ATE533084T1 - Stubstrat mit reflektierenden schichten geeignet zur herstellung von reflexionsmaskenrohlingen für die euv-lithographie - Google Patents
Stubstrat mit reflektierenden schichten geeignet zur herstellung von reflexionsmaskenrohlingen für die euv-lithographieInfo
- Publication number
- ATE533084T1 ATE533084T1 AT07707133T AT07707133T ATE533084T1 AT E533084 T1 ATE533084 T1 AT E533084T1 AT 07707133 T AT07707133 T AT 07707133T AT 07707133 T AT07707133 T AT 07707133T AT E533084 T1 ATE533084 T1 AT E533084T1
- Authority
- AT
- Austria
- Prior art keywords
- layer
- substrate
- reflective layer
- euv lithography
- stubstrate
- Prior art date
Links
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/40—Electrostatic discharge [ESD] related features, e.g. antistatic coatings or a conductive metal layer around the periphery of the mask substrate
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/60—Substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
- H10P76/405—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their composition, e.g. multilayer masks
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K2201/00—Arrangements for handling radiation or particles
- G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
- G21K2201/067—Construction details
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31616—Next to polyester [e.g., alkyd]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/330,205 US7678511B2 (en) | 2006-01-12 | 2006-01-12 | Reflective-type mask blank for EUV lithography |
| PCT/JP2007/050845 WO2007081059A2 (en) | 2006-01-12 | 2007-01-12 | Reflective-type mask blank for euv lithography |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE533084T1 true ATE533084T1 (de) | 2011-11-15 |
Family
ID=37891724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT07707133T ATE533084T1 (de) | 2006-01-12 | 2007-01-12 | Stubstrat mit reflektierenden schichten geeignet zur herstellung von reflexionsmaskenrohlingen für die euv-lithographie |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7678511B2 (de) |
| EP (3) | EP1971898B1 (de) |
| JP (2) | JP4862892B2 (de) |
| KR (1) | KR101287697B1 (de) |
| AT (1) | ATE533084T1 (de) |
| TW (1) | TWI452418B (de) |
| WO (1) | WO2007081059A2 (de) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1962326B1 (de) * | 2005-12-12 | 2012-06-06 | Asahi Glass Company, Limited | Maskenrohling des reflexionstyps für die euv-lithographie und substrat mit elektrisch leitfähigem film für den maskenrohling |
| JP4532533B2 (ja) * | 2007-09-18 | 2010-08-25 | アドバンスド・マスク・インスペクション・テクノロジー株式会社 | Euv露光用マスクブランクおよびeuv露光用マスク |
| JP4663749B2 (ja) * | 2008-03-11 | 2011-04-06 | 大日本印刷株式会社 | 反射型マスクの検査方法および製造方法 |
| JP5348127B2 (ja) * | 2008-03-18 | 2013-11-20 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランク |
| JP2010135732A (ja) * | 2008-08-01 | 2010-06-17 | Asahi Glass Co Ltd | Euvマスクブランクス用基板 |
| CN102124542B (zh) * | 2008-09-05 | 2013-04-17 | 旭硝子株式会社 | Euv光刻用反射型掩模底板及其制造方法 |
| TW201131615A (en) * | 2009-12-09 | 2011-09-16 | Asahi Glass Co Ltd | Multilayer mirror for euv lithography and process for producing same |
| KR20130007537A (ko) | 2010-03-02 | 2013-01-18 | 아사히 가라스 가부시키가이샤 | Euv 리소그래피용 반사형 마스크 블랭크 및 그 제조 방법 |
| JP5560776B2 (ja) * | 2010-03-03 | 2014-07-30 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランクスの製造方法 |
| DE102011079933A1 (de) * | 2010-08-19 | 2012-02-23 | Carl Zeiss Smt Gmbh | Optisches Element für die UV- oder EUV-Lithographie |
| KR101857844B1 (ko) | 2011-02-04 | 2018-05-14 | 아사히 가라스 가부시키가이샤 | 도전막이 형성된 기판, 다층 반사막이 형성된 기판, 및 euv 리소그래피용 반사형 마스크 블랭크 |
| KR101642617B1 (ko) * | 2011-09-28 | 2016-07-25 | 도판 인사츠 가부시키가이샤 | 반사형 노광용 마스크 블랭크 및 반사형 노광용 마스크 |
| JP5950535B2 (ja) * | 2011-10-25 | 2016-07-13 | 凸版印刷株式会社 | 反射型マスクブランクおよび反射型マスク |
| EP2581789B1 (de) * | 2011-10-14 | 2020-04-29 | Fundació Institut de Ciències Fotòniques | Optisch transparente und elektrisch leitfähige Beschichtungen und Verfahren zu ihrer Ablagerung auf einem Substrat |
| JP6157874B2 (ja) * | 2012-03-19 | 2017-07-05 | Hoya株式会社 | Euvリソグラフィー用多層反射膜付き基板及びeuvリソグラフィー用反射型マスクブランク、並びにeuvリソグラフィー用反射型マスク及び半導体装置の製造方法 |
| KR20140016662A (ko) | 2012-07-30 | 2014-02-10 | 에스케이하이닉스 주식회사 | 극자외선 리소그래피용 마스크 및 그 제조방법, 마스크 정렬도 에러 보정방법 |
| US9377679B2 (en) * | 2012-07-31 | 2016-06-28 | Hoya Corporation | Reflective mask blank and method for manufacturing same, method for manufacturing reflective mask, and method for manufacturing semiconductor device |
| WO2014050891A1 (ja) | 2012-09-28 | 2014-04-03 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランクおよびその製造方法、ならびにeuvリソグラフィ用反射型マスクおよびその製造方法 |
| KR102190850B1 (ko) * | 2012-11-08 | 2020-12-14 | 호야 가부시키가이샤 | 마스크 블랭크의 제조 방법 및 전사용 마스크의 제조 방법 |
| WO2014080840A1 (ja) * | 2012-11-20 | 2014-05-30 | Hoya株式会社 | マスクブランク、転写用マスク、マスクブランクの製造方法、転写用マスクの製造方法および半導体デバイスの製造方法 |
| US9612521B2 (en) | 2013-03-12 | 2017-04-04 | Applied Materials, Inc. | Amorphous layer extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor |
| US20140272684A1 (en) | 2013-03-12 | 2014-09-18 | Applied Materials, Inc. | Extreme ultraviolet lithography mask blank manufacturing system and method of operation therefor |
| US9417515B2 (en) | 2013-03-14 | 2016-08-16 | Applied Materials, Inc. | Ultra-smooth layer ultraviolet lithography mirrors and blanks, and manufacturing and lithography systems therefor |
| US9632411B2 (en) | 2013-03-14 | 2017-04-25 | Applied Materials, Inc. | Vapor deposition deposited photoresist, and manufacturing and lithography systems therefor |
| US9354508B2 (en) | 2013-03-12 | 2016-05-31 | Applied Materials, Inc. | Planarized extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor |
| JP6263051B2 (ja) * | 2013-03-13 | 2018-01-17 | Hoya株式会社 | ハーフトーン型位相シフトマスクブランクの製造方法 |
| DE102013107192A1 (de) * | 2013-07-08 | 2015-01-08 | Carl Zeiss Laser Optics Gmbh | Reflektives optisches Element für streifenden Einfall im EUV-Wellenlängenbereich |
| JP6303346B2 (ja) * | 2013-09-09 | 2018-04-04 | 凸版印刷株式会社 | 反射型マスクブランクおよび反射型マスク |
| KR102107799B1 (ko) * | 2013-09-27 | 2020-05-07 | 호야 가부시키가이샤 | 도전막 부착 기판, 다층 반사막 부착 기판, 반사형 마스크 블랭크 및 반사형 마스크, 그리고 반도체 장치의 제조방법 |
| JP6647198B2 (ja) * | 2013-12-22 | 2020-02-14 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | チャックアセンブリを有する極端紫外線リソグラフィーシステム及びその製造方法 |
| JP2016122751A (ja) * | 2014-12-25 | 2016-07-07 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク及び反射型マスク、並びに多層反射膜付き基板、反射型マスクブランク及び半導体装置の製造方法 |
| SG10201911400WA (en) * | 2015-06-17 | 2020-02-27 | Hoya Corp | Substrate with electrically conductive film, substrate with multilayer reflective film, reflective mask blank, reflective mask, and method of manufacturing semiconductor device |
| WO2017186486A1 (en) | 2016-04-25 | 2017-11-02 | Asml Netherlands B.V. | A membrane for euv lithography |
| US10775693B2 (en) * | 2016-12-07 | 2020-09-15 | Fundacio Institut De Ciencies Fotoniques | Transparent and electrically conductive coatings containing nitrides, borides or carbides |
| JP6904234B2 (ja) * | 2017-12-15 | 2021-07-14 | Agc株式会社 | マスクブランク用基板およびマスクブランク |
| WO2019131506A1 (ja) * | 2017-12-27 | 2019-07-04 | Hoya株式会社 | 導電膜付き基板、多層反射膜付き基板、反射型マスクブランク、反射型マスク及び半導体装置の製造方法 |
| US11448955B2 (en) * | 2018-09-27 | 2022-09-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mask for lithography process and method for manufacturing the same |
| US11119398B2 (en) * | 2018-09-28 | 2021-09-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | EUV photo masks |
| CN112997116B (zh) * | 2018-11-15 | 2025-02-21 | 科盛德光掩模株式会社 | 反射型光掩模坯以及反射型光掩模 |
| KR102798354B1 (ko) * | 2019-01-14 | 2025-04-23 | 삼성전자주식회사 | 포토 마스크, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법 |
| KR20220006543A (ko) * | 2019-05-21 | 2022-01-17 | 에이지씨 가부시키가이샤 | Euv 리소그래피용 반사형 마스크 블랭크 |
| JP7689790B2 (ja) * | 2019-09-02 | 2025-06-09 | Hoya株式会社 | 反射膜付基板、マスクブランク、反射型マスク、及び半導体デバイスの製造方法 |
| CN113253563B (zh) * | 2020-05-26 | 2024-12-27 | 台湾积体电路制造股份有限公司 | Euv光掩模及其制造方法 |
| US11506969B2 (en) | 2020-05-26 | 2022-11-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | EUV photo masks and manufacturing method thereof |
| WO2024195577A1 (ja) * | 2023-03-17 | 2024-09-26 | Agc株式会社 | Euvリソグラフィ用反射型マスクブランクおよび導電膜付き基板 |
| JP2025095450A (ja) * | 2023-12-14 | 2025-06-26 | Hoya株式会社 | 導電膜付き基板、多層反射膜付き基板、反射型マスクブランク、反射型マスク、および半導体装置の製造方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6098408A (en) * | 1998-11-11 | 2000-08-08 | Advanced Micro Devices | System for controlling reflection reticle temperature in microlithography |
| JP2000208594A (ja) | 1999-01-08 | 2000-07-28 | Nissin Electric Co Ltd | ガラス基板の吸着保持方法 |
| EP1190276A2 (de) | 1999-06-07 | 2002-03-27 | The Regents of the University of California | Beschichtungen für reflexionsmaskenträger |
| US6737201B2 (en) * | 2000-11-22 | 2004-05-18 | Hoya Corporation | Substrate with multilayer film, reflection type mask blank for exposure, reflection type mask for exposure and production method thereof as well as production method of semiconductor device |
| JP3939132B2 (ja) * | 2000-11-22 | 2007-07-04 | Hoya株式会社 | 多層膜付き基板、露光用反射型マスクブランク、露光用反射型マスクおよびその製造方法、並びに半導体の製造方法 |
| JP4390418B2 (ja) | 2001-02-14 | 2009-12-24 | Hoya株式会社 | Euv露光用反射型マスクブランクおよびeuv露光用反射型マスク並びに半導体の製造方法 |
| DE10206143B4 (de) * | 2001-02-14 | 2006-11-16 | Hoya Corp. | Reflektierender Maskenrohling und reflektierende Maske für EUV-Belichtung und Verfahren zum Herstellen der Maske |
| JP2002299228A (ja) * | 2001-04-03 | 2002-10-11 | Nikon Corp | レチクル、それを用いた露光装置及び露光方法 |
| US7226705B2 (en) * | 2001-09-28 | 2007-06-05 | Hoya Corporation | Method of manufacturing a mask blank and a mask, the mask blank and the mask, and useless film removing method and apparatus |
| US7129010B2 (en) | 2002-08-02 | 2006-10-31 | Schott Ag | Substrates for in particular microlithography |
| DE10255605B4 (de) * | 2002-11-28 | 2005-07-07 | Infineon Technologies Ag | Reflektionsmaske zur Projektion einer Struktur auf einen Halbleiterwafer sowie Verfahren zu deren Herstellung |
| US6806007B1 (en) * | 2003-05-02 | 2004-10-19 | Advanced Micro Devices, Inc. | EUV mask which facilitates electro-static chucking |
| KR20050031425A (ko) * | 2003-09-29 | 2005-04-06 | 호야 가부시키가이샤 | 마스크 블랭크 및 그 제조방법 |
| JP4525893B2 (ja) * | 2003-10-24 | 2010-08-18 | 信越化学工業株式会社 | 位相シフトマスクブランク、位相シフトマスク及びパターン転写方法 |
| US6984475B1 (en) * | 2003-11-03 | 2006-01-10 | Advanced Micro Devices, Inc. | Extreme ultraviolet (EUV) lithography masks |
| JP2005210093A (ja) | 2003-12-25 | 2005-08-04 | Hoya Corp | 多層反射膜付き基板、露光用反射型マスクブランクス及び露光用反射型マスク、並びにそれらの製造方法 |
| US20050238922A1 (en) * | 2003-12-25 | 2005-10-27 | Hoya Corporation | Substrate with a multilayer reflection film, reflection type mask blank for exposure, reflection type mask for exposure and methods of manufacturing them |
| US7230695B2 (en) * | 2004-07-08 | 2007-06-12 | Asahi Glass Company, Ltd. | Defect repair device and defect repair method |
| JP2006267595A (ja) * | 2005-03-24 | 2006-10-05 | Toshiba Corp | マスクブランクスとその製造方法及び使用方法、並びにマスクとその製造方法及び使用方法 |
-
2006
- 2006-01-12 US US11/330,205 patent/US7678511B2/en active Active
-
2007
- 2007-01-12 KR KR1020087016849A patent/KR101287697B1/ko active Active
- 2007-01-12 AT AT07707133T patent/ATE533084T1/de active
- 2007-01-12 EP EP07707133A patent/EP1971898B1/de active Active
- 2007-01-12 JP JP2008518548A patent/JP4862892B2/ja not_active Expired - Fee Related
- 2007-01-12 WO PCT/JP2007/050845 patent/WO2007081059A2/en not_active Ceased
- 2007-01-12 TW TW96101310A patent/TWI452418B/zh active
- 2007-01-12 EP EP20100014669 patent/EP2278395A1/de not_active Withdrawn
- 2007-01-12 EP EP20100014668 patent/EP2278394A1/de not_active Withdrawn
-
2010
- 2010-01-27 US US12/694,860 patent/US7960077B2/en not_active Expired - Lifetime
-
2011
- 2011-07-29 JP JP2011166856A patent/JP4862970B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007081059A2 (en) | 2007-07-19 |
| EP2278395A1 (de) | 2011-01-26 |
| US20070160916A1 (en) | 2007-07-12 |
| JP2009523311A (ja) | 2009-06-18 |
| JP4862970B2 (ja) | 2012-01-25 |
| US7960077B2 (en) | 2011-06-14 |
| WO2007081059A3 (en) | 2007-11-08 |
| EP1971898B1 (de) | 2011-11-09 |
| KR20080092363A (ko) | 2008-10-15 |
| TW200741332A (en) | 2007-11-01 |
| EP2278394A1 (de) | 2011-01-26 |
| JP2011228744A (ja) | 2011-11-10 |
| US7678511B2 (en) | 2010-03-16 |
| JP4862892B2 (ja) | 2012-01-25 |
| KR101287697B1 (ko) | 2013-07-24 |
| EP1971898A2 (de) | 2008-09-24 |
| TWI452418B (zh) | 2014-09-11 |
| US20100167187A1 (en) | 2010-07-01 |
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