧化石墨烯量子点的单晶硅制绒添加剂及其应用 |
| JP7406632B2 (ja) * | 2020-06-24 | 2023-12-27 | 日機装株式会社 | 窒化物半導体紫外線発光素子 |
| CN112614918A (zh) * | 2020-12-01 | 2021-04-06 | 木昇半导体科技(苏州)有限公司 | 一种高内量子率的外延材料生长方法 |
| CN114080692A (zh) * | 2021-04-02 | 2022-02-22 | 英诺赛科(苏州)科技有限公司 | 三族氮基半导体晶圆 |
| US20240222938A1 (en) * | 2021-05-05 | 2024-07-04 | Nilt Switzerland Gmbh | Manufacturing of surface emitting lasers including an integrated metastructure |
Family Cites Families (62)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4147564A (en) * | 1977-11-18 | 1979-04-03 | Sri International | Method of controlled surface texturization of crystalline semiconductor material |
| CA1139412A (en) | 1980-09-10 | 1983-01-11 | Northern Telecom Limited | Light emitting diodes with high external quantum efficiency |
| JPS60173829A (ja) | 1984-02-14 | 1985-09-07 | Nippon Telegr & Teleph Corp <Ntt> | 化合物半導体薄膜の成長方法 |
| JPS61108176A (ja) * | 1984-11-01 | 1986-05-26 | Fuji Electric Co Ltd | 粗面化方法 |
| JPH02237110A (ja) * | 1989-03-10 | 1990-09-19 | Mitsubishi Electric Corp | 量子細線の製造方法 |
| JP2953468B2 (ja) | 1989-06-21 | 1999-09-27 | 三菱化学株式会社 | 化合物半導体装置及びその表面処理加工方法 |
| US5248621A (en) * | 1990-10-23 | 1993-09-28 | Canon Kabushiki Kaisha | Method for producing solar cell devices of crystalline material |
| US5309001A (en) | 1991-11-25 | 1994-05-03 | Sharp Kabushiki Kaisha | Light-emitting diode having a surface electrode of a tree-like form |
| JP2695585B2 (ja) * | 1992-12-28 | 1997-12-24 | キヤノン株式会社 | 光起電力素子及びその製造方法、並びにそれを用いた発電装置 |
| JP3792281B2 (ja) * | 1995-01-09 | 2006-07-05 | 株式会社半導体エネルギー研究所 | 太陽電池 |
| US5814839A (en) * | 1995-02-16 | 1998-09-29 | Sharp Kabushiki Kaisha | Semiconductor light-emitting device having a current adjusting layer and a uneven shape light emitting region, and method for producing same |
| US5986204A (en) * | 1996-03-21 | 1999-11-16 | Canon Kabushiki Kaisha | Photovoltaic cell |
| US5779924A (en) | 1996-03-22 | 1998-07-14 | Hewlett-Packard Company | Ordered interface texturing for a light emitting device |
| JP3448450B2 (ja) * | 1996-04-26 | 2003-09-22 | 三洋電機株式会社 | 発光素子およびその製造方法 |
| US5684309A (en) * | 1996-07-11 | 1997-11-04 | North Carolina State University | Stacked quantum well aluminum indium gallium nitride light emitting diodes |
| US6103604A (en) * | 1997-02-10 | 2000-08-15 | Trw Inc. | High electron mobility transparent conductor |
| CA2258080C (en) * | 1997-04-11 | 2007-06-05 | Nichia Chemical Industries, Ltd. | Nitride semiconductor growth method, nitride semiconductor substrate, and nitride semiconductor device |
| JPH10335684A (ja) * | 1997-05-30 | 1998-12-18 | Canon Inc | 光電気変換体の製造方法 |
| US6091083A (en) * | 1997-06-02 | 2000-07-18 | Sharp Kabushiki Kaisha | Gallium nitride type compound semiconductor light-emitting device having buffer layer with non-flat surface |
| US6229160B1 (en) | 1997-06-03 | 2001-05-08 | Lumileds Lighting, U.S., Llc | Light extraction from a semiconductor light-emitting device via chip shaping |
| JP3955367B2 (ja) | 1997-09-30 | 2007-08-08 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | 光半導体素子およびその製造方法 |
| JPH11135838A (ja) | 1997-10-20 | 1999-05-21 | Ind Technol Res Inst | 白色発光ダイオード及びその製造方法 |
| US6091085A (en) | 1998-02-19 | 2000-07-18 | Agilent Technologies, Inc. | GaN LEDs with improved output coupling efficiency |
| US6294440B1 (en) | 1998-04-10 | 2001-09-25 | Sharp Kabushiki Kaisha | Semiconductor substrate, light-emitting device, and method for producing the same |
| JP3788104B2 (ja) * | 1998-05-28 | 2006-06-21 | 住友電気工業株式会社 | 窒化ガリウム単結晶基板及びその製造方法 |
| US6218280B1 (en) | 1998-06-18 | 2001-04-17 | University Of Florida | Method and apparatus for producing group-III nitrides |
| US20010020703A1 (en) | 1998-07-24 | 2001-09-13 | Nathan F. Gardner | Algainp light emitting devices with thin active layers |
| US6504180B1 (en) | 1998-07-28 | 2003-01-07 | Imec Vzw And Vrije Universiteit | Method of manufacturing surface textured high-efficiency radiating devices and devices obtained therefrom |
| US6291839B1 (en) | 1998-09-11 | 2001-09-18 | Lulileds Lighting, U.S. Llc | Light emitting device having a finely-patterned reflective contact |
| US6285698B1 (en) * | 1998-09-25 | 2001-09-04 | Xerox Corporation | MOCVD growth of InGaN quantum well laser structures on a grooved lower waveguiding layer |
| US6252261B1 (en) | 1998-09-30 | 2001-06-26 | Nec Corporation | GaN crystal film, a group III element nitride semiconductor wafer and a manufacturing process therefor |
| JP3469484B2 (ja) | 1998-12-24 | 2003-11-25 | 株式会社東芝 | 半導体発光素子およびその製造方法 |
| JP3619053B2 (ja) * | 1999-05-21 | 2005-02-09 | キヤノン株式会社 | 光電変換装置の製造方法 |
| TW437104B (en) | 1999-05-25 | 2001-05-28 | Wang Tien Yang | Semiconductor light-emitting device and method for manufacturing the same |
| US6133589A (en) | 1999-06-08 | 2000-10-17 | Lumileds Lighting, U.S., Llc | AlGaInN-based LED having thick epitaxial layer for improved light extraction |
| US6376864B1 (en) | 1999-07-06 | 2002-04-23 | Tien Yang Wang | Semiconductor light-emitting device and method for manufacturing the same |
| JP4145437B2 (ja) * | 1999-09-28 | 2008-09-03 | 住友電気工業株式会社 | 単結晶GaNの結晶成長方法及び単結晶GaN基板の製造方法と単結晶GaN基板 |
| US6531719B2 (en) * | 1999-09-29 | 2003-03-11 | Toyoda Gosei Co., Ltd. | Group III nitride compound semiconductor device |
| JP4197814B2 (ja) | 1999-11-12 | 2008-12-17 | シャープ株式会社 | Led駆動方法およびled装置と表示装置 |
| US6486499B1 (en) | 1999-12-22 | 2002-11-26 | Lumileds Lighting U.S., Llc | III-nitride light-emitting device with increased light generating capability |
| US6328456B1 (en) | 2000-03-24 | 2001-12-11 | Ledcorp | Illuminating apparatus and light emitting diode |
| US20020123163A1 (en) | 2000-04-24 | 2002-09-05 | Takehiro Fujii | Edge-emitting light-emitting semiconductor device and method of manufacture thereof |
| JP2001339102A (ja) * | 2000-05-29 | 2001-12-07 | Toyota Central Res & Dev Lab Inc | 窒化物系化合物半導体発光素子 |
| US6661028B2 (en) | 2000-08-01 | 2003-12-09 | United Epitaxy Company, Ltd. | Interface texturing for light-emitting device |
| WO2002039555A1 (en) * | 2000-11-10 | 2002-05-16 | Sharp Kabushiki Kaisha | Nitride semiconductor luminous element and optical device including it |
| US6649287B2 (en) * | 2000-12-14 | 2003-11-18 | Nitronex Corporation | Gallium nitride materials and methods |
| JP4595198B2 (ja) * | 2000-12-15 | 2010-12-08 | ソニー株式会社 | 半導体発光素子及び半導体発光素子の製造方法 |
| CA2437124A1 (en) | 2001-02-09 | 2002-08-22 | Midwest Research Institute | Isoelectronic co-doping |
| US6686676B2 (en) | 2001-04-30 | 2004-02-03 | General Electric Company | UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same |
| JP2002368263A (ja) | 2001-06-06 | 2002-12-20 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子 |
| JP3763754B2 (ja) | 2001-06-07 | 2006-04-05 | 豊田合成株式会社 | Iii族窒化物系化合物半導体発光素子 |
| TW544956B (en) * | 2001-06-13 | 2003-08-01 | Matsushita Electric Industrial Co Ltd | Nitride semiconductor, production method therefor and nitride semiconductor element |
| JP4055503B2 (ja) * | 2001-07-24 | 2008-03-05 | 日亜化学工業株式会社 | 半導体発光素子 |
| TW516248B (en) | 2001-12-21 | 2003-01-01 | Epitech Technology Corp | Nitride light emitting diode with spiral-shaped metal electrode |
| JP4307113B2 (ja) | 2002-03-19 | 2009-08-05 | 宣彦 澤木 | 半導体発光素子およびその製造方法 |
| JP2003332620A (ja) * | 2002-05-08 | 2003-11-21 | Mitsubishi Cable Ind Ltd | 発光装置、GaN系半導体発光素子、およびそれらを用いた照明装置 |
| DE10245628A1 (de) * | 2002-09-30 | 2004-04-15 | Osram Opto Semiconductors Gmbh | Elektromagnetische Strahlung emittierender Halbleiterchip und Verfahren zu dessen Herstellung |
| US7071494B2 (en) * | 2002-12-11 | 2006-07-04 | Lumileds Lighting U.S. Llc | Light emitting device with enhanced optical scattering |
| WO2004068182A2 (en) | 2003-01-24 | 2004-08-12 | Digital Optics International Corporation | High density illumination system |
| US7704763B2 (en) | 2003-12-09 | 2010-04-27 | The Regents Of The University Of California | Highly efficient group-III nitride based light emitting diodes via fabrication of structures on an N-face surface |
| US8227820B2 (en) | 2005-02-09 | 2012-07-24 | The Regents Of The University Of California | Semiconductor light-emitting device |
| US7223998B2 (en) | 2004-09-10 | 2007-05-29 | The Regents Of The University Of California | White, single or multi-color light emitting diodes by recycling guided modes |
-
2005
- 2005-04-15 EP EP05744389A patent/EP1735838B1/de not_active Expired - Lifetime
- 2005-04-15 JP JP2007508566A patent/JP2007533164A/ja active Pending
- 2005-04-15 CA CA002563418A patent/CA2563418A1/en not_active Abandoned
- 2005-04-15 WO PCT/US2005/012849 patent/WO2005104236A2/en not_active Ceased
- 2005-04-15 US US11/107,150 patent/US7777241B2/en not_active Expired - Fee Related
- 2005-04-15 AT AT05744389T patent/ATE527571T1/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1735838A2 (de) | 2006-12-27 |
| WO2005104236A3 (en) | 2006-12-07 |
| EP1735838A4 (de) | 2007-11-07 |
| US20050242364A1 (en) | 2005-11-03 |
| CA2563418A1 (en) | 2005-11-03 |
| EP1735838B1 (de) | 2011-10-05 |
| US7777241B2 (en) | 2010-08-17 |
| JP2007533164A (ja) | 2007-11-15 |
| WO2005104236A2 (en) | 2005-11-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE527571T1 (de) | Optische bauelemente mit texturierten halbleiterschichten | |
| CN103022290B (zh) | 具有四元InAlGaN的LED外延结构及其制备方法 | |
| TWI528570B (zh) | 紋理化光電子裝置及其相關製造方法 | |
| TW200627675A (en) | Growth of Ⅲ-nitride light-emitting devices on textured substrates | |
| TW200620708A (en) | Semiconductor light-emitting device, lighting module, lighting device and method for manufacturing semiconductor light-emitting device | |
| JP2006100787A5 (de) | ||
| WO2007044322A3 (en) | Conductive layer for biaxially oriented semiconductor film growth | |
| JP2008182226A5 (de) | ||
| EP1258928A4 (de) | Leuchtdiode und halbleiterlaser | |
| TW200742126A (en) | Semiconductor light emitting device and its manufacturing method | |
| WO2008123213A1 (ja) | 半導体装置及び半導体製造方法 | |
| WO2008081717A1 (ja) | Iii族窒化物半導体層の製造方法、及びiii族窒化物半導体発光素子、並びにランプ | |
| TW200633277A (en) | Method for producing a nanostructured pn junction light-emitting diode and diode obtained by such a method | |
| TW200705706A (en) | Light emitting diode structure | |
| TW200703716A (en) | Nitride semiconductor element and its fabrication process | |
| TW200605413A (en) | Group Ⅲ nitride semiconductor light emitting device | |
| WO2007053624A3 (en) | Optical devices featuring textured semiconductor layers | |
| TW200802910A (en) | Semiconductor device and method of manufacturing semiconductor device | |
| CN103187495B (zh) | 发光二极管芯片及其制造方法 | |
| Yin et al. | Enhanced light extraction in n-GaN-based light-emitting diodes with three-dimensional semi-spherical structure | |
| TW200623960A (en) | Device for integrating organic transistor with organic light emitting diode via heterogeneous interface | |
| JP2011523219A5 (de) | ||
| CN100502071C (zh) | 基于平面结构的ⅲ族氮化物半导体发光二极管及其制备方法 | |
| TW200711180A (en) | Light emitting diode and light emitting diode lamp | |
| CN102280534A (zh) | 预处理蓝宝石衬底提高led出光效率的方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |