ATE543082T1 - Drucksensor mit halbleitermembran - Google Patents

Drucksensor mit halbleitermembran

Info

Publication number
ATE543082T1
ATE543082T1 AT08250641T AT08250641T ATE543082T1 AT E543082 T1 ATE543082 T1 AT E543082T1 AT 08250641 T AT08250641 T AT 08250641T AT 08250641 T AT08250641 T AT 08250641T AT E543082 T1 ATE543082 T1 AT E543082T1
Authority
AT
Austria
Prior art keywords
pressure sensor
diaphragm
pressure
aspect ratio
setting
Prior art date
Application number
AT08250641T
Other languages
English (en)
Inventor
Hirofumi Tojo
Masayuki Yoneda
Tomohisa Tokuda
Original Assignee
Yamatake Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamatake Corp filed Critical Yamatake Corp
Application granted granted Critical
Publication of ATE543082T1 publication Critical patent/ATE543082T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
    • G01L7/02—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges
    • G01L7/08—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
AT08250641T 2007-02-28 2008-02-26 Drucksensor mit halbleitermembran ATE543082T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007050844A JP4916006B2 (ja) 2007-02-28 2007-02-28 圧力センサ

Publications (1)

Publication Number Publication Date
ATE543082T1 true ATE543082T1 (de) 2012-02-15

Family

ID=39433853

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08250641T ATE543082T1 (de) 2007-02-28 2008-02-26 Drucksensor mit halbleitermembran

Country Status (6)

Country Link
US (1) US7497126B2 (de)
EP (1) EP1965186B1 (de)
JP (1) JP4916006B2 (de)
KR (1) KR100972161B1 (de)
CN (1) CN101256101B (de)
AT (1) ATE543082T1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009001892A1 (de) * 2009-03-26 2010-09-30 Endress + Hauser Gmbh + Co. Kg Drucksensor
JP5630088B2 (ja) * 2010-06-16 2014-11-26 ミツミ電機株式会社 ピエゾ抵抗式圧力センサ
IT1401474B1 (it) * 2010-07-20 2013-07-26 Eni Spa Metodo di monitoraggio e di analisi delle condizioni di una condotta
DE102010043364B4 (de) * 2010-11-04 2019-11-14 Robert Bosch Gmbh Piezoresistive Druckmessanordnung mit einer vorgegebenen Kennlinie und Verwendung einer derartigen Druckmessanordnung
JP5778619B2 (ja) * 2012-05-02 2015-09-16 セイコーインスツル株式会社 圧力センサ
TWI506278B (zh) * 2012-12-06 2015-11-01 Murata Manufacturing Co High Voltage Resistive MEMS Sensors
FI125958B (en) * 2013-05-10 2016-04-29 Murata Manufacturing Co Improved pressure sensor
KR102390874B1 (ko) 2014-10-29 2022-04-26 삼성전자주식회사 혈당 측정기 및 그에 따른 혈당 측정 방법
JP6213527B2 (ja) * 2015-06-30 2017-10-18 株式会社デンソー 圧力センサ
CN108551643B (zh) * 2018-06-15 2019-09-17 歌尔股份有限公司 扬声器振膜以及扬声器
US20250130600A1 (en) * 2023-10-20 2025-04-24 Illinois Took Works Inc. Valve assembly and system used to control flow rate of a fluid

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3772628A (en) * 1972-05-30 1973-11-13 Gen Electric Integral silicon diaphragms for low pressure measurements
JP2615887B2 (ja) * 1988-07-29 1997-06-04 株式会社デンソー 半導体圧力センサ
CN2049351U (zh) * 1989-05-30 1989-12-13 复旦大学 十字梁岛结构的硅力传感器
JP3203560B2 (ja) 1991-12-13 2001-08-27 ハネウエル・インコーポレーテッド 圧電抵抗シリコン圧力センサ設計
JPH0685287A (ja) 1992-09-03 1994-03-25 Mitsubishi Electric Corp 半導体圧力センサ及びその製造方法
US5332469A (en) * 1992-11-12 1994-07-26 Ford Motor Company Capacitive surface micromachined differential pressure sensor
US5369544A (en) * 1993-04-05 1994-11-29 Ford Motor Company Silicon-on-insulator capacitive surface micromachined absolute pressure sensor
JP3506932B2 (ja) 1998-12-09 2004-03-15 株式会社山武 半導体圧力センサ及びその製造方法
JP2000214023A (ja) 1999-01-26 2000-08-04 Matsushita Electric Works Ltd 半導体圧力センサ
JP2001099734A (ja) * 1999-09-30 2001-04-13 Hitachi Ltd 半導体容量式圧力センサ
US6417766B1 (en) * 2000-01-14 2002-07-09 Schrader-Bridgeport International, Inc. Method and apparatus for identifying remote sending units in a tire pressure monitor system of a vehicle using secondary modulation of wheel rotation
DE10014949B4 (de) * 2000-03-22 2005-02-03 Beru Ag Einrichtung an Fahrzeugen mit Rädern, die Luftreifen haben, zur Verwendung in einem Reifendrucküberwachungssystem
JP2001356061A (ja) * 2000-06-14 2001-12-26 Denso Corp 半導体圧力センサ
JP3629185B2 (ja) * 2000-06-15 2005-03-16 株式会社日立製作所 半導体センサ及びその製造方法
US6362731B1 (en) * 2000-12-06 2002-03-26 Eaton Corporation Tire pressure monitor and location identification system and method
JP2002181650A (ja) * 2000-12-18 2002-06-26 Fujikura Ltd 圧力センサ
JP2002236067A (ja) * 2001-02-07 2002-08-23 Fujikura Ltd 圧力センサおよびその製造方法
JP3895937B2 (ja) 2001-03-22 2007-03-22 株式会社山武 差圧・圧力センサ
FR2826731B1 (fr) * 2001-06-28 2005-02-25 Siemens Automotive Sa Procede de localisation de capteurs montes chacun sur une roue de vehicule.
US6788193B2 (en) * 2002-03-01 2004-09-07 Lear Corporation System and method for tire pressure monitoring providing automatic tire location recognition
JP4357324B2 (ja) * 2004-03-10 2009-11-04 アルプス電気株式会社 タイヤ空気圧モニターシステム及び該タイヤ空気圧モニタシステムに使用するタイヤ空気圧モニター用受信機
JP4175307B2 (ja) * 2004-08-25 2008-11-05 株式会社デンソー タイヤ空気圧検出装置
JP4692068B2 (ja) * 2005-05-06 2011-06-01 株式会社デンソー 車輪位置検出装置およびそれを備えたタイヤ空気圧検出装置
US7597005B2 (en) * 2005-11-10 2009-10-06 Honeywell International Inc. Pressure sensor housing and configuration
DE102006004209B3 (de) * 2006-01-30 2007-09-06 Infineon Technologies Ag Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements
WO2008057445A2 (en) * 2006-11-03 2008-05-15 Trw Automotive U.S. Llc Method and apparatus for determining tire data

Also Published As

Publication number Publication date
CN101256101B (zh) 2010-07-21
KR100972161B1 (ko) 2010-07-26
JP4916006B2 (ja) 2012-04-11
CN101256101A (zh) 2008-09-03
US20080202248A1 (en) 2008-08-28
EP1965186A3 (de) 2010-07-28
EP1965186B1 (de) 2012-01-25
US7497126B2 (en) 2009-03-03
KR20080080005A (ko) 2008-09-02
EP1965186A2 (de) 2008-09-03
JP2008215893A (ja) 2008-09-18

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