ATE532099T1 - Verfahren und vorrichtung zur übertragung eines musters von einem stempel auf ein substrat - Google Patents
Verfahren und vorrichtung zur übertragung eines musters von einem stempel auf ein substratInfo
- Publication number
- ATE532099T1 ATE532099T1 AT03727761T AT03727761T ATE532099T1 AT E532099 T1 ATE532099 T1 AT E532099T1 AT 03727761 T AT03727761 T AT 03727761T AT 03727761 T AT03727761 T AT 03727761T AT E532099 T1 ATE532099 T1 AT E532099T1
- Authority
- AT
- Austria
- Prior art keywords
- pattern
- receiving surface
- stamp
- transferring
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C17/00—Hand tools or apparatus using hand held tools, for applying liquids or other fluent materials to, for spreading applied liquids or other fluent materials on, or for partially removing applied liquids or other fluent materials from, surfaces
- B05C17/06—Stencils
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/02—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
- B05C1/027—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles only at particular parts of the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Printing Methods (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Decoration By Transfer Pictures (AREA)
- Manufacturing Optical Record Carriers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP02077087 | 2002-05-27 | ||
| EP02077079 | 2002-05-27 | ||
| PCT/IB2003/002003 WO2003099463A2 (en) | 2002-05-27 | 2003-05-26 | Method and device for transferring a pattern from a stamp to a substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE532099T1 true ATE532099T1 (de) | 2011-11-15 |
Family
ID=29585707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT03727761T ATE532099T1 (de) | 2002-05-27 | 2003-05-26 | Verfahren und vorrichtung zur übertragung eines musters von einem stempel auf ein substrat |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7296519B2 (de) |
| EP (1) | EP1511632B1 (de) |
| JP (1) | JP4639081B2 (de) |
| KR (1) | KR100981692B1 (de) |
| CN (1) | CN100358728C (de) |
| AT (1) | ATE532099T1 (de) |
| AU (1) | AU2003232962A1 (de) |
| WO (1) | WO2003099463A2 (de) |
Families Citing this family (80)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4340086B2 (ja) * | 2003-03-20 | 2009-10-07 | 株式会社日立製作所 | ナノプリント用スタンパ、及び微細構造転写方法 |
| DE10330456B9 (de) * | 2003-07-05 | 2007-11-08 | Erich Thallner | Vorrichtung zum Erstellen einer Oberflächenstruktur auf einem Wafer |
| US7632087B2 (en) * | 2003-12-19 | 2009-12-15 | Wd Media, Inc. | Composite stamper for imprint lithography |
| US6981445B2 (en) * | 2003-12-24 | 2006-01-03 | Axela Biosensors Inc. | Method and apparatus for micro-contact printing |
| US7195733B2 (en) * | 2004-04-27 | 2007-03-27 | The Board Of Trustees Of The University Of Illinois | Composite patterning devices for soft lithography |
| WO2005109535A2 (en) * | 2004-05-06 | 2005-11-17 | Koninklijke Philips Electronics N.V. | A method of manufacturing a thermoelectric device |
| EP1763704A2 (de) * | 2004-06-30 | 2007-03-21 | Koninklijke Philips Electronics N.V. | Weicher lithographischer stempel mit einer chemisch strukturierten oberfläche |
| US20070164476A1 (en) * | 2004-09-01 | 2007-07-19 | Wei Wu | Contact lithography apparatus and method employing substrate deformation |
| WO2006043244A1 (en) | 2004-10-22 | 2006-04-27 | Koninklijke Philips Electronics N.V. | Roller micro-contact printer with pressure control |
| WO2006061741A2 (en) | 2004-12-06 | 2006-06-15 | Koninklijke Philips Electronics N.V. | Etchant solutions and additives therefor |
| EP1669196B1 (de) * | 2004-12-10 | 2008-05-21 | ESSILOR INTERNATIONAL (Compagnie Générale d'Optique) | Stempel zum Auftragen eines Motivs, Verfahren zur Stempelherstellung und Verfahren zur Herstellung eines Objekts anhand von diesem Stempel |
| US7331283B2 (en) | 2004-12-16 | 2008-02-19 | Asml Holding N.V. | Method and apparatus for imprint pattern replication |
| US7363854B2 (en) | 2004-12-16 | 2008-04-29 | Asml Holding N.V. | System and method for patterning both sides of a substrate utilizing imprint lithography |
| US7409759B2 (en) | 2004-12-16 | 2008-08-12 | Asml Holding N.V. | Method for making a computer hard drive platen using a nano-plate |
| US7410591B2 (en) | 2004-12-16 | 2008-08-12 | Asml Holding N.V. | Method and system for making a nano-plate for imprint lithography |
| US7399422B2 (en) | 2005-11-29 | 2008-07-15 | Asml Holding N.V. | System and method for forming nanodisks used in imprint lithography and nanodisk and memory disk formed thereby |
| US7676088B2 (en) | 2004-12-23 | 2010-03-09 | Asml Netherlands B.V. | Imprint lithography |
| WO2006083518A2 (en) * | 2005-01-31 | 2006-08-10 | Molecular Imprints, Inc. | Chucking system for nano-manufacturing |
| US7636999B2 (en) * | 2005-01-31 | 2009-12-29 | Molecular Imprints, Inc. | Method of retaining a substrate to a wafer chuck |
| JP5180820B2 (ja) | 2005-05-03 | 2013-04-10 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | スタンプから基板にパターンを転写する方法及び装置 |
| JP4596981B2 (ja) * | 2005-05-24 | 2010-12-15 | 株式会社日立ハイテクノロジーズ | インプリント装置、及び微細構造転写方法 |
| US20080202360A1 (en) * | 2005-06-13 | 2008-08-28 | Korea Institute Of Machinery & Materials | Imprinting Apparatus For Forming Pattern at Uniform Contact by Additional Constant Pressure |
| US20070178237A1 (en) * | 2005-08-02 | 2007-08-02 | Shin Dong M | Method for patterning coatings |
| US20070035717A1 (en) * | 2005-08-12 | 2007-02-15 | Wei Wu | Contact lithography apparatus, system and method |
| TWI345804B (en) * | 2005-08-17 | 2011-07-21 | Lg Chemical Ltd | Patterning method using coatings containing ionic components |
| EP1764648B1 (de) | 2005-09-14 | 2012-05-23 | Thallner, Erich, Dipl.-Ing. | Stempel mit einer Nanostempelstruktur sowie Vorrichtung und Verfahren zu dessen Herstellung |
| US7677877B2 (en) | 2005-11-04 | 2010-03-16 | Asml Netherlands B.V. | Imprint lithography |
| JP2007134368A (ja) * | 2005-11-08 | 2007-05-31 | Nikon Corp | パターン転写装置、露光装置及びパターン転写方法 |
| US7906058B2 (en) * | 2005-12-01 | 2011-03-15 | Molecular Imprints, Inc. | Bifurcated contact printing technique |
| MY144847A (en) | 2005-12-08 | 2011-11-30 | Molecular Imprints Inc | Method and system for double-sided patterning of substrates |
| US7707937B2 (en) * | 2005-12-15 | 2010-05-04 | Palo Alto Research Center Incorporated | Digital impression printing system |
| US7517211B2 (en) | 2005-12-21 | 2009-04-14 | Asml Netherlands B.V. | Imprint lithography |
| JP4814682B2 (ja) * | 2006-04-18 | 2011-11-16 | 株式会社日立ハイテクノロジーズ | 微細構造パターンの転写方法及び転写装置 |
| JP4854383B2 (ja) * | 2006-05-15 | 2012-01-18 | アピックヤマダ株式会社 | インプリント方法およびナノ・インプリント装置 |
| JP4996150B2 (ja) * | 2006-07-07 | 2012-08-08 | 株式会社日立ハイテクノロジーズ | 微細構造転写装置および微細構造転写方法 |
| JP4449949B2 (ja) * | 2006-07-18 | 2010-04-14 | セイコーエプソン株式会社 | 表面エネルギー差バンクの形成方法、パターンの形成方法、バンク構造、電子回路、電子デバイス、電子機器、及びスタンプ |
| US7946837B2 (en) | 2006-10-06 | 2011-05-24 | Asml Netherlands B.V. | Imprint lithography |
| WO2008068701A2 (en) * | 2006-12-04 | 2008-06-12 | Koninklijke Philips Electronics N.V. | Method and apparatus for applying a sheet to a substrate |
| CN101583436B (zh) * | 2007-01-16 | 2014-05-07 | 皇家飞利浦电子股份有限公司 | 用于挠性板件和基板接触的方法和系统 |
| GB0701909D0 (en) * | 2007-01-31 | 2007-03-14 | Imp Innovations Ltd | Deposition Of Organic Layers |
| CA2682928A1 (en) | 2007-04-19 | 2008-10-30 | Basf Se | Method for forming a pattern on a substrate and electronic device formed thereby |
| US20080309900A1 (en) * | 2007-06-12 | 2008-12-18 | Micron Technology, Inc. | Method of making patterning device, patterning device for making patterned structure, and method of making patterned structure |
| JP5041214B2 (ja) * | 2007-06-15 | 2012-10-03 | ソニー株式会社 | 金属薄膜の形成方法および電子デバイスの製造方法 |
| JP5045263B2 (ja) * | 2007-06-20 | 2012-10-10 | ソニー株式会社 | 印刷装置および印刷方法 |
| NL1036034A1 (nl) | 2007-10-11 | 2009-04-15 | Asml Netherlands Bv | Imprint lithography. |
| GB2453766A (en) * | 2007-10-18 | 2009-04-22 | Novalia Ltd | Method of fabricating an electronic device |
| CN103365077B (zh) | 2008-06-06 | 2016-06-08 | 皇家飞利浦电子股份有限公司 | 用于软光刻的硅酮橡胶材料 |
| US7927976B2 (en) * | 2008-07-23 | 2011-04-19 | Semprius, Inc. | Reinforced composite stamp for dry transfer printing of semiconductor elements |
| US8462325B2 (en) | 2008-10-10 | 2013-06-11 | Koninklijke Philips Electronics N.V. | Light directionality sensor |
| JP5261845B2 (ja) * | 2008-10-28 | 2013-08-14 | 株式会社ブイ・テクノロジー | 欠陥修正方法 |
| US8506867B2 (en) * | 2008-11-19 | 2013-08-13 | Semprius, Inc. | Printing semiconductor elements by shear-assisted elastomeric stamp transfer |
| JP2011005773A (ja) * | 2009-06-26 | 2011-01-13 | Fuji Electric Device Technology Co Ltd | インプリント用スタンパおよびインプリント装置 |
| US8261660B2 (en) * | 2009-07-22 | 2012-09-11 | Semprius, Inc. | Vacuum coupled tool apparatus for dry transfer printing semiconductor elements |
| JP5843784B2 (ja) | 2009-12-22 | 2016-01-13 | スリーエム イノベイティブ プロパティズ カンパニー | 加圧ローラーを使用するマイクロコンタクトプリンティングのための装置及び方法 |
| CN101807004B (zh) * | 2010-03-08 | 2012-07-11 | 彩虹集团电子股份有限公司 | 一种用于彩色显像管网版生产的工作版的制做方法 |
| JP5618588B2 (ja) * | 2010-03-24 | 2014-11-05 | キヤノン株式会社 | インプリント方法 |
| US9765934B2 (en) | 2011-05-16 | 2017-09-19 | The Board Of Trustees Of The University Of Illinois | Thermally managed LED arrays assembled by printing |
| DE102011054789A1 (de) * | 2011-10-25 | 2013-04-25 | Universität Kassel | Nano-Formgebungsstruktur |
| JP6086675B2 (ja) * | 2011-11-30 | 2017-03-01 | 株式会社Screenホールディングス | 印刷装置および印刷方法 |
| JP5759348B2 (ja) * | 2011-11-30 | 2015-08-05 | 株式会社Screenホールディングス | パターン形成装置およびパターン形成方法 |
| JP5925505B2 (ja) * | 2012-02-03 | 2016-05-25 | セーレン株式会社 | 微細ドットパターンの印刷方法 |
| CN103373094A (zh) * | 2012-04-11 | 2013-10-30 | 得利环球有限公司 | 微接触印刷设备及方法 |
| CN102866582B (zh) * | 2012-09-29 | 2014-09-10 | 兰红波 | 一种用于高亮度led图形化的纳米压印装置和方法 |
| JP6207997B2 (ja) * | 2013-01-30 | 2017-10-04 | 株式会社Screenホールディングス | パターン形成装置およびパターン形成方法 |
| US10088747B2 (en) * | 2014-03-31 | 2018-10-02 | Koninklijke Philips N.V. | Imprinting method, computer program product and apparatus for the same |
| RU2701780C2 (ru) * | 2014-09-22 | 2019-10-01 | Конинклейке Филипс Н.В. | Способ переноса, а также устройство и компьютерный программный продукт для его осуществления |
| EP3215895B1 (de) * | 2014-11-03 | 2022-02-23 | Universität Osnabrück | Verfahren zur durchführung eines kapillar-nanodrucks, feld von tintentropfen und feld von drähten erhältlich nach dem verfahren |
| KR102331438B1 (ko) | 2016-04-06 | 2021-11-26 | 코닌클리케 필립스 엔.브이. | 임프린트 리소그래피 스탬프, 이의 제조 방법 및 사용 방법 |
| CN116736631A (zh) | 2016-07-14 | 2023-09-12 | 莫福托尼克斯控股有限公司 | 用于使用柔性压模压印不连续基板的设备 |
| US11338477B2 (en) * | 2016-07-27 | 2022-05-24 | Koninklijke Philips N.V. | Polyorganosiloxane-based stamp manufacturing method, polyorganosiloxane-based stamp, use of the same for a printing process, and an imprinting method using the same |
| CN107215111B (zh) * | 2017-06-14 | 2023-03-28 | 浙江大学 | 一种磁控转印印章及磁控转移印刷方法 |
| WO2020099265A1 (en) | 2018-11-14 | 2020-05-22 | Koninklijke Philips N.V. | Pneumatic system, imprint apparatus and use thereof |
| US20220223451A1 (en) * | 2019-05-22 | 2022-07-14 | Vuereal Inc. | Systems and methods for transferring devices or patterns to a substrate |
| CN111430272B (zh) * | 2020-03-09 | 2023-02-03 | 广东工业大学 | 单类和多类微小物体悬浮定向移动及自主装巨量转移方法 |
| EP4123376A1 (de) * | 2021-07-21 | 2023-01-25 | Koninklijke Philips N.V. | Prägevorrichtung |
| US20240329520A1 (en) | 2021-07-21 | 2024-10-03 | Koninklijke Philips N.V. | Imprinting apparatus |
| US12259660B2 (en) * | 2021-10-26 | 2025-03-25 | Industrial Technology Research Institute | Inspection method and inspection platform for lithography |
| EP4390539A1 (de) | 2022-12-19 | 2024-06-26 | Koninklijke Philips N.V. | Ausrichtungsverfahren für imprintverfahren |
| EP4390540A1 (de) | 2022-12-19 | 2024-06-26 | Koninklijke Philips N.V. | Ausrichtungsverfahren |
| US20240427236A1 (en) * | 2023-06-26 | 2024-12-26 | Google Llc | Process control pattern to improve nanoimprint detaching process |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE94221C (de) * | ||||
| US1527921A (en) | 1923-05-22 | 1925-02-24 | Auto Mark Corp | Printing device |
| DE1103357B (de) * | 1955-01-24 | 1961-03-30 | Konrad Elsaesser | Vorrichtung zum Bedrucken oder Bestempeln von Markenetiketten |
| GB1005502A (en) * | 1963-04-17 | 1965-09-22 | Ellicock & Healy Ltd | Improvements in or relating to printing blocks for printing machines |
| US5352651A (en) * | 1992-12-23 | 1994-10-04 | Minnesota Mining And Manufacturing Company | Nanostructured imaging transfer element |
| US5900160A (en) * | 1993-10-04 | 1999-05-04 | President And Fellows Of Harvard College | Methods of etching articles via microcontact printing |
| WO1997006013A1 (en) * | 1995-08-04 | 1997-02-20 | International Business Machines Corporation | Lithographic surface or thin layer modification |
| EP0784542B1 (de) * | 1995-08-04 | 2001-11-28 | International Business Machines Corporation | Stempel für lithographie-verfahren |
| JPH09263028A (ja) * | 1996-01-25 | 1997-10-07 | Hiroyuki Koike | 回転式印字器及び回転式印字器に用いる帯状体の製造方法 |
| US5669303A (en) * | 1996-03-04 | 1997-09-23 | Motorola | Apparatus and method for stamping a surface |
| US6129016A (en) * | 1998-04-03 | 2000-10-10 | Rehkemper; Steven | Stamping toy having indexing means |
| US20020043170A1 (en) * | 2000-01-10 | 2002-04-18 | Rafael Bronstein | System and method for preparing and utilizing a printing member having magnetic particles therein |
| DE60118843T2 (de) * | 2000-02-07 | 2006-11-30 | Koninklijke Philips Electronics N.V. | Stempel für ein lithographisches verfahren, methode zur stempelherstellung und methode zur herstellung einer gemusterten schicht auf einem substrat |
| JP2002273996A (ja) * | 2001-03-21 | 2002-09-25 | Yamahachi Chemical Co Ltd | 複数の印面を有する液浸透式スタンプ |
| AU2003217184A1 (en) * | 2002-01-11 | 2003-09-02 | Massachusetts Institute Of Technology | Microcontact printing |
| US7037458B2 (en) * | 2003-10-23 | 2006-05-02 | Intel Corporation | Progressive stamping apparatus and method |
| KR100585951B1 (ko) * | 2004-02-18 | 2006-06-01 | 한국기계연구원 | 조합/분리형 독립구동이 가능한 복수 개의 모듈을 갖는 임프린팅 장치 |
-
2003
- 2003-05-26 WO PCT/IB2003/002003 patent/WO2003099463A2/en not_active Ceased
- 2003-05-26 KR KR1020047019102A patent/KR100981692B1/ko not_active Expired - Lifetime
- 2003-05-26 EP EP03727761A patent/EP1511632B1/de not_active Expired - Lifetime
- 2003-05-26 JP JP2004506978A patent/JP4639081B2/ja not_active Expired - Lifetime
- 2003-05-26 US US10/515,687 patent/US7296519B2/en not_active Expired - Lifetime
- 2003-05-26 AT AT03727761T patent/ATE532099T1/de active
- 2003-05-26 AU AU2003232962A patent/AU2003232962A1/en not_active Abandoned
- 2003-05-26 CN CNB038123967A patent/CN100358728C/zh not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR100981692B1 (ko) | 2010-09-13 |
| WO2003099463A3 (en) | 2004-09-16 |
| US20050173049A1 (en) | 2005-08-11 |
| JP4639081B2 (ja) | 2011-02-23 |
| EP1511632B1 (de) | 2011-11-02 |
| AU2003232962A1 (en) | 2003-12-12 |
| JP2005527406A (ja) | 2005-09-15 |
| CN1665684A (zh) | 2005-09-07 |
| CN100358728C (zh) | 2008-01-02 |
| EP1511632A2 (de) | 2005-03-09 |
| WO2003099463A2 (en) | 2003-12-04 |
| KR20050016441A (ko) | 2005-02-21 |
| US7296519B2 (en) | 2007-11-20 |
| AU2003232962A8 (en) | 2003-12-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE532099T1 (de) | Verfahren und vorrichtung zur übertragung eines musters von einem stempel auf ein substrat | |
| DE69007733D1 (de) | Vorrichtung und verfahren zur behandlung eines flachen, scheibenförmigen substrates unter niedrigem druck. | |
| ATE549294T1 (de) | Vorrichtung und verfahren zum transfer von mustern mit zwischenstempel | |
| EP1357590A3 (de) | Verfahren und Vorrichtung zur Herstellung von Halbleiterbauelementen | |
| DE60211951D1 (de) | Vorrichtung und verfahren zur herstellung eines produkts durch freiformen | |
| DE60122578D1 (de) | Verfahren und vorrichtung zur auswahl von tientenstrahldruck parametern | |
| DE60033084D1 (de) | Vorrichtung und Verfahren zur Beschichtung einer Metallschicht auf die Oberfläche einer Keimschicht eines Halbleiterwafers | |
| WO2003096123A8 (en) | Reversal imprint technique | |
| TW200520112A (en) | Method for production of a film | |
| DE60018598D1 (de) | Verfahren und vorrichtung zur beschichtung eines substrates | |
| DE68926361D1 (de) | Verfahren und Vorrichtung zur Aufbringung einer dünnen Schicht auf ein Substrat unter Druck | |
| TW200628236A (en) | Apparatus and method for processing a substrate | |
| DE69032227D1 (de) | Verfahren und vorrichtung zur herstellung eines bedruckten und geprägten bodenbelags | |
| TW200505617A (en) | Method and apparatus for removing an edge region of a layer applied to a substrate and for coating a substrate and a substrate | |
| EP1726991A3 (de) | Mikrokontaktdruckmodul | |
| DE19983807T1 (de) | Verfahren und Vorrichtung zur Oberflächemmarkierung eines Substrats | |
| DE69612452D1 (de) | Verfahren und Vorrichtung zum Entfernen von Beschichtungen aus der Oberfläche einer Glasplatte | |
| DE59913661D1 (de) | Vorrichtung und Verfahren zum Beschichten eines ebenen Substrates | |
| GR1004059B (el) | Κατασκευη βιοπολυμερικων σχηματων μεσω εναποθεσης με λειζερ. | |
| ATE243621T1 (de) | Verfahren und vorrichtung zum aufbringen eines mediums auf ein substrat, system mit mehreren dieser vorrichtungenund anwendung dieser vorrichtung, verfahren und system | |
| DE60110510D1 (de) | Vorrichtung und Verfahren zur Substratbeschichtung | |
| DE3667498D1 (de) | Verfahren zur metallbeschichtung eines organischen substrates. | |
| ATE102150T1 (de) | Verfahren zum uebertragen eines dekors von einer praegefolie auf ein ebenflaechiges substrat und vorrichtung zur durchfuehrung des verfahrens. | |
| DE60218797D1 (de) | Vorrichtung und Verfahren zum Beschichten von lichtempfindlichem Substrat | |
| DE69008359D1 (de) | Verfahren zur ablagerung von deckschichten auf anodisierbaren metallsubstraten und dadurch erhaltene produkte. |