ATE54341T1 - Mikrowellenvorrichtung und verfahren zur herstellung von halbleiterteilen und halbleiterteile nach diesem verfahren. - Google Patents

Mikrowellenvorrichtung und verfahren zur herstellung von halbleiterteilen und halbleiterteile nach diesem verfahren.

Info

Publication number
ATE54341T1
ATE54341T1 AT86104253T AT86104253T ATE54341T1 AT E54341 T1 ATE54341 T1 AT E54341T1 AT 86104253 T AT86104253 T AT 86104253T AT 86104253 T AT86104253 T AT 86104253T AT E54341 T1 ATE54341 T1 AT E54341T1
Authority
AT
Austria
Prior art keywords
members
microwave energy
photoconductive
semiconductor parts
layer
Prior art date
Application number
AT86104253T
Other languages
English (en)
Inventor
Annette G Johncock
Stephen J Hudgens
Original Assignee
Energy Conversion Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Energy Conversion Devices Inc filed Critical Energy Conversion Devices Inc
Application granted granted Critical
Publication of ATE54341T1 publication Critical patent/ATE54341T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192Microwave generated discharge
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/511Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G5/00Recording-members for original recording by exposure, e.g. to light, to heat or to electrons; Manufacture thereof; Selection of materials therefor
    • G03G5/02Charge-receiving layers
    • G03G5/04Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor
    • G03G5/08Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor characterised by the photoconductive material being inorganic
    • G03G5/082Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor characterised by the photoconductive material being inorganic and not being incorporated in a bonding material, e.g. vacuum deposited
    • G03G5/08214Silicon-based
    • G03G5/08235Silicon-based comprising three or four silicon-based layers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G5/00Recording-members for original recording by exposure, e.g. to light, to heat or to electrons; Manufacture thereof; Selection of materials therefor
    • G03G5/02Charge-receiving layers
    • G03G5/04Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor
    • G03G5/08Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor characterised by the photoconductive material being inorganic
    • G03G5/082Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor characterised by the photoconductive material being inorganic and not being incorporated in a bonding material, e.g. vacuum deposited
    • G03G5/08214Silicon-based
    • G03G5/08278Depositing methods
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/10Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices being sensitive to infrared radiation, visible or ultraviolet radiation, and having no potential barriers, e.g. photoresistors
    • H10F30/15Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices being sensitive to infrared radiation, visible or ultraviolet radiation, and having no potential barriers, e.g. photoresistors comprising amorphous semiconductors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/10Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
    • H10F71/103Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material including only Group IV materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Photovoltaic Devices (AREA)
  • Light Receiving Elements (AREA)
  • Electronic Switches (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Control Of High-Frequency Heating Circuits (AREA)
  • Constitution Of High-Frequency Heating (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Conductive Materials (AREA)
  • Electrodes Of Semiconductors (AREA)
AT86104253T 1985-05-15 1986-03-27 Mikrowellenvorrichtung und verfahren zur herstellung von halbleiterteilen und halbleiterteile nach diesem verfahren. ATE54341T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/734,576 US4619729A (en) 1984-02-14 1985-05-15 Microwave method of making semiconductor members
EP86104253A EP0204907B1 (de) 1985-05-15 1986-03-27 Mikrowellenvorrichtung und Verfahren zur Herstellung von Halbleiterteilen und Halbleiterteile nach diesem Verfahren

Publications (1)

Publication Number Publication Date
ATE54341T1 true ATE54341T1 (de) 1990-07-15

Family

ID=24952243

Family Applications (1)

Application Number Title Priority Date Filing Date
AT86104253T ATE54341T1 (de) 1985-05-15 1986-03-27 Mikrowellenvorrichtung und verfahren zur herstellung von halbleiterteilen und halbleiterteile nach diesem verfahren.

Country Status (12)

Country Link
US (1) US4619729A (de)
EP (1) EP0204907B1 (de)
JP (1) JPH0693431B2 (de)
AT (1) ATE54341T1 (de)
AU (1) AU572395B2 (de)
BR (1) BR8602112A (de)
CA (1) CA1244964A (de)
DE (1) DE3672398D1 (de)
IE (1) IE57299B1 (de)
IN (1) IN166431B (de)
MX (1) MX167077B (de)
ZA (1) ZA862694B (de)

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US5129359A (en) * 1988-11-15 1992-07-14 Canon Kabushiki Kaisha Microwave plasma CVD apparatus for the formation of functional deposited film with discharge space provided with gas feed device capable of applying bias voltage between the gas feed device and substrate
US5130170A (en) * 1989-06-28 1992-07-14 Canon Kabushiki Kaisha Microwave pcvd method for continuously forming a large area functional deposited film using a curved moving substrate web with microwave energy with a directivity in one direction perpendicular to the direction of microwave propagation
US5114770A (en) * 1989-06-28 1992-05-19 Canon Kabushiki Kaisha Method for continuously forming functional deposited films with a large area by a microwave plasma cvd method
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JP2841243B2 (ja) * 1990-11-19 1998-12-24 キヤノン株式会社 マイクロ波プラズマcvd法による堆積膜形成装置
US5629054A (en) * 1990-11-20 1997-05-13 Canon Kabushiki Kaisha Method for continuously forming a functional deposit film of large area by micro-wave plasma CVD method
US5314780A (en) 1991-02-28 1994-05-24 Canon Kabushiki Kaisha Method for treating metal substrate for electro-photographic photosensitive member and method for manufacturing electrophotographic photosensitive member
US5204272A (en) * 1991-12-13 1993-04-20 United Solar Systems Corporation Semiconductor device and microwave process for its manufacture
US5256576A (en) * 1992-02-14 1993-10-26 United Solar Systems Corporation Method of making pin junction semiconductor device with RF deposited intrinsic buffer layer
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JP3102721B2 (ja) * 1993-03-23 2000-10-23 キヤノン株式会社 電子写真感光体の製造方法
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JP3630831B2 (ja) * 1995-04-03 2005-03-23 キヤノン株式会社 堆積膜の形成方法
US6096389A (en) * 1995-09-14 2000-08-01 Canon Kabushiki Kaisha Method and apparatus for forming a deposited film using a microwave CVD process
US6316111B1 (en) * 1996-03-01 2001-11-13 Cardinal Cg Company Heat-emperable coated glass article
US6231999B1 (en) * 1996-06-21 2001-05-15 Cardinal Ig Company Heat temperable transparent coated glass article
US6435130B1 (en) 1996-08-22 2002-08-20 Canon Kabushiki Kaisha Plasma CVD apparatus and plasma processing method
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US6156472A (en) * 1997-11-06 2000-12-05 Canon Kabushiki Kaisha Method of manufacturing electrophotographic photosensitive member
JP3890153B2 (ja) * 1997-12-26 2007-03-07 キヤノン株式会社 電子写真感光体の製造方法及び製造装置
US6321759B1 (en) 1997-12-26 2001-11-27 Canon Kabushiki Kaisha Method for cleaning a substrate
US6406554B1 (en) 1997-12-26 2002-06-18 Canon Kabushiki Kaisha Method and apparatus for producing electrophotographic photosensitive member
JP3658257B2 (ja) 1998-12-24 2005-06-08 キヤノン株式会社 洗浄方法及び洗浄装置及び電子写真感光体及び電子写真感光体の製造方法
EP1754691B1 (de) 1999-12-02 2009-02-11 Cardinal CG Company Gegen Anlaufen beständiges durchsichtiges Beschichtungssystem
JP3477148B2 (ja) 1999-12-02 2003-12-10 カーディナル・シージー・カンパニー 耐曇り性透明フィルム積層体
US6919133B2 (en) 2002-03-01 2005-07-19 Cardinal Cg Company Thin film coating having transparent base layer
WO2003074442A1 (en) * 2002-03-01 2003-09-12 Cardinal Cg Company Thin film coating having transparent base layer
JP5046641B2 (ja) * 2004-05-25 2012-10-10 パナソニック株式会社 電荷中和装置
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TWI552797B (zh) * 2005-06-22 2016-10-11 恩特葛瑞斯股份有限公司 整合式氣體混合用之裝置及方法
TWI476292B (zh) 2005-08-30 2015-03-11 尖端科技材料股份有限公司 利用選擇性氟化硼前驅物之硼離子植入方法,及供植入用之大群氫化硼之形成方法
US7339728B2 (en) * 2005-10-11 2008-03-04 Cardinal Cg Company Low-emissivity coatings having high visible transmission and low solar heat gain coefficient
US7342716B2 (en) 2005-10-11 2008-03-11 Cardinal Cg Company Multiple cavity low-emissivity coatings
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KR102857322B1 (ko) * 2020-03-27 2025-09-09 (주)포인트엔지니어링 양극산화막 구조체 및 이를 포함하는 프로브 헤드 및 이를 포함하는 프로브 카드
KR102896286B1 (ko) * 2020-04-24 2025-12-05 (주)포인트엔지니어링 적층형 양극산화막 구조체 및 이를 이용한 프로브 카드의 가이드 플레이트 및 이를 구비하는 프로브 카드

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Also Published As

Publication number Publication date
IN166431B (de) 1990-05-05
MX167077B (es) 1993-03-02
CA1244964A (en) 1988-11-15
ZA862694B (en) 1986-12-30
EP0204907A3 (en) 1987-08-26
JPH0693431B2 (ja) 1994-11-16
DE3672398D1 (de) 1990-08-09
EP0204907B1 (de) 1990-07-04
JPS61283116A (ja) 1986-12-13
US4619729A (en) 1986-10-28
IE860863L (en) 1986-11-15
IE57299B1 (en) 1992-07-15
AU5725786A (en) 1986-11-20
AU572395B2 (en) 1988-05-05
EP0204907A2 (de) 1986-12-17
BR8602112A (pt) 1987-01-13

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