ATE535010T1 - Verfahren zur herstllung selbstausgerichteten transistortopologien in siliziumkarbid durch verwendung selektiver epitaxie - Google Patents
Verfahren zur herstllung selbstausgerichteten transistortopologien in siliziumkarbid durch verwendung selektiver epitaxieInfo
- Publication number
- ATE535010T1 ATE535010T1 AT02806537T AT02806537T ATE535010T1 AT E535010 T1 ATE535010 T1 AT E535010T1 AT 02806537 T AT02806537 T AT 02806537T AT 02806537 T AT02806537 T AT 02806537T AT E535010 T1 ATE535010 T1 AT E535010T1
- Authority
- AT
- Austria
- Prior art keywords
- silicon carbide
- selective epitaxy
- producing self
- transistors
- aligned transistor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/01—Manufacture or treatment
- H10D8/051—Manufacture or treatment of Schottky diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
- H10D10/40—Vertical BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/01—Manufacture or treatment
- H10D12/031—Manufacture or treatment of IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/202—FETs having static field-induced regions, e.g. static-induction transistors [SIT] or permeable base transistors [PBT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/01—Manufacture or treatment
- H10D8/043—Manufacture or treatment of planar diodes
Landscapes
- Bipolar Transistors (AREA)
- Junction Field-Effect Transistors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US30442301P | 2001-07-12 | 2001-07-12 | |
| PCT/US2002/022281 WO2003075319A2 (en) | 2001-07-12 | 2002-07-12 | Self-aligned transistor and diode topologies |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE535010T1 true ATE535010T1 (de) | 2011-12-15 |
Family
ID=27788870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT02806537T ATE535010T1 (de) | 2001-07-12 | 2002-07-12 | Verfahren zur herstllung selbstausgerichteten transistortopologien in siliziumkarbid durch verwendung selektiver epitaxie |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6767783B2 (de) |
| EP (1) | EP1428248B1 (de) |
| JP (2) | JP4234016B2 (de) |
| AT (1) | ATE535010T1 (de) |
| AU (1) | AU2002367561A1 (de) |
| WO (1) | WO2003075319A2 (de) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6759308B2 (en) * | 2001-07-10 | 2004-07-06 | Advanced Micro Devices, Inc. | Silicon on insulator field effect transistor with heterojunction gate |
| US6955978B1 (en) * | 2001-12-20 | 2005-10-18 | Fairchild Semiconductor Corporation | Uniform contact |
| US6982440B2 (en) * | 2002-02-19 | 2006-01-03 | Powersicel, Inc. | Silicon carbide semiconductor devices with a regrown contact layer |
| US6815304B2 (en) * | 2002-02-22 | 2004-11-09 | Semisouth Laboratories, Llc | Silicon carbide bipolar junction transistor with overgrown base region |
| US6855970B2 (en) * | 2002-03-25 | 2005-02-15 | Kabushiki Kaisha Toshiba | High-breakdown-voltage semiconductor device |
| JP2004134547A (ja) * | 2002-10-10 | 2004-04-30 | Hitachi Ltd | 半導体装置 |
| US7009228B1 (en) * | 2003-03-04 | 2006-03-07 | Lovoltech, Incorporated | Guard ring structure and method for fabricating same |
| EP1723680A1 (de) * | 2004-03-11 | 2006-11-22 | Siemens Aktiengesellschaft | Pn-diode auf der basis von siliciumcarbid und verfahren zu deren herstellung |
| US7470967B2 (en) * | 2004-03-12 | 2008-12-30 | Semisouth Laboratories, Inc. | Self-aligned silicon carbide semiconductor devices and methods of making the same |
| JP4857527B2 (ja) * | 2004-05-24 | 2012-01-18 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
| EP1779435B8 (de) * | 2004-07-08 | 2012-03-07 | Ss Sc Ip, Llc | Monolithischer vertikal-sperrschichtfeldeffekttransistor und aus siliziumcarbid hergestellte schottky-barrierendiode und herstellungsverfahren dafür |
| US7820511B2 (en) | 2004-07-08 | 2010-10-26 | Semisouth Laboratories, Inc. | Normally-off integrated JFET power switches in wide bandgap semiconductors and methods of making |
| US20060211210A1 (en) * | 2004-08-27 | 2006-09-21 | Rensselaer Polytechnic Institute | Material for selective deposition and etching |
| US7098093B2 (en) * | 2004-09-13 | 2006-08-29 | Northrop Grumman Corporation | HEMT device and method of making |
| JP4430531B2 (ja) * | 2004-12-28 | 2010-03-10 | 株式会社日立製作所 | 双方向絶縁型dc−dcコンバータ |
| JP4915056B2 (ja) * | 2005-05-06 | 2012-04-11 | 住友電気工業株式会社 | 終端構造を有する半導体装置の製造方法 |
| US20060260956A1 (en) * | 2005-05-23 | 2006-11-23 | Bausch & Lomb Incorporated | Methods for preventing or reducing interaction between packaging materials and polymeric articles contained therein |
| JP4961686B2 (ja) * | 2005-06-03 | 2012-06-27 | 株式会社デンソー | 半導体装置 |
| US20070029573A1 (en) | 2005-08-08 | 2007-02-08 | Lin Cheng | Vertical-channel junction field-effect transistors having buried gates and methods of making |
| KR100638880B1 (ko) * | 2005-08-18 | 2006-10-27 | 삼성전기주식회사 | 반도체 적층 구조물과, 질화물 반도체 결정 기판 및 질화물반도체 소자의 제조 방법 |
| US7404858B2 (en) * | 2005-09-16 | 2008-07-29 | Mississippi State University | Method for epitaxial growth of silicon carbide |
| US7304334B2 (en) * | 2005-09-16 | 2007-12-04 | Cree, Inc. | Silicon carbide bipolar junction transistors having epitaxial base regions and multilayer emitters and methods of fabricating the same |
| US7314799B2 (en) * | 2005-12-05 | 2008-01-01 | Semisouth Laboratories, Inc. | Self-aligned trench field effect transistors with regrown gates and bipolar junction transistors with regrown base contact regions and methods of making |
| US7345310B2 (en) * | 2005-12-22 | 2008-03-18 | Cree, Inc. | Silicon carbide bipolar junction transistors having a silicon carbide passivation layer on the base region thereof |
| KR100660724B1 (ko) * | 2005-12-29 | 2006-12-21 | 동부일렉트로닉스 주식회사 | 대칭형 고전압 소자 및 그 제조 방법 |
| DE102006011697B4 (de) | 2006-03-14 | 2012-01-26 | Infineon Technologies Austria Ag | Integrierte Halbleiterbauelementeanordnung und Verfahren zu deren Herstellung |
| US20070228505A1 (en) * | 2006-04-04 | 2007-10-04 | Mazzola Michael S | Junction barrier schottky rectifiers having epitaxially grown p+-n junctions and methods of making |
| US7977154B2 (en) * | 2006-04-14 | 2011-07-12 | Mississippi State University | Self-aligned methods based on low-temperature selective epitaxial growth for fabricating silicon carbide devices |
| US7821015B2 (en) * | 2006-06-19 | 2010-10-26 | Semisouth Laboratories, Inc. | Silicon carbide and related wide-bandgap transistors on semi insulating epitaxy |
| US8193537B2 (en) * | 2006-06-19 | 2012-06-05 | Ss Sc Ip, Llc | Optically controlled silicon carbide and related wide-bandgap transistors and thyristors |
| CN101473442B (zh) * | 2006-06-19 | 2012-07-04 | Ssscip有限公司 | 半绝缘外延的碳化硅及相关的宽带隙晶体管 |
| JP5140998B2 (ja) * | 2006-11-18 | 2013-02-13 | 住友電気工業株式会社 | ワイドバンドギャップ半導体装置およびその製造方法 |
| US7670908B2 (en) * | 2007-01-22 | 2010-03-02 | Alpha & Omega Semiconductor, Ltd. | Configuration of high-voltage semiconductor power device to achieve three dimensional charge coupling |
| JP4412335B2 (ja) * | 2007-02-23 | 2010-02-10 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
| US8254134B2 (en) * | 2007-05-03 | 2012-08-28 | Super Talent Electronics, Inc. | Molded memory card with write protection switch assembly |
| US7560325B1 (en) * | 2008-04-14 | 2009-07-14 | Semisouth Laboratories, Inc. | Methods of making lateral junction field effect transistors using selective epitaxial growth |
| US8120072B2 (en) * | 2008-07-24 | 2012-02-21 | Micron Technology, Inc. | JFET devices with increased barrier height and methods of making same |
| US8232585B2 (en) | 2008-07-24 | 2012-07-31 | Micron Technology, Inc. | JFET devices with PIN gate stacks |
| US7800196B2 (en) * | 2008-09-30 | 2010-09-21 | Northrop Grumman Systems Corporation | Semiconductor structure with an electric field stop layer for improved edge termination capability |
| US8278691B2 (en) | 2008-12-11 | 2012-10-02 | Micron Technology, Inc. | Low power memory device with JFET device structures |
| US8481372B2 (en) | 2008-12-11 | 2013-07-09 | Micron Technology, Inc. | JFET device structures and methods for fabricating the same |
| US8106487B2 (en) | 2008-12-23 | 2012-01-31 | Pratt & Whitney Rocketdyne, Inc. | Semiconductor device having an inorganic coating layer applied over a junction termination extension |
| KR20120091368A (ko) * | 2009-12-08 | 2012-08-17 | 에스에스 에스시 아이피, 엘엘시 | 주입된 측벽들을 가지는 반도체 장치들의 제조 방법 및 그에 의해 제조된 장치들 |
| CN102544076A (zh) * | 2010-12-23 | 2012-07-04 | 中国科学院微电子研究所 | 一种双极晶体管选通的阻变存储器、阵列及其制造方法 |
| US9184305B2 (en) * | 2011-08-04 | 2015-11-10 | Avogy, Inc. | Method and system for a GAN vertical JFET utilizing a regrown gate |
| US8969912B2 (en) | 2011-08-04 | 2015-03-03 | Avogy, Inc. | Method and system for a GaN vertical JFET utilizing a regrown channel |
| US8377754B1 (en) * | 2011-10-10 | 2013-02-19 | International Business Machines Corporation | Stress enhanced junction engineering for latchup SCR |
| US8871600B2 (en) | 2011-11-11 | 2014-10-28 | International Business Machines Corporation | Schottky barrier diodes with a guard ring formed by selective epitaxy |
| JP2013201190A (ja) | 2012-03-23 | 2013-10-03 | Toshiba Corp | 接合形電界効果トランジスタ及びその製造方法 |
| US9209318B2 (en) | 2013-02-20 | 2015-12-08 | Infineon Technologies Austria Ag | Vertical JFET with body diode and device regions disposed in a single compound epitaxial layer |
| US9159799B2 (en) * | 2013-04-19 | 2015-10-13 | Avogy, Inc. | Method of fabricating a merged P-N junction and schottky diode with regrown gallium nitride layer |
| JP6319151B2 (ja) * | 2015-03-23 | 2018-05-09 | 豊田合成株式会社 | 半導体装置および半導体装置の製造方法 |
| US9871510B1 (en) | 2016-08-24 | 2018-01-16 | Power Integrations, Inc. | Clamp for a hybrid switch |
| US12206028B2 (en) | 2020-08-21 | 2025-01-21 | Monolithic Power Systems, Inc. | Single sided channel mesa power junction field effect transistor |
| US11545585B2 (en) | 2020-08-21 | 2023-01-03 | Monolithic Power Systems, Inc. | Single sided channel mesa power junction field effect transistor |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2592287B2 (ja) * | 1988-04-06 | 1997-03-19 | 富士通株式会社 | バイポーラ半導体装置の製造方法 |
| JPH03192723A (ja) * | 1989-12-21 | 1991-08-22 | Nec Corp | 半導体素子の製造方法 |
| JP3214868B2 (ja) * | 1991-07-19 | 2001-10-02 | ローム株式会社 | ヘテロ接合バイポーラトランジスタの製造方法 |
| US5342795A (en) * | 1992-04-30 | 1994-08-30 | Texas Instruments Incorporated | Method of fabricating power VFET gate-refill |
| JPH0730111A (ja) * | 1993-07-15 | 1995-01-31 | Hitachi Ltd | 絶縁ゲート形電界効果トランジスタ |
| JPH08306700A (ja) * | 1995-04-27 | 1996-11-22 | Nec Corp | 半導体装置及びその製造方法 |
| US5859447A (en) * | 1997-05-09 | 1999-01-12 | Yang; Edward S. | Heterojunction bipolar transistor having heterostructure ballasting emitter |
| US5903020A (en) * | 1997-06-18 | 1999-05-11 | Northrop Grumman Corporation | Silicon carbide static induction transistor structure |
| EP1037284A3 (de) * | 1999-03-15 | 2002-10-30 | Matsushita Electric Industrial Co., Ltd. | Heteroübergang-Bipolartransistor und Verfahren zur Herstellung |
| US6218254B1 (en) * | 1999-09-22 | 2001-04-17 | Cree Research, Inc. | Method of fabricating a self-aligned bipolar junction transistor in silicon carbide and resulting devices |
| KR100661691B1 (ko) * | 1999-12-24 | 2006-12-26 | 스미토모덴키고교가부시키가이샤 | 접합형 전계 효과 트랜지스터 및 그 제조 방법 |
-
2002
- 2002-07-12 JP JP2003573679A patent/JP4234016B2/ja not_active Expired - Fee Related
- 2002-07-12 AT AT02806537T patent/ATE535010T1/de active
- 2002-07-12 AU AU2002367561A patent/AU2002367561A1/en not_active Abandoned
- 2002-07-12 EP EP02806537A patent/EP1428248B1/de not_active Expired - Lifetime
- 2002-07-12 US US10/193,108 patent/US6767783B2/en not_active Expired - Lifetime
- 2002-07-12 WO PCT/US2002/022281 patent/WO2003075319A2/en not_active Ceased
-
2008
- 2008-10-20 JP JP2008269845A patent/JP2009049426A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| AU2002367561A8 (en) | 2003-09-16 |
| AU2002367561A1 (en) | 2003-09-16 |
| US6767783B2 (en) | 2004-07-27 |
| EP1428248B1 (de) | 2011-11-23 |
| EP1428248A4 (de) | 2007-03-28 |
| WO2003075319A3 (en) | 2004-02-12 |
| US20030034495A1 (en) | 2003-02-20 |
| EP1428248A2 (de) | 2004-06-16 |
| WO2003075319A2 (en) | 2003-09-12 |
| JP2009049426A (ja) | 2009-03-05 |
| JP2005520322A (ja) | 2005-07-07 |
| JP4234016B2 (ja) | 2009-03-04 |
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