ATE541319T1 - Leuchtdiode und deren herstellung - Google Patents

Leuchtdiode und deren herstellung

Info

Publication number
ATE541319T1
ATE541319T1 AT04425873T AT04425873T ATE541319T1 AT E541319 T1 ATE541319 T1 AT E541319T1 AT 04425873 T AT04425873 T AT 04425873T AT 04425873 T AT04425873 T AT 04425873T AT E541319 T1 ATE541319 T1 AT E541319T1
Authority
AT
Austria
Prior art keywords
light emitting
led
emitting devices
production
encapsulation
Prior art date
Application number
AT04425873T
Other languages
English (en)
Inventor
Sabino Sinesi
Alberto Pairetti
Michele Antonipieri
Silvia Priante
Piero Perlo
Gianluca Rotaris
Original Assignee
Ct Ricerche Plast Optica S P A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ct Ricerche Plast Optica S P A filed Critical Ct Ricerche Plast Optica S P A
Application granted granted Critical
Publication of ATE541319T1 publication Critical patent/ATE541319T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
AT04425873T 2004-11-23 2004-11-23 Leuchtdiode und deren herstellung ATE541319T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04425873A EP1659641B1 (de) 2004-11-23 2004-11-23 Leuchtdiode und deren Herstellung

Publications (1)

Publication Number Publication Date
ATE541319T1 true ATE541319T1 (de) 2012-01-15

Family

ID=34932902

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04425873T ATE541319T1 (de) 2004-11-23 2004-11-23 Leuchtdiode und deren herstellung

Country Status (2)

Country Link
EP (1) EP1659641B1 (de)
AT (1) ATE541319T1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060135207A (ko) * 2005-06-24 2006-12-29 엘지.필립스 엘시디 주식회사 휘도를 개선한 발광다이오드 램프 및 이를 이용하는백라이트 어셈블리
DE102011115150A1 (de) * 2011-09-27 2013-03-28 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung mindestens eines strahlungsemittierenden und/oder -empfangenden Halbleiterbauteils und Halbleiterbauteil
CN103165765A (zh) * 2011-12-17 2013-06-19 展晶科技(深圳)有限公司 发光二极管制造方法
DE102012219461A1 (de) * 2012-10-24 2014-04-24 Osram Gmbh Träger für leuchtvorrichtung mit begrenzungsstruktur für auflagefläche
CN115662984A (zh) * 2022-10-21 2023-01-31 武汉华星光电半导体显示技术有限公司 封装发光单元、显示装置和封装发光单元的制作方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425185A (ja) * 1990-05-18 1992-01-28 Omron Corp 光半導体素子の製造方法
EP0632511A3 (de) * 1993-06-29 1996-11-27 Mitsubishi Cable Ind Ltd Lichtemittierende Diodenanordnung und Herstellungsverfahren.
JP2851589B2 (ja) * 1996-08-15 1999-01-27 日本レック株式会社 光電子部品の製造方法
US5833903A (en) * 1996-12-10 1998-11-10 Great American Gumball Corporation Injection molding encapsulation for an electronic device directly onto a substrate
US6328456B1 (en) * 2000-03-24 2001-12-11 Ledcorp Illuminating apparatus and light emitting diode
TW506236B (en) * 2000-06-09 2002-10-11 Sanyo Electric Co Method for manufacturing an illumination device
JP3614776B2 (ja) * 2000-12-19 2005-01-26 シャープ株式会社 チップ部品型ｌｅｄとその製造方法
US6674096B2 (en) * 2001-06-08 2004-01-06 Gelcore Llc Light-emitting diode (LED) package and packaging method for shaping the external light intensity distribution
US6642652B2 (en) * 2001-06-11 2003-11-04 Lumileds Lighting U.S., Llc Phosphor-converted light emitting device
JP3844196B2 (ja) * 2001-06-12 2006-11-08 シチズン電子株式会社 発光ダイオードの製造方法
US6610598B2 (en) * 2001-11-14 2003-08-26 Solidlite Corporation Surface-mounted devices of light-emitting diodes with small lens

Also Published As

Publication number Publication date
EP1659641B1 (de) 2012-01-11
EP1659641A1 (de) 2006-05-24

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