ATE539177T1 - Vorrichtung und verfahren zur sputterbeschichtung - Google Patents

Vorrichtung und verfahren zur sputterbeschichtung

Info

Publication number
ATE539177T1
ATE539177T1 AT05256564T AT05256564T ATE539177T1 AT E539177 T1 ATE539177 T1 AT E539177T1 AT 05256564 T AT05256564 T AT 05256564T AT 05256564 T AT05256564 T AT 05256564T AT E539177 T1 ATE539177 T1 AT E539177T1
Authority
AT
Austria
Prior art keywords
vacuum chamber
sputter coating
target assembly
plasma
vacuum
Prior art date
Application number
AT05256564T
Other languages
English (en)
Original Assignee
Plasma Quest Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plasma Quest Ltd filed Critical Plasma Quest Ltd
Application granted granted Critical
Publication of ATE539177T1 publication Critical patent/ATE539177T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/354—Introduction of auxiliary energy into the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/3211—Antennas, e.g. particular shapes of coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3447—Collimators, shutters, apertures

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Glass Compositions (AREA)
AT05256564T 2004-10-22 2005-10-22 Vorrichtung und verfahren zur sputterbeschichtung ATE539177T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0423502A GB2419894B (en) 2004-10-22 2004-10-22 Sputtering system

Publications (1)

Publication Number Publication Date
ATE539177T1 true ATE539177T1 (de) 2012-01-15

Family

ID=33485036

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05256564T ATE539177T1 (de) 2004-10-22 2005-10-22 Vorrichtung und verfahren zur sputterbeschichtung

Country Status (5)

Country Link
US (1) US7578908B2 (de)
EP (1) EP1650324B1 (de)
AT (1) ATE539177T1 (de)
ES (1) ES2380211T3 (de)
GB (1) GB2419894B (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8273222B2 (en) * 2006-05-16 2012-09-25 Southwest Research Institute Apparatus and method for RF plasma enhanced magnetron sputter deposition
US8236152B2 (en) * 2006-11-24 2012-08-07 Ascentool International Ltd. Deposition system
US20080121620A1 (en) * 2006-11-24 2008-05-29 Guo G X Processing chamber
US8277617B2 (en) * 2007-08-14 2012-10-02 Southwest Research Institute Conformal magnetron sputter deposition
US20090271196A1 (en) * 2007-10-24 2009-10-29 Red Shift Company, Llc Classifying portions of a signal representing speech
US9175383B2 (en) 2008-01-16 2015-11-03 Applied Materials, Inc. Double-coating device with one process chamber
US20090238985A1 (en) * 2008-03-24 2009-09-24 Chau Hugh D Systems and methods for deposition
GB2461094B (en) * 2008-06-20 2012-08-22 Mantis Deposition Ltd Deposition of materials
US8703001B1 (en) 2008-10-02 2014-04-22 Sarpangala Hari Harakeshava Hegde Grid assemblies for use in ion beam etching systems and methods of utilizing the grid assemblies
US20100096254A1 (en) * 2008-10-22 2010-04-22 Hari Hegde Deposition systems and methods
US8747631B2 (en) * 2010-03-15 2014-06-10 Southwest Research Institute Apparatus and method utilizing a double glow discharge plasma for sputter cleaning
KR20130012017A (ko) * 2010-03-31 2013-01-30 무스탕 배큠 시스템즈 인코포레이티드 실린더형 회전 마크네트론 스퍼터링 음극 장치 및 무선 주파수 방사를 사용하여 재료를 증착하는 방법
US20120193226A1 (en) * 2011-02-02 2012-08-02 Beers Russell A Physical vapor deposition system
US20140110255A1 (en) * 2012-10-18 2014-04-24 Primestar Solar, Inc. Cylindrical target having an inhomogeneous sputtering surface for depositing a homogeneous film
US20140110246A1 (en) * 2012-10-18 2014-04-24 Primestar Solar, Inc. Methods for depositing a homogeneous film via sputtering from an inhomogeneous target
TWI485277B (zh) * 2013-12-13 2015-05-21 Univ Minghsin Sci & Tech 多靶反應性濺鍍製程穩定控制方法
CN105088153B (zh) * 2015-08-17 2017-09-26 宁波中车时代传感技术有限公司 半导体硅锗薄膜的制备方法
WO2019244174A2 (en) * 2018-06-22 2019-12-26 Indian Institute Of Technology Bombay Method for fabricating germanium/silicon on insulator in radio frequency sputter system
CN115141037B (zh) * 2022-07-08 2023-09-26 杭州大和江东新材料科技有限公司 一种解决半导体设备用氧化铝部件颗粒脱落的制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51117933A (en) * 1975-04-10 1976-10-16 Tokuda Seisakusho Spattering apparatus
US5387247A (en) * 1983-10-25 1995-02-07 Sorin Biomedia S.P.A. Prosthetic device having a biocompatible carbon film thereon and a method of and apparatus for forming such device
US4911814A (en) * 1988-02-08 1990-03-27 Nippon Telegraph And Telephone Corporation Thin film forming apparatus and ion source utilizing sputtering with microwave plasma
DE3914476C1 (de) * 1989-05-02 1990-06-21 Forschungszentrum Juelich Gmbh, 5170 Juelich, De
US5122251A (en) * 1989-06-13 1992-06-16 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US5096562A (en) * 1989-11-08 1992-03-17 The Boc Group, Inc. Rotating cylindrical magnetron structure for large area coating
GB9010133D0 (en) 1990-05-04 1990-06-27 Owens Geraint L Carpet-cleaning machine
US5427665A (en) * 1990-07-11 1995-06-27 Leybold Aktiengesellschaft Process and apparatus for reactive coating of a substrate
JPH0565634A (ja) * 1991-09-06 1993-03-19 Rohm Co Ltd スパツタ装置
JPH06192830A (ja) * 1992-07-31 1994-07-12 Texas Instr Inc <Ti> 材料層の物理的蒸気沈着のための方法と装置
JPH08506855A (ja) * 1993-01-15 1996-07-23 ザ ビーオーシー グループ インコーポレイテッド 円筒形マグネトロンのシールド構造
SG74667A1 (en) * 1993-07-28 2000-08-22 Asahi Glass Co Ltd Method of an apparatus for sputtering
US5693376A (en) * 1995-06-23 1997-12-02 Wisconsin Alumni Research Foundation Method for plasma source ion implantation and deposition for cylindrical surfaces
GB2343992B (en) 1998-11-20 2001-06-20 Michael John Thwaites High density plasmas
US20030066486A1 (en) * 2001-08-30 2003-04-10 Applied Materials, Inc. Microwave heat shield for plasma chamber
US6743342B2 (en) * 2002-03-12 2004-06-01 Applied Materials, Inc. Sputtering target with a partially enclosed vault

Also Published As

Publication number Publication date
EP1650324B1 (de) 2011-12-28
GB0423502D0 (en) 2004-11-24
GB2419894A (en) 2006-05-10
EP1650324A3 (de) 2007-07-04
US20060090999A1 (en) 2006-05-04
US7578908B2 (en) 2009-08-25
ES2380211T3 (es) 2012-05-09
EP1650324A2 (de) 2006-04-26
GB2419894B (en) 2009-08-26

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