ATE535015T1 - Substrathalter, bühnenvorrichtung und belichtungsvorrichtung - Google Patents

Substrathalter, bühnenvorrichtung und belichtungsvorrichtung

Info

Publication number
ATE535015T1
ATE535015T1 AT05774525T AT05774525T ATE535015T1 AT E535015 T1 ATE535015 T1 AT E535015T1 AT 05774525 T AT05774525 T AT 05774525T AT 05774525 T AT05774525 T AT 05774525T AT E535015 T1 ATE535015 T1 AT E535015T1
Authority
AT
Austria
Prior art keywords
substrate holder
stage
substrate
exposure
circumferential edge
Prior art date
Application number
AT05774525T
Other languages
English (en)
Inventor
Yuichi Shibazaki
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Application granted granted Critical
Publication of ATE535015T1 publication Critical patent/ATE535015T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AT05774525T 2004-09-01 2005-08-29 Substrathalter, bühnenvorrichtung und belichtungsvorrichtung ATE535015T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004253978 2004-09-01
PCT/JP2005/015687 WO2006025341A1 (ja) 2004-09-01 2005-08-29 基板ホルダ及びステージ装置並びに露光装置

Publications (1)

Publication Number Publication Date
ATE535015T1 true ATE535015T1 (de) 2011-12-15

Family

ID=35999993

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05774525T ATE535015T1 (de) 2004-09-01 2005-08-29 Substrathalter, bühnenvorrichtung und belichtungsvorrichtung

Country Status (7)

Country Link
US (2) US20070252970A1 (de)
EP (1) EP1796143B1 (de)
JP (1) JP4779973B2 (de)
KR (1) KR101187611B1 (de)
AT (1) ATE535015T1 (de)
TW (1) TWI394226B (de)
WO (1) WO2006025341A1 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170018113A (ko) 2003-04-09 2017-02-15 가부시키가이샤 니콘 노광 방법 및 장치, 그리고 디바이스 제조 방법
TW201834020A (zh) 2003-10-28 2018-09-16 日商尼康股份有限公司 照明光學裝置、曝光裝置、曝光方法以及元件製造方法
TW201809801A (zh) 2003-11-20 2018-03-16 日商尼康股份有限公司 光學照明裝置、曝光裝置、曝光方法、以及元件製造方法
TWI389174B (zh) 2004-02-06 2013-03-11 尼康股份有限公司 偏光變換元件、光學照明裝置、曝光裝置以及曝光方法
US7324185B2 (en) 2005-03-04 2008-01-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8248577B2 (en) 2005-05-03 2012-08-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2660854B1 (de) 2005-05-12 2017-06-21 Nikon Corporation Optisches Projektionssystem, Belichtungsvorrichtung und Belichtungsverfahren
US7607647B2 (en) * 2007-03-20 2009-10-27 Kla-Tencor Technologies Corporation Stabilizing a substrate using a vacuum preload air bearing chuck
US20090009733A1 (en) * 2007-07-06 2009-01-08 Canon Kabushiki Kaisha Exposure apparatus
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
JP5267029B2 (ja) 2007-10-12 2013-08-21 株式会社ニコン 照明光学装置、露光装置及びデバイスの製造方法
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US8145349B2 (en) * 2008-05-14 2012-03-27 Formfactor, Inc. Pre-aligner search
US8336188B2 (en) * 2008-07-17 2012-12-25 Formfactor, Inc. Thin wafer chuck
EP2221668B1 (de) * 2009-02-24 2021-04-14 ASML Netherlands B.V. Lithographischer Apparat und Positionierungsanordnung
WO2011065386A1 (ja) * 2009-11-25 2011-06-03 日本精工株式会社 露光ユニット及び基板の露光方法
KR101703716B1 (ko) * 2009-12-15 2017-02-08 주식회사 탑 엔지니어링 스테이지 및 이를 구비하는 디스펜서
WO2011159390A1 (en) 2010-06-07 2011-12-22 Cascade Microtech, Inc. High voltage chuck for a probe station
DE102012100825A1 (de) * 2011-12-01 2013-06-06 solar-semi GmbH Vorrichtung zum Bearbeiten eines Substrats und Verfahren hierzu
CN109254501A (zh) * 2012-02-03 2019-01-22 Asml荷兰有限公司 衬底支架、光刻装置、器件制造方法和制造衬底保持器的方法
KR20160013916A (ko) * 2013-05-23 2016-02-05 가부시키가이샤 니콘 기판 유지 방법 및 장치, 그리고 노광 방법 및 장치
KR20170137050A (ko) * 2015-04-10 2017-12-12 에베 그룹 에. 탈너 게엠베하 2개의 기판을 결합하기 위한 기판 홀더 및 방법.
US10978332B2 (en) * 2016-10-05 2021-04-13 Prilit Optronics, Inc. Vacuum suction apparatus
WO2019072504A1 (en) 2017-10-12 2019-04-18 Asml Netherlands B.V. SUBSTRATE CARRIER FOR USE IN A LITHOGRAPHIC APPARATUS
US11081383B2 (en) * 2017-11-24 2021-08-03 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate table with vacuum channels grid
KR101982833B1 (ko) * 2018-11-27 2019-05-28 주식회사 엠오티 워크테이블 처짐 보정 기능을 구비한 글래스 검사 장치
KR101983385B1 (ko) * 2018-11-27 2019-05-28 주식회사 엠오티 워크테이블의 처짐 보정 장치
CN113075865B (zh) * 2020-01-06 2022-11-08 夏泰鑫半导体(青岛)有限公司 一种用于处理半导体衬底的装置和方法
JP1700777S (ja) * 2021-03-15 2021-11-29 基板処理装置用ボート
JP7843608B2 (ja) * 2021-12-28 2026-04-10 日本特殊陶業株式会社 基板保持部材
WO2026017338A1 (en) * 2024-07-16 2026-01-22 Asml Netherlands B.V. Substrate support
US20260092873A1 (en) * 2024-09-30 2026-04-02 Onto Innovation Inc. Top plate for inspection system

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63141313A (ja) * 1986-12-03 1988-06-13 Hitachi Ltd 薄板変形装置
JPH04152512A (ja) * 1990-10-16 1992-05-26 Fujitsu Ltd ウエハチャック
JPH04280619A (ja) * 1991-03-08 1992-10-06 Canon Inc ウエハ保持方法およびその保持装置
US5528118A (en) 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
US5874820A (en) * 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
US6246204B1 (en) * 1994-06-27 2001-06-12 Nikon Corporation Electromagnetic alignment and scanning apparatus
JP3800616B2 (ja) 1994-06-27 2006-07-26 株式会社ニコン 目標物移動装置、位置決め装置及び可動ステージ装置
JP3205468B2 (ja) 1994-07-25 2001-09-04 株式会社日立製作所 ウエハチャックを備えた処理装置および露光装置
JP3487368B2 (ja) * 1994-09-30 2004-01-19 株式会社ニコン 走査型露光装置
US5623853A (en) * 1994-10-19 1997-04-29 Nikon Precision Inc. Precision motion stage with single guide beam and follower stage
US5923408A (en) * 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
JP3639686B2 (ja) * 1996-01-31 2005-04-20 キヤノン株式会社 基板の保持装置とこれを用いた露光装置、及びデバイスの製造方法
JP4029183B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 投影露光装置及び投影露光方法
JP4029182B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 露光方法
WO1998028665A1 (en) 1996-12-24 1998-07-02 Koninklijke Philips Electronics N.V. Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device
WO1999049504A1 (fr) * 1998-03-26 1999-09-30 Nikon Corporation Procede et systeme d'exposition par projection
JP3810039B2 (ja) * 1998-05-06 2006-08-16 キヤノン株式会社 ステージ装置
US6225796B1 (en) * 1999-06-23 2001-05-01 Texas Instruments Incorporated Zero temperature coefficient bandgap reference circuit and method
JP3260340B2 (ja) * 1999-08-23 2002-02-25 太平洋セメント株式会社 複合セラミックスおよびその製造方法
JP2001244177A (ja) * 2000-02-28 2001-09-07 Nikon Corp ステージ装置とホルダ、および走査型露光装置並びに露光装置
JP4700819B2 (ja) * 2000-03-10 2011-06-15 キヤノン株式会社 基板保持装置、半導体製造装置および半導体デバイス製造方法
JP2002246450A (ja) * 2001-02-20 2002-08-30 Nikon Corp 基板保持装置及び基板搬送方法
EP1274121A1 (de) * 2001-06-29 2003-01-08 Infineon Technologies SC300 GmbH & Co. KG Halbleiterwaferhalter
SG121819A1 (en) * 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
JP2006054364A (ja) 2004-08-13 2006-02-23 Nikon Corp 基板吸着装置、露光装置

Also Published As

Publication number Publication date
KR101187611B1 (ko) 2012-10-08
TWI394226B (zh) 2013-04-21
KR20070044818A (ko) 2007-04-30
TW200625504A (en) 2006-07-16
WO2006025341A1 (ja) 2006-03-09
JP4779973B2 (ja) 2011-09-28
HK1101622A1 (en) 2007-10-18
EP1796143A4 (de) 2009-06-17
US8717543B2 (en) 2014-05-06
EP1796143A1 (de) 2007-06-13
JPWO2006025341A1 (ja) 2008-05-08
US20100141924A1 (en) 2010-06-10
EP1796143B1 (de) 2011-11-23
US20070252970A1 (en) 2007-11-01

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